DE3873503T2 - Thermisch leitfaehige keramik-polymer-zusammensetzungen. - Google Patents

Thermisch leitfaehige keramik-polymer-zusammensetzungen.

Info

Publication number
DE3873503T2
DE3873503T2 DE8888311962T DE3873503T DE3873503T2 DE 3873503 T2 DE3873503 T2 DE 3873503T2 DE 8888311962 T DE8888311962 T DE 8888311962T DE 3873503 T DE3873503 T DE 3873503T DE 3873503 T2 DE3873503 T2 DE 3873503T2
Authority
DE
Germany
Prior art keywords
thermally conductive
polymer compositions
conductive ceramic
ceramic
compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8888311962T
Other languages
English (en)
Other versions
DE3873503D1 (de
Inventor
Carol Ann Latham
Michael Francis Mcguiggan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Standard Oil Co
Original Assignee
Standard Oil Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Oil Co filed Critical Standard Oil Co
Application granted granted Critical
Publication of DE3873503D1 publication Critical patent/DE3873503D1/de
Publication of DE3873503T2 publication Critical patent/DE3873503T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Combustion & Propulsion (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Ceramic Products (AREA)
DE8888311962T 1987-12-21 1988-12-16 Thermisch leitfaehige keramik-polymer-zusammensetzungen. Expired - Fee Related DE3873503T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13578587A 1987-12-21 1987-12-21

Publications (2)

Publication Number Publication Date
DE3873503D1 DE3873503D1 (de) 1992-09-10
DE3873503T2 true DE3873503T2 (de) 1992-12-24

Family

ID=22469655

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8888311962T Expired - Fee Related DE3873503T2 (de) 1987-12-21 1988-12-16 Thermisch leitfaehige keramik-polymer-zusammensetzungen.

Country Status (6)

Country Link
EP (1) EP0322165B1 (de)
JP (1) JPH02263847A (de)
KR (1) KR970006227B1 (de)
CA (1) CA1331245C (de)
DE (1) DE3873503T2 (de)
ES (1) ES2034273T3 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19861398B4 (de) * 1997-10-03 2010-12-09 Rohm Co. Ltd., Kyoto Licht abstrahlende Halbleitervorrichtung
DE102010005020B4 (de) * 2010-01-19 2019-12-12 Continental Automotive Gmbh Verwendung eines Formkörpers aus einem wärmeleitenden Kompositmaterial zur Wärmeableitung

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0561048B1 (de) * 1992-03-16 1999-05-26 Raytheon Company Wärmetransferklebstoff
FR2694839A1 (fr) * 1992-08-14 1994-02-18 Protex Manuf Prod Chimiq Utilisation de corindon brun comme charge thermoconductrice dans des compositions polymères, en particulier des compositions d'enrobage électriquement isolantes.
US5545473A (en) * 1994-02-14 1996-08-13 W. L. Gore & Associates, Inc. Thermally conductive interface
US5591034A (en) * 1994-02-14 1997-01-07 W. L. Gore & Associates, Inc. Thermally conductive adhesive interface
US5738936A (en) * 1996-06-27 1998-04-14 W. L. Gore & Associates, Inc. Thermally conductive polytetrafluoroethylene article
JP4086946B2 (ja) * 1998-01-05 2008-05-14 日東電工株式会社 熱伝導性感圧接着シ―ト類およびこれを用いた電子部品と放熱部材との固定方法
US6713088B2 (en) 1999-08-31 2004-03-30 General Electric Company Low viscosity filler composition of boron nitride particles of spherical geometry and process
US7976941B2 (en) 1999-08-31 2011-07-12 Momentive Performance Materials Inc. Boron nitride particles of spherical geometry and process for making thereof
WO2001096458A1 (de) * 2000-06-16 2001-12-20 Siemens Aktiengesellschaft Füllstoff für wärmeleitende kunststoffe, wärmeleitender kunststoff und herstellungsverfahren dazu
WO2002013261A2 (en) * 2000-08-07 2002-02-14 Formfactor, Inc. Heat spreading die cover
US6549409B1 (en) * 2000-08-21 2003-04-15 Vlt Corporation Power converter assembly
EP1604385B1 (de) * 2003-03-10 2019-12-11 OSRAM Opto Semiconductors GmbH Optoelektronisches bauelement mit einem gehäusekörper aus kunststoffmaterial
US6776226B1 (en) * 2003-03-12 2004-08-17 National Starch And Chemical Investment Holding Corporation Electronic device containing thermal interface material
JP5305656B2 (ja) * 2004-08-23 2013-10-02 モーメンティブ・パフォーマンス・マテリアルズ・インク 熱伝導性組成物およびその作製方法
US20080039555A1 (en) * 2006-08-10 2008-02-14 Michel Ruyters Thermally conductive material
ITRN20130032A1 (it) * 2013-08-10 2015-02-11 Rebernig Supervisioni Srl Dispositivo elettrico e/o elettronico comprendente almeno un circuito stampato.

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3972821A (en) * 1973-04-30 1976-08-03 Amchem Products, Inc. Heat transfer composition and method of making
GB1534003A (en) * 1975-04-11 1978-11-29 Sola Basic Ind Inc Electrical stress-relieving elastomeric material devices made therewith and method of making shielded electrical conductor terminations
US4210774A (en) * 1977-06-16 1980-07-01 Electric Power Research Institute, Inc. Filled polymer electrical insulator
DE3443789A1 (de) * 1983-12-02 1985-06-27 Osaka Soda Co. Ltd., Osaka Elektrische leitende klebstoffmasse

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19861398B4 (de) * 1997-10-03 2010-12-09 Rohm Co. Ltd., Kyoto Licht abstrahlende Halbleitervorrichtung
DE102010005020B4 (de) * 2010-01-19 2019-12-12 Continental Automotive Gmbh Verwendung eines Formkörpers aus einem wärmeleitenden Kompositmaterial zur Wärmeableitung

Also Published As

Publication number Publication date
EP0322165A1 (de) 1989-06-28
KR890011509A (ko) 1989-08-14
EP0322165B1 (de) 1992-08-05
ES2034273T3 (es) 1993-04-01
JPH02263847A (ja) 1990-10-26
DE3873503D1 (de) 1992-09-10
KR970006227B1 (ko) 1997-04-24
CA1331245C (en) 1994-08-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee