NL7406783A - PROCEDURE FOR MOUNTING A WIRE CONNECTION TO A SEMICONDUCTOR DEVICE. - Google Patents

PROCEDURE FOR MOUNTING A WIRE CONNECTION TO A SEMICONDUCTOR DEVICE.

Info

Publication number
NL7406783A
NL7406783A NL7406783A NL7406783A NL7406783A NL 7406783 A NL7406783 A NL 7406783A NL 7406783 A NL7406783 A NL 7406783A NL 7406783 A NL7406783 A NL 7406783A NL 7406783 A NL7406783 A NL 7406783A
Authority
NL
Netherlands
Prior art keywords
welding
wire
ball
tool
discharge
Prior art date
Application number
NL7406783A
Other languages
Dutch (nl)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL7406783A priority Critical patent/NL7406783A/en
Priority to IT2343475A priority patent/IT1038208B/en
Priority to GB2084075A priority patent/GB1502965A/en
Priority to DE2522022A priority patent/DE2522022C3/en
Priority to JP5877875A priority patent/JPS5118477A/en
Priority to FR7515783A priority patent/FR2272491B1/fr
Publication of NL7406783A publication Critical patent/NL7406783A/en
Priority to HK1079A priority patent/HK1079A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4846—Connecting portions with multiple bonds on the same bonding area
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
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    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
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    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
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    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
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    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
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    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

1502965 Welding by pressure; welding electrical contact PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd 16 May 1975 [21 May 1974] 20840/75 Headings B3R and B3A In a method of welding a wire 9 (e.g. gold) to a semi-conductor body 1, an electric spark discharge between an electrode 10 and the end of the wire 9 melts the wire to form a ball 11 below a recess 8 in the welding surface 6 of a welding tool 5, preferably an ultrasonic sonotrode, whereupon the tool 5 presses the ball 11 on to a contact place 2 of the semi-conductor body 1 to produce the weld. The welding tool 5 also produces a weld between the wire 9 and a supply conductor, without the formation of a ball 11 (Fig. 6, not shown). The electric spark discharge may be provided by way of a transformer fed by a discharge capacitor, the discharge time being less than 5 msec. and the energy of the discharge (hence the size of the ball) determined by the capacitor voltage. The recess 8 can either be a groove transverse to the wire 9, which is fed to the welding surface by way of a hole in a separate plate (not shown) or an aperture 7 in the welding tool, or a cone having an apex of 120 degrees. On completion of the weld to the supply conduction the tool remains in its welding position as the wire is snapped by pulling.
NL7406783A 1974-05-21 1974-05-21 PROCEDURE FOR MOUNTING A WIRE CONNECTION TO A SEMICONDUCTOR DEVICE. NL7406783A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
NL7406783A NL7406783A (en) 1974-05-21 1974-05-21 PROCEDURE FOR MOUNTING A WIRE CONNECTION TO A SEMICONDUCTOR DEVICE.
IT2343475A IT1038208B (en) 1974-05-21 1975-05-16 METHOD FOR APPLYING A CONNECTION WIRE TO A SEMICONDUCTING DEVICE
GB2084075A GB1502965A (en) 1974-05-21 1975-05-16 Provision of wire connections for semiconductor devices
DE2522022A DE2522022C3 (en) 1974-05-21 1975-05-17 Method for applying a wire connection between a contact point on a semiconductor arrangement and a feed conductor
JP5877875A JPS5118477A (en) 1974-05-21 1975-05-19 Handotaisochino waiyasetsuzokuhoho
FR7515783A FR2272491B1 (en) 1974-05-21 1975-05-21
HK1079A HK1079A (en) 1974-05-21 1979-01-04 Provision of wire connections for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7406783A NL7406783A (en) 1974-05-21 1974-05-21 PROCEDURE FOR MOUNTING A WIRE CONNECTION TO A SEMICONDUCTOR DEVICE.

Publications (1)

Publication Number Publication Date
NL7406783A true NL7406783A (en) 1975-11-25

Family

ID=19821385

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7406783A NL7406783A (en) 1974-05-21 1974-05-21 PROCEDURE FOR MOUNTING A WIRE CONNECTION TO A SEMICONDUCTOR DEVICE.

Country Status (7)

Country Link
JP (1) JPS5118477A (en)
DE (1) DE2522022C3 (en)
FR (1) FR2272491B1 (en)
GB (1) GB1502965A (en)
HK (1) HK1079A (en)
IT (1) IT1038208B (en)
NL (1) NL7406783A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1600021A (en) * 1977-07-26 1981-10-14 Welding Inst Electrical inter-connection method and apparatus
NL8005922A (en) * 1980-10-29 1982-05-17 Philips Nv METHOD FOR FORMING A WIRE JOINT
AU569998B2 (en) * 1981-03-27 1988-03-03 Dow Chemical Company, The Process for preparation of diene styrene alpha- methylstyrene block polymers
FR2555813B1 (en) * 1983-09-28 1986-06-20 Hitachi Ltd SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SUCH A DEVICE
CH673908A5 (en) * 1987-05-26 1990-04-12 Vyacheslav Gennadievich Sizov
JPH0614322U (en) * 1992-07-28 1994-02-22 東洋化学株式会社 Synthetic resin eaves joint

Also Published As

Publication number Publication date
FR2272491A1 (en) 1975-12-19
GB1502965A (en) 1978-03-08
DE2522022C3 (en) 1980-01-10
IT1038208B (en) 1979-11-20
JPS5118477A (en) 1976-02-14
DE2522022A1 (en) 1975-12-11
JPS5310427B2 (en) 1978-04-13
HK1079A (en) 1979-01-12
FR2272491B1 (en) 1978-10-27
DE2522022B2 (en) 1979-05-17

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BV The patent application has lapsed