NL7406783A - Werkwijze voor het aanbrengen van een draad- verbinding aan een halfgeleiderinrichting. - Google Patents
Werkwijze voor het aanbrengen van een draad- verbinding aan een halfgeleiderinrichting.Info
- Publication number
- NL7406783A NL7406783A NL7406783A NL7406783A NL7406783A NL 7406783 A NL7406783 A NL 7406783A NL 7406783 A NL7406783 A NL 7406783A NL 7406783 A NL7406783 A NL 7406783A NL 7406783 A NL7406783 A NL 7406783A
- Authority
- NL
- Netherlands
- Prior art keywords
- welding
- wire
- ball
- tool
- discharge
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4846—Connecting portions with multiple bonds on the same bonding area
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78268—Discharge electrode
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- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
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- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
- H01L2224/78314—Shape
- H01L2224/78317—Shape of other portions
- H01L2224/78318—Shape of other portions inside the capillary
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01013—Aluminum [Al]
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- H01L2924/01014—Silicon [Si]
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- H01L2924/01033—Arsenic [As]
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- H01L2924/01079—Gold [Au]
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- H01L2924/01082—Lead [Pb]
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- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7406783A NL7406783A (nl) | 1974-05-21 | 1974-05-21 | Werkwijze voor het aanbrengen van een draad- verbinding aan een halfgeleiderinrichting. |
GB2084075A GB1502965A (en) | 1974-05-21 | 1975-05-16 | Provision of wire connections for semiconductor devices |
IT2343475A IT1038208B (it) | 1974-05-21 | 1975-05-16 | Metodo per applicare un filo di connessione ad un dispositivo semiconduttore |
DE2522022A DE2522022C3 (de) | 1974-05-21 | 1975-05-17 | Verfahren zum Anbringen einer Drahtverbindung zwischen einer Kontaktstelle auf einer Halbleiteranordnung und einem Zuführungsleiter |
JP5877875A JPS5118477A (en) | 1974-05-21 | 1975-05-19 | Handotaisochino waiyasetsuzokuhoho |
FR7515783A FR2272491B1 (nl) | 1974-05-21 | 1975-05-21 | |
HK1079A HK1079A (en) | 1974-05-21 | 1979-01-04 | Provision of wire connections for semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7406783A NL7406783A (nl) | 1974-05-21 | 1974-05-21 | Werkwijze voor het aanbrengen van een draad- verbinding aan een halfgeleiderinrichting. |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7406783A true NL7406783A (nl) | 1975-11-25 |
Family
ID=19821385
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7406783A NL7406783A (nl) | 1974-05-21 | 1974-05-21 | Werkwijze voor het aanbrengen van een draad- verbinding aan een halfgeleiderinrichting. |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS5118477A (nl) |
DE (1) | DE2522022C3 (nl) |
FR (1) | FR2272491B1 (nl) |
GB (1) | GB1502965A (nl) |
HK (1) | HK1079A (nl) |
IT (1) | IT1038208B (nl) |
NL (1) | NL7406783A (nl) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1600021A (en) * | 1977-07-26 | 1981-10-14 | Welding Inst | Electrical inter-connection method and apparatus |
NL8005922A (nl) * | 1980-10-29 | 1982-05-17 | Philips Nv | Werkwijze voor het vormen van een draadverbinding. |
AU569998B2 (en) * | 1981-03-27 | 1988-03-03 | Dow Chemical Company, The | Process for preparation of diene styrene alpha- methylstyrene block polymers |
FR2555813B1 (fr) * | 1983-09-28 | 1986-06-20 | Hitachi Ltd | Dispositif a semi-conducteurs et procede de fabrication d'un tel dispositif |
CH673908A5 (nl) * | 1987-05-26 | 1990-04-12 | Vyacheslav Gennadievich Sizov | |
JPH0614322U (ja) * | 1992-07-28 | 1994-02-22 | 東洋化学株式会社 | 合成樹脂製軒樋継手 |
-
1974
- 1974-05-21 NL NL7406783A patent/NL7406783A/nl not_active Application Discontinuation
-
1975
- 1975-05-16 GB GB2084075A patent/GB1502965A/en not_active Expired
- 1975-05-16 IT IT2343475A patent/IT1038208B/it active
- 1975-05-17 DE DE2522022A patent/DE2522022C3/de not_active Expired
- 1975-05-19 JP JP5877875A patent/JPS5118477A/ja active Granted
- 1975-05-21 FR FR7515783A patent/FR2272491B1/fr not_active Expired
-
1979
- 1979-01-04 HK HK1079A patent/HK1079A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
IT1038208B (it) | 1979-11-20 |
DE2522022A1 (de) | 1975-12-11 |
JPS5310427B2 (nl) | 1978-04-13 |
HK1079A (en) | 1979-01-12 |
FR2272491A1 (nl) | 1975-12-19 |
DE2522022B2 (de) | 1979-05-17 |
FR2272491B1 (nl) | 1978-10-27 |
DE2522022C3 (de) | 1980-01-10 |
GB1502965A (en) | 1978-03-08 |
JPS5118477A (en) | 1976-02-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
BC | A request for examination has been filed | ||
BV | The patent application has lapsed |