FR2555813B1 - Dispositif a semi-conducteurs et procede de fabrication d'un tel dispositif - Google Patents

Dispositif a semi-conducteurs et procede de fabrication d'un tel dispositif

Info

Publication number
FR2555813B1
FR2555813B1 FR8412906A FR8412906A FR2555813B1 FR 2555813 B1 FR2555813 B1 FR 2555813B1 FR 8412906 A FR8412906 A FR 8412906A FR 8412906 A FR8412906 A FR 8412906A FR 2555813 B1 FR2555813 B1 FR 2555813B1
Authority
FR
France
Prior art keywords
manufacturing
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8412906A
Other languages
English (en)
Other versions
FR2555813A1 (fr
Inventor
Susumu Okikawa
Hiroshi Mikino
Wahei Kitamura
Hiromichi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP58177944A external-priority patent/JPS6070750A/ja
Priority claimed from JP58177945A external-priority patent/JPS6070751A/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of FR2555813A1 publication Critical patent/FR2555813A1/fr
Application granted granted Critical
Publication of FR2555813B1 publication Critical patent/FR2555813B1/fr
Expired legal-status Critical Current

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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
FR8412906A 1983-09-28 1984-08-17 Dispositif a semi-conducteurs et procede de fabrication d'un tel dispositif Expired FR2555813B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP58177944A JPS6070750A (ja) 1983-09-28 1983-09-28 半導体装置
JP58177945A JPS6070751A (ja) 1983-09-28 1983-09-28 半導体装置

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Publication Number Publication Date
FR2555813A1 FR2555813A1 (fr) 1985-05-31
FR2555813B1 true FR2555813B1 (fr) 1986-06-20

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FR8412906A Expired FR2555813B1 (fr) 1983-09-28 1984-08-17 Dispositif a semi-conducteurs et procede de fabrication d'un tel dispositif

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KR (1) KR920008252B1 (fr)
DE (1) DE3435489A1 (fr)
FR (1) FR2555813B1 (fr)
GB (1) GB2146937B (fr)
HK (1) HK22389A (fr)
IT (1) IT1176815B (fr)
SG (1) SG77288G (fr)

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IT1183375B (it) * 1984-02-24 1987-10-22 Hitachi Ltd Dispositivo a semiconduttori comprendente una pallina, fili conduttori e porzioni conduttrici esterneche sono collegate alla pallina mediante tali fili conduttori
JPS60223149A (ja) * 1984-04-19 1985-11-07 Hitachi Ltd 半導体装置
US4705204A (en) * 1985-03-01 1987-11-10 Mitsubishi Denki Kabushiki Kaisha Method of ball forming for wire bonding
US4976393A (en) * 1986-12-26 1990-12-11 Hitachi, Ltd. Semiconductor device and production process thereof, as well as wire bonding device used therefor
DE69004452T2 (de) * 1989-02-13 1994-03-10 Bayer Agrochem Kk Nitroverbindungen als Insektizide.
US5437405A (en) * 1994-08-22 1995-08-01 National Semiconductor Corporation Method and apparatus for stitch bonding of wires to integrated circuit bonding pads
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IT8422846A0 (it) 1984-09-26
HK22389A (en) 1989-03-24
GB2146937B (en) 1987-04-23
GB8424394D0 (en) 1984-10-31
FR2555813A1 (fr) 1985-05-31
GB2146937A (en) 1985-05-01
KR920008252B1 (ko) 1992-09-25
KR850002668A (ko) 1985-05-15
SG77288G (en) 1989-03-23
IT1176815B (it) 1987-08-18
DE3435489A1 (de) 1985-05-02
IT8422846A1 (it) 1986-03-26

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