ES2118549T3 - Procedimiento y dispositivo para la deposicion por electrolisis de las capas metalicas. - Google Patents

Procedimiento y dispositivo para la deposicion por electrolisis de las capas metalicas.

Info

Publication number
ES2118549T3
ES2118549T3 ES95904386T ES95904386T ES2118549T3 ES 2118549 T3 ES2118549 T3 ES 2118549T3 ES 95904386 T ES95904386 T ES 95904386T ES 95904386 T ES95904386 T ES 95904386T ES 2118549 T3 ES2118549 T3 ES 2118549T3
Authority
ES
Spain
Prior art keywords
metal
workpiece
pct
plating solution
anode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95904386T
Other languages
English (en)
Inventor
Walter Di Meyer
Rolf Schumacher
Wolfgang Dahms
Reinhard Schneider
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Application granted granted Critical
Publication of ES2118549T3 publication Critical patent/ES2118549T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/92—Electrolytic coating of circuit board or printed circuit, other than selected area coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

PARA LA SEPARACION ELECTROLITICA DE CAPAS METALICAS REGULARES CON PROPIEDADES FISICOMECANICAS DETERMINADAS, EN PARTICULAR A BASE DE COBRE, NO SE UTILIZA NINGUN ANODO SOLUBLE, QUE MODIFIQUE SU FORMA GEOMETRICA DURANTE LA SEPARACION Y CON ELLO MODIFIQUE LA DISTRIBUCION DE LINEAS DE CAMPO EN LAS CELDAS ELECTROLITICAS. PARA RESOLVER EL PROBLEMA EXISTENTE, SE DESCRIBE UN PROCESO DE ACUERDO CON EL CUAL LOS COMPUESTOS DE UN SISTEMA REDOX SE AÑADEN A UNA SOLUCION DE PRECIPITACION, SIENDO DETECTADOS DURANTE LA PRECIPITACION EN LOS ANODOS INSOLUBLES. LOS COMPUESTOS RESULTANTE ARROJAN LOS NUEVOS IONES METALICOS DE LA PARTE DEL RECIPIENTE QUE CONTIENE EL METAL A SER PRECIPITADO PARA REEMPLAZAR LOS IONES METALICOS PRECIPITADOS A PARTIR DE LA SOLUCION. SE DESCRIBE UN PROCESO EN DONDE LOS COMPUESTOS DE ADICION NO SON DESTRUIDOS, DE FORMA CONTRARIA A LOS PROCEDIMIENTOS CONOCIDOS.
ES95904386T 1993-12-24 1994-12-23 Procedimiento y dispositivo para la deposicion por electrolisis de las capas metalicas. Expired - Lifetime ES2118549T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4344387A DE4344387C2 (de) 1993-12-24 1993-12-24 Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens

Publications (1)

Publication Number Publication Date
ES2118549T3 true ES2118549T3 (es) 1998-09-16

Family

ID=6506149

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95904386T Expired - Lifetime ES2118549T3 (es) 1993-12-24 1994-12-23 Procedimiento y dispositivo para la deposicion por electrolisis de las capas metalicas.

Country Status (10)

Country Link
US (1) US5976341A (es)
EP (1) EP0690934B1 (es)
JP (1) JP3436936B2 (es)
AT (1) ATE167532T1 (es)
CA (1) CA2156407C (es)
DE (2) DE4344387C2 (es)
ES (1) ES2118549T3 (es)
SG (1) SG52609A1 (es)
TW (1) TW418263B (es)
WO (1) WO1995018251A1 (es)

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DE19708208C2 (de) * 1997-02-28 1999-11-25 Hans Juergen Pauling Verfahren und Vorrichtung zum Herstellen einer Elektrodenschicht
DE19717512C3 (de) * 1997-04-25 2003-06-18 Atotech Deutschland Gmbh Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen
DE19736350C1 (de) * 1997-08-21 1999-08-05 Atotech Deutschland Gmbh Verfahren zur Konzentrationsregulierung von Stoffen in Elektrolyten und Vorrichtung zur Durchführung des Verfahrens
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DE10013339C1 (de) * 2000-03-17 2001-06-13 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum Regulieren der Konzentration von Metallionen in einer Elektrolytflüssigkeit sowie Anwendung des Verfahrens und Verwendung der Vorrichtung
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CN101416569B (zh) * 2006-03-30 2011-04-06 埃托特克德国有限公司 用金属填充孔和凹处的电解方法
EP1961842A1 (en) * 2007-02-22 2008-08-27 Atotech Deutschland Gmbh Device and method for the electrolytic plating of a metal
JP5293276B2 (ja) * 2008-03-11 2013-09-18 上村工業株式会社 連続電気銅めっき方法
DE102008031003B4 (de) 2008-06-30 2010-04-15 Siemens Aktiengesellschaft Verfahren zum Erzeugen einer CNT enthaltenen Schicht aus einer ionischen Flüssigkeit
US20100206737A1 (en) * 2009-02-17 2010-08-19 Preisser Robert F Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv)
DE102009043594B4 (de) 2009-09-25 2013-05-16 Siemens Aktiengesellschaft Verfahren zum elektrochemischen Beschichten und Einbau von Partikeln in die Schicht
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US20120024713A1 (en) * 2010-07-29 2012-02-02 Preisser Robert F Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv) with heated substrate and cooled electrolyte
US9017528B2 (en) 2011-04-14 2015-04-28 Tel Nexx, Inc. Electro chemical deposition and replenishment apparatus
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DE102012206800B3 (de) * 2012-04-25 2013-09-05 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrolytischen Abscheiden eines Abscheidemetalls auf einem Werkstück
JP5876767B2 (ja) * 2012-05-15 2016-03-02 株式会社荏原製作所 めっき装置及びめっき液管理方法
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MY186922A (en) 2015-04-20 2021-08-26 Atotech Deutschland Gmbh Electrolytic copper plating bath compositions and a method for their use
EP3135709B1 (en) 2015-08-31 2018-01-10 ATOTECH Deutschland GmbH Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions
EP3344800B1 (en) 2015-08-31 2019-03-13 ATOTECH Deutschland GmbH Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate
ES2681836T3 (es) 2015-09-10 2018-09-17 Atotech Deutschland Gmbh Composición de baño para chapado de cobre
CN109790638B (zh) 2016-08-15 2021-06-18 德国艾托特克公司 用于电解镀铜的酸性水性组合物
CN106591932B (zh) * 2016-12-30 2023-09-29 宁波工程学院 用于深孔电镀的电镀制具及电镀方法
EP3360988B1 (en) 2017-02-09 2019-06-26 ATOTECH Deutschland GmbH Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths
EP3470552B1 (en) 2017-10-13 2020-12-30 ATOTECH Deutschland GmbH An acidic aqueous composition for electrolytically depositing a copper deposit
EP3483307B1 (en) 2017-11-09 2020-04-01 ATOTECH Deutschland GmbH Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate
EP3508620B1 (en) 2018-01-09 2021-05-19 ATOTECH Deutschland GmbH Ureylene additive, its use and a preparation method therefor
EP3511444B1 (en) 2018-01-16 2020-07-22 ATOTECH Deutschland GmbH Metal or metal alloy deposition composition and plating compound
EP4018790A1 (en) 2019-08-19 2022-06-29 Atotech Deutschland GmbH & Co. KG Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board
KR20220047360A (ko) 2019-08-19 2022-04-15 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 구리로 충전된 마이크로비아들을 포함하는 고밀도 상호연결 인쇄 회로 기판을 제조하는 방법
EP3901331A1 (en) 2020-04-23 2021-10-27 ATOTECH Deutschland GmbH Acidic aqueous composition for electrolytically depositing a copper deposit
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CN112888169B (zh) * 2020-12-30 2022-11-08 深圳市迅捷兴科技股份有限公司 图形电镀电流分流方法
EP4032930B1 (en) 2021-01-22 2023-08-30 Atotech Deutschland GmbH & Co. KG Biuret-based quaternized polymers and their use in metal or metal alloy plating baths
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Also Published As

Publication number Publication date
DE4344387C2 (de) 1996-09-05
WO1995018251A1 (de) 1995-07-06
TW418263B (en) 2001-01-11
JPH08507106A (ja) 1996-07-30
EP0690934A1 (de) 1996-01-10
SG52609A1 (en) 1998-09-28
JP3436936B2 (ja) 2003-08-18
DE4344387A1 (de) 1995-06-29
EP0690934B1 (de) 1998-06-17
US5976341A (en) 1999-11-02
CA2156407A1 (en) 1995-07-06
CA2156407C (en) 2003-09-02
DE59406281D1 (de) 1998-07-23
ATE167532T1 (de) 1998-07-15

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