DE3770309D1 - Leitfaehige zusammensetzungen auf kupferbasis. - Google Patents
Leitfaehige zusammensetzungen auf kupferbasis.Info
- Publication number
- DE3770309D1 DE3770309D1 DE8787100930T DE3770309T DE3770309D1 DE 3770309 D1 DE3770309 D1 DE 3770309D1 DE 8787100930 T DE8787100930 T DE 8787100930T DE 3770309 T DE3770309 T DE 3770309T DE 3770309 D1 DE3770309 D1 DE 3770309D1
- Authority
- DE
- Germany
- Prior art keywords
- conductive copper
- based compositions
- compositions
- copper
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
- H05K3/248—Finish coating of conductors by using conductive pastes, inks or powders fired compositions for inorganic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
- Powder Metallurgy (AREA)
- Glass Compositions (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/823,657 US4687597A (en) | 1986-01-29 | 1986-01-29 | Copper conductor compositions |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3770309D1 true DE3770309D1 (de) | 1991-07-04 |
Family
ID=25239342
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8787100930T Expired - Lifetime DE3770309D1 (de) | 1986-01-29 | 1987-01-23 | Leitfaehige zusammensetzungen auf kupferbasis. |
Country Status (9)
Country | Link |
---|---|
US (1) | US4687597A (de) |
EP (1) | EP0240654B1 (de) |
JP (1) | JPH0727727B2 (de) |
KR (1) | KR900006510B1 (de) |
CA (1) | CA1278912C (de) |
DE (1) | DE3770309D1 (de) |
DK (1) | DK44687A (de) |
GR (1) | GR3002071T3 (de) |
IE (1) | IE59654B1 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6167702A (ja) * | 1984-09-07 | 1986-04-07 | Mitsui Mining & Smelting Co Ltd | 導電性粉末及びこれを用いた導電性組成物 |
JPS6355807A (ja) * | 1986-08-27 | 1988-03-10 | 古河電気工業株式会社 | 導電性ペ−スト |
US4871608A (en) * | 1986-12-10 | 1989-10-03 | Ngk Spark Plug Co., Ltd. | High-density wiring multilayered substrate |
US4877555A (en) * | 1987-04-13 | 1989-10-31 | Matsushita Electric Industrial Co., Ltd. | Conductor composition and method of manufacturing a ceramic multilayer structure using the same |
JPH0753625B2 (ja) * | 1987-10-12 | 1995-06-07 | 日本特殊陶業株式会社 | セラミック用メタライズ組成物 |
JPH075410B2 (ja) * | 1987-12-24 | 1995-01-25 | 日本特殊陶業株式会社 | セラミック用メタライズ組成物 |
JPH0812801B2 (ja) * | 1988-01-11 | 1996-02-07 | 株式会社日立製作所 | ハイブリットic用基板とそれを用いたハイブリットic及びその装置 |
JPH01192781A (ja) * | 1988-01-26 | 1989-08-02 | Dai Ichi Kogyo Seiyaku Co Ltd | 銅厚膜導体組成物 |
US4814107A (en) * | 1988-02-12 | 1989-03-21 | Heraeus Incorporated Cermalloy Division | Nitrogen fireable resistor compositions |
US4859364A (en) * | 1988-05-25 | 1989-08-22 | E. I. Du Pont De Nemours And Company | Conductive paste composition |
US4937016A (en) * | 1989-02-01 | 1990-06-26 | Dai-Ichi Kogyo Seiyaku Co., Ltd. | Copper conductor composition |
US5318803A (en) * | 1990-11-13 | 1994-06-07 | International Business Machines Corporation | Conditioning of a substrate for electroless plating thereon |
JP2657008B2 (ja) * | 1991-06-26 | 1997-09-24 | 日本特殊陶業株式会社 | セラミックス用メタライズ組成物 |
US5182926A (en) * | 1991-09-16 | 1993-02-02 | Nestec S.A. | Recovery of aroma gases |
US5336444A (en) * | 1992-05-29 | 1994-08-09 | International Business Machines Corporation | Ceramic via composition, multilayer ceramic circuit containing same, and process for using same |
US6344157B1 (en) * | 1999-02-12 | 2002-02-05 | National Starch And Chemical Investment Holding Corporation | Conductive and resistive materials with electrical stability for use in electronics devices |
US6468448B1 (en) * | 1999-10-22 | 2002-10-22 | Matsushita Electric Industrial Co., Ltd. | Conductive composition, conductive adhesive, and their mounting structure |
US6663799B2 (en) * | 2000-09-28 | 2003-12-16 | Jsr Corporation | Conductive metal particles, conductive composite metal particles and applied products using the same |
US6583201B2 (en) | 2001-04-25 | 2003-06-24 | National Starch And Chemical Investment Holding Corporation | Conductive materials with electrical stability for use in electronics devices |
SG2013066683A (en) * | 2012-09-10 | 2014-04-28 | Heraeus Precious Metals North America Conshohocken Llc | Low firing temperature copper composition |
US9190188B2 (en) * | 2013-06-13 | 2015-11-17 | E I Du Pont De Nemours And Company | Photonic sintering of polymer thick film copper conductor compositions |
US10844238B2 (en) | 2016-07-28 | 2020-11-24 | National Research Council Of Canada | Copper ink and conductive solderable copper traces produced therefrom |
TW201842088A (zh) | 2017-02-08 | 2018-12-01 | 加拿大國家研究委員會 | 可印刷分子油墨 |
TW201842087A (zh) | 2017-02-08 | 2018-12-01 | 加拿大國家研究委員會 | 具改良之熱穩定性的分子油墨 |
KR102568858B1 (ko) | 2017-02-08 | 2023-08-18 | 내션얼 리서치 카운슬 오브 캐나다 | 낮은 점도 및 낮은 처리 온도를 갖는 실버 분자 잉크 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3794518A (en) * | 1972-05-01 | 1974-02-26 | Trw Inc | Electrical resistance material and method of making the same |
DE2240493C3 (de) * | 1972-08-17 | 1978-04-27 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Durchdringungsverbundmetall als Kontaktwerkstoff für Vakuumschalter und Verfahren zu seiner Herstellung |
US4323483A (en) * | 1979-11-08 | 1982-04-06 | E. I. Du Pont De Nemours And Company | Mixed oxide bonded copper conductor compositions |
GB2085339A (en) * | 1980-10-14 | 1982-04-28 | Standard Telephones Cables Ltd | Solderable paint |
US4521329A (en) * | 1983-06-20 | 1985-06-04 | E. I. Du Pont De Nemours And Company | Copper conductor compositions |
US4514321A (en) * | 1983-08-25 | 1985-04-30 | E. I. Du Pont De Nemours And Company | Thick film conductor compositions |
JPS61411A (ja) * | 1984-06-12 | 1986-01-06 | Mitsubishi Plastics Ind Ltd | 油水分離器 |
-
1986
- 1986-01-29 US US06/823,657 patent/US4687597A/en not_active Expired - Lifetime
-
1987
- 1987-01-22 CA CA000527889A patent/CA1278912C/en not_active Expired - Lifetime
- 1987-01-23 EP EP87100930A patent/EP0240654B1/de not_active Expired - Lifetime
- 1987-01-23 DE DE8787100930T patent/DE3770309D1/de not_active Expired - Lifetime
- 1987-01-28 IE IE21687A patent/IE59654B1/en not_active IP Right Cessation
- 1987-01-28 KR KR1019870000707A patent/KR900006510B1/ko not_active IP Right Cessation
- 1987-01-28 DK DK044687A patent/DK44687A/da unknown
- 1987-01-29 JP JP62017412A patent/JPH0727727B2/ja not_active Expired - Lifetime
-
1991
- 1991-06-06 GR GR91400741T patent/GR3002071T3/el unknown
Also Published As
Publication number | Publication date |
---|---|
IE59654B1 (en) | 1994-03-09 |
KR900006510B1 (ko) | 1990-09-03 |
CA1278912C (en) | 1991-01-15 |
DK44687A (da) | 1987-07-30 |
JPH0727727B2 (ja) | 1995-03-29 |
IE870216L (en) | 1987-07-29 |
KR870007533A (ko) | 1987-08-20 |
JPS62184704A (ja) | 1987-08-13 |
EP0240654A1 (de) | 1987-10-14 |
GR3002071T3 (en) | 1992-12-30 |
US4687597A (en) | 1987-08-18 |
EP0240654B1 (de) | 1991-05-29 |
DK44687D0 (da) | 1987-01-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3770309D1 (de) | Leitfaehige zusammensetzungen auf kupferbasis. | |
DE3782522D1 (de) | Leitfaehige kupferpastenzusammensetzung. | |
DE3683384D1 (de) | Dielektrische zusammensetzungen. | |
DE3776052D1 (de) | Leitende kunststoffzusammensetzungen. | |
DE3767751D1 (de) | Wickeldraht. | |
DE3777384D1 (de) | Drahtverbindung. | |
DE3767633D1 (de) | Glaszusammensetzungen. | |
DE3688098D1 (de) | Dielektrische zusammensetzungen. | |
DE3684564D1 (de) | Veterinaere zusammensetzungen. | |
FI875703A (fi) | Laekemedelplaoster-kompositioner. | |
DE68920653D1 (de) | Elektrisch leitfähige Silikonzusammensetzungen. | |
DE3873503T2 (de) | Thermisch leitfaehige keramik-polymer-zusammensetzungen. | |
DE3780718D1 (de) | Elektrisch leitende beschichtungszusammensetzung. | |
DE68922465T2 (de) | Elektrisch leitfähige Silikonzusammensetzungen. | |
DE271973T1 (de) | Kommutator. | |
DE3889177T2 (de) | Leitfähige Kunststoffzusammensetzung. | |
DE3788432T2 (de) | Glaskeramische dielektrische Zusammensetzungen. | |
DE3789165D1 (de) | Schaltanlage. | |
NO885026D0 (no) | Aluminium-motstandsdyktige ildfaste sammensetninger. | |
DE3787514T2 (de) | Kommutator. | |
DE3750678T2 (de) | Isolierung verdrängender Verbinder. | |
FI871227A (fi) | Omstaellningsanordning foer elektrisk kontakt. | |
DE69017553T2 (de) | Leitfähige Verbindungsstruktur. | |
IT8723114A0 (it) | Composizioni. | |
IT8720311A0 (it) | Conduttore elettrico. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |