ES2375170T3 - Composiciones de silicona para revestimiento de desmoldeo. - Google Patents
Composiciones de silicona para revestimiento de desmoldeo. Download PDFInfo
- Publication number
- ES2375170T3 ES2375170T3 ES07802479T ES07802479T ES2375170T3 ES 2375170 T3 ES2375170 T3 ES 2375170T3 ES 07802479 T ES07802479 T ES 07802479T ES 07802479 T ES07802479 T ES 07802479T ES 2375170 T3 ES2375170 T3 ES 2375170T3
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- ES
- Spain
- Prior art keywords
- polyorganosiloxane
- groups
- group
- mold release
- coating composition
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 71
- 229920001296 polysiloxane Polymers 0.000 title abstract description 33
- 238000000576 coating method Methods 0.000 title description 45
- 239000011248 coating agent Substances 0.000 title description 40
- 239000000654 additive Substances 0.000 claims abstract description 53
- 230000000996 additive effect Effects 0.000 claims abstract description 50
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 39
- 239000003054 catalyst Substances 0.000 claims abstract description 36
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910000077 silane Inorganic materials 0.000 claims abstract description 32
- 239000008199 coating composition Substances 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 229920006254 polymer film Polymers 0.000 claims abstract description 23
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 22
- 239000012530 fluid Substances 0.000 claims abstract description 19
- 238000006459 hydrosilylation reaction Methods 0.000 claims abstract description 17
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 16
- 125000005372 silanol group Chemical group 0.000 claims abstract description 12
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 11
- -1 siloxane units Chemical group 0.000 claims description 61
- 238000004873 anchoring Methods 0.000 claims description 49
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 23
- 229920001577 copolymer Polymers 0.000 claims description 16
- 239000003112 inhibitor Substances 0.000 claims description 16
- 125000000217 alkyl group Chemical group 0.000 claims description 12
- 125000004432 carbon atom Chemical group C* 0.000 claims description 11
- 125000001424 substituent group Chemical group 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
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- 229910052909 inorganic silicate Inorganic materials 0.000 claims description 4
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 3
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- 125000001183 hydrocarbyl group Chemical group 0.000 claims 2
- 230000002708 enhancing effect Effects 0.000 abstract 1
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 9
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- 238000001035 drying Methods 0.000 description 6
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 6
- 229920002554 vinyl polymer Polymers 0.000 description 6
- 125000003545 alkoxy group Chemical group 0.000 description 5
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- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
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- 239000002253 acid Substances 0.000 description 4
- ZPOLOEWJWXZUSP-WAYWQWQTSA-N bis(prop-2-enyl) (z)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C/C(=O)OCC=C ZPOLOEWJWXZUSP-WAYWQWQTSA-N 0.000 description 4
- 208000028659 discharge Diseases 0.000 description 4
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- IALUUOKJPBOFJL-UHFFFAOYSA-N potassium oxidosilane Chemical compound [K+].[SiH3][O-] IALUUOKJPBOFJL-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 4
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
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- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
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- ZLNAFSPCNATQPQ-UHFFFAOYSA-N ethenyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)C=C ZLNAFSPCNATQPQ-UHFFFAOYSA-N 0.000 description 3
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- 239000005350 fused silica glass Substances 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
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- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 3
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- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052990 silicon hydride Inorganic materials 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 3
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 2
- 102000004373 Actin-related protein 2 Human genes 0.000 description 2
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- 108090000104 Actin-related protein 3 Proteins 0.000 description 2
- 102100029631 Actin-related protein 3B Human genes 0.000 description 2
- IEPRKVQEAMIZSS-UHFFFAOYSA-N Di-Et ester-Fumaric acid Natural products CCOC(=O)C=CC(=O)OCC IEPRKVQEAMIZSS-UHFFFAOYSA-N 0.000 description 2
- 101000798882 Homo sapiens Actin-like protein 6A Proteins 0.000 description 2
- 101000693076 Homo sapiens Angiopoietin-related protein 4 Proteins 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
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- 230000008901 benefit Effects 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 2
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- ZHNXXBWJDHCHRJ-UHFFFAOYSA-N ethenyl-hydroxy-methylsilane Chemical compound C[SiH](O)C=C ZHNXXBWJDHCHRJ-UHFFFAOYSA-N 0.000 description 2
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- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
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- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
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- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
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- 238000012360 testing method Methods 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- DBUFXGVMAMMWSD-UHFFFAOYSA-N trimethoxy-[3-(7-oxabicyclo[4.1.0]heptan-4-yl)propyl]silane Chemical compound C1C(CCC[Si](OC)(OC)OC)CCC2OC21 DBUFXGVMAMMWSD-UHFFFAOYSA-N 0.000 description 1
- PQDJYEQOELDLCP-UHFFFAOYSA-N trimethylsilane Chemical compound C[SiH](C)C PQDJYEQOELDLCP-UHFFFAOYSA-N 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Paints Or Removers (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Paper (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB0616021.2A GB0616021D0 (en) | 2006-08-14 | 2006-08-14 | Silicone release coating compositions |
| GB0616021 | 2006-08-14 | ||
| PCT/EP2007/058022 WO2008019953A1 (en) | 2006-08-14 | 2007-08-02 | Silicone release coating compositions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2375170T3 true ES2375170T3 (es) | 2012-02-27 |
Family
ID=37056232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES07802479T Active ES2375170T3 (es) | 2006-08-14 | 2007-08-02 | Composiciones de silicona para revestimiento de desmoldeo. |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US9562149B2 (enExample) |
| EP (1) | EP2125957B1 (enExample) |
| JP (2) | JP5507246B2 (enExample) |
| KR (2) | KR20150007356A (enExample) |
| CN (1) | CN101517002B (enExample) |
| AT (1) | ATE528357T1 (enExample) |
| ES (1) | ES2375170T3 (enExample) |
| GB (1) | GB0616021D0 (enExample) |
| PL (1) | PL2125957T3 (enExample) |
| WO (1) | WO2008019953A1 (enExample) |
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|---|---|---|---|---|
| MX2013003600A (es) | 2010-10-05 | 2013-07-29 | Eco Friendly Solutions Llc | Revestimiento de liberacion. |
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| JP6292305B2 (ja) | 2014-06-18 | 2018-03-14 | 信越化学工業株式会社 | 基材密着性に優れるシリコーン粘着剤組成物及び粘着性物品 |
| WO2015196440A1 (en) * | 2014-06-27 | 2015-12-30 | Dow Corning (China) Holding Co., Ltd. | Silicone release coating composition and low release force emulsion silicone release coating for films and papers having cured release coating |
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| US6551676B1 (en) | 1998-09-04 | 2003-04-22 | Dow Corning Toray Silicone Company, Ltd. | Silicone-based adhesive sheet method for manufacturing same and semiconductor device |
| JP2000119627A (ja) | 1998-10-12 | 2000-04-25 | Dow Corning Toray Silicone Co Ltd | 接着性硬化シリコーンシートの保存方法 |
| US6124407A (en) * | 1998-10-28 | 2000-09-26 | Dow Corning Corporation | Silicone composition, method for the preparation thereof, and silicone elastomer |
| US6369185B1 (en) | 1999-03-31 | 2002-04-09 | Dow Corning Toray Silicone Co., Ltd. | Curable organopolysiloxane composition, cured products formed therefrom and unified articles |
| JP4408982B2 (ja) | 1999-03-31 | 2010-02-03 | 東レ・ダウコーニング株式会社 | フェノール基含有有機ケイ素化合物およびその製造方法 |
| JP3439719B2 (ja) * | 1999-03-31 | 2003-08-25 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性オルガノポリシロキサン組成物、その硬化物および基材との一体化物 |
| DE19928033A1 (de) | 1999-06-18 | 2000-12-21 | Basf Ag | Verwendung von cyclischen Enaminen als Lichtschutzmittel |
| GB9917372D0 (en) * | 1999-07-23 | 1999-09-22 | Dow Corning | Silicone release coating compositions |
| DE60119416T2 (de) * | 2000-03-23 | 2007-05-03 | Shin-Etsu Chemical Co., Ltd. | Grundierungszusammensetzung für druckempfindliche Klebstoffe auf Basis von Silikonen |
| US6716533B2 (en) | 2001-08-27 | 2004-04-06 | General Electric Company | Paper release compositions having improved adhesion to paper and polymeric films |
| FR2831547B1 (fr) | 2001-10-26 | 2005-08-19 | Rhodia Chimie Sa | Formulation silicone liquide pour la realisation de revetements elastomeres reticules anti-adherents et hydrofuges sur support solide, par exemple en papier |
| JP3803058B2 (ja) * | 2001-12-11 | 2006-08-02 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物、その硬化物及び敷設方法並びにそれを用いた半導体装置の放熱構造体 |
| GB0227066D0 (en) | 2002-11-20 | 2002-12-24 | Dow Corning | Silicone release coatings |
| US7090923B2 (en) | 2003-02-12 | 2006-08-15 | General Electric Corporation | Paper release compositions having improved adhesion to paper and polymeric films |
| JP4646496B2 (ja) * | 2003-02-13 | 2011-03-09 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーン組成物 |
| US7005475B2 (en) | 2003-06-10 | 2006-02-28 | General Electric Company | Curable silicone compositions having improved adhesion to polymeric films |
| US7045586B2 (en) | 2003-08-14 | 2006-05-16 | Dow Corning Corporation | Adhesives having improved chemical resistance and curable silicone compositions for preparing the adhesives |
| US20050038188A1 (en) | 2003-08-14 | 2005-02-17 | Dongchan Ahn | Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance |
| ATE316545T1 (de) * | 2003-10-04 | 2006-02-15 | Goldschmidt Gmbh | Verfahren zur herstellung von organischen siliciumverbindungen |
| JP4733933B2 (ja) | 2004-06-18 | 2011-07-27 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物 |
| KR101279938B1 (ko) * | 2005-02-01 | 2013-07-05 | 다우 코닝 도레이 캄파니 리미티드 | 경화성 피복 조성물 |
-
2006
- 2006-08-14 GB GBGB0616021.2A patent/GB0616021D0/en not_active Ceased
-
2007
- 2007-08-02 ES ES07802479T patent/ES2375170T3/es active Active
- 2007-08-02 AT AT07802479T patent/ATE528357T1/de not_active IP Right Cessation
- 2007-08-02 PL PL07802479T patent/PL2125957T3/pl unknown
- 2007-08-02 EP EP07802479A patent/EP2125957B1/en active Active
- 2007-08-02 JP JP2009524163A patent/JP5507246B2/ja active Active
- 2007-08-02 KR KR1020147036415A patent/KR20150007356A/ko not_active Abandoned
- 2007-08-02 CN CN2007800345058A patent/CN101517002B/zh active Active
- 2007-08-02 WO PCT/EP2007/058022 patent/WO2008019953A1/en not_active Ceased
- 2007-08-02 KR KR1020097005340A patent/KR101522588B1/ko active Active
- 2007-08-02 US US12/377,508 patent/US9562149B2/en active Active
-
2013
- 2013-07-19 JP JP2013150613A patent/JP2014028954A/ja not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| US20100255205A1 (en) | 2010-10-07 |
| EP2125957B1 (en) | 2011-10-12 |
| JP5507246B2 (ja) | 2014-05-28 |
| PL2125957T3 (pl) | 2012-03-30 |
| GB0616021D0 (en) | 2006-09-20 |
| CN101517002A (zh) | 2009-08-26 |
| KR20150007356A (ko) | 2015-01-20 |
| JP2010500462A (ja) | 2010-01-07 |
| WO2008019953A1 (en) | 2008-02-21 |
| KR101522588B1 (ko) | 2015-05-27 |
| ATE528357T1 (de) | 2011-10-15 |
| US9562149B2 (en) | 2017-02-07 |
| JP2014028954A (ja) | 2014-02-13 |
| CN101517002B (zh) | 2011-10-19 |
| EP2125957A1 (en) | 2009-12-02 |
| KR20090040474A (ko) | 2009-04-24 |
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