ES2118549T3 - Procedimiento y dispositivo para la deposicion por electrolisis de las capas metalicas. - Google Patents

Procedimiento y dispositivo para la deposicion por electrolisis de las capas metalicas.

Info

Publication number
ES2118549T3
ES2118549T3 ES95904386T ES95904386T ES2118549T3 ES 2118549 T3 ES2118549 T3 ES 2118549T3 ES 95904386 T ES95904386 T ES 95904386T ES 95904386 T ES95904386 T ES 95904386T ES 2118549 T3 ES2118549 T3 ES 2118549T3
Authority
ES
Spain
Prior art keywords
metal
workpiece
pct
plating solution
anode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95904386T
Other languages
English (en)
Inventor
Walter Di Meyer
Rolf Schumacher
Wolfgang Dahms
Reinhard Schneider
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Application granted granted Critical
Publication of ES2118549T3 publication Critical patent/ES2118549T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/92—Electrolytic coating of circuit board or printed circuit, other than selected area coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PARA LA SEPARACION ELECTROLITICA DE CAPAS METALICAS REGULARES CON PROPIEDADES FISICOMECANICAS DETERMINADAS, EN PARTICULAR A BASE DE COBRE, NO SE UTILIZA NINGUN ANODO SOLUBLE, QUE MODIFIQUE SU FORMA GEOMETRICA DURANTE LA SEPARACION Y CON ELLO MODIFIQUE LA DISTRIBUCION DE LINEAS DE CAMPO EN LAS CELDAS ELECTROLITICAS. PARA RESOLVER EL PROBLEMA EXISTENTE, SE DESCRIBE UN PROCESO DE ACUERDO CON EL CUAL LOS COMPUESTOS DE UN SISTEMA REDOX SE AÑADEN A UNA SOLUCION DE PRECIPITACION, SIENDO DETECTADOS DURANTE LA PRECIPITACION EN LOS ANODOS INSOLUBLES. LOS COMPUESTOS RESULTANTE ARROJAN LOS NUEVOS IONES METALICOS DE LA PARTE DEL RECIPIENTE QUE CONTIENE EL METAL A SER PRECIPITADO PARA REEMPLAZAR LOS IONES METALICOS PRECIPITADOS A PARTIR DE LA SOLUCION. SE DESCRIBE UN PROCESO EN DONDE LOS COMPUESTOS DE ADICION NO SON DESTRUIDOS, DE FORMA CONTRARIA A LOS PROCEDIMIENTOS CONOCIDOS.
ES95904386T 1993-12-24 1994-12-23 Procedimiento y dispositivo para la deposicion por electrolisis de las capas metalicas. Expired - Lifetime ES2118549T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4344387A DE4344387C2 (de) 1993-12-24 1993-12-24 Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens

Publications (1)

Publication Number Publication Date
ES2118549T3 true ES2118549T3 (es) 1998-09-16

Family

ID=6506149

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95904386T Expired - Lifetime ES2118549T3 (es) 1993-12-24 1994-12-23 Procedimiento y dispositivo para la deposicion por electrolisis de las capas metalicas.

Country Status (10)

Country Link
US (1) US5976341A (es)
EP (1) EP0690934B1 (es)
JP (1) JP3436936B2 (es)
AT (1) ATE167532T1 (es)
CA (1) CA2156407C (es)
DE (2) DE4344387C2 (es)
ES (1) ES2118549T3 (es)
SG (1) SG52609A1 (es)
TW (1) TW418263B (es)
WO (1) WO1995018251A1 (es)

Families Citing this family (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19545231A1 (de) * 1995-11-21 1997-05-22 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Metallschichten
EP0848012A1 (de) 1996-12-13 1998-06-17 Roche Diagnostics GmbH Verwendung von Polypeptiden zur Behandlung von Thrombozytopenien
DE19653681C2 (de) * 1996-12-13 2000-04-06 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupferschichten mit gleichmäßiger Schichtdicke und guten optischen und metallphysikalischen Eigenschaften und Anwendung des Verfahrens
DE19708208C2 (de) * 1997-02-28 1999-11-25 Hans Juergen Pauling Verfahren und Vorrichtung zum Herstellen einer Elektrodenschicht
DE19717512C3 (de) 1997-04-25 2003-06-18 Atotech Deutschland Gmbh Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen
DE19736350C1 (de) 1997-08-21 1999-08-05 Atotech Deutschland Gmbh Verfahren zur Konzentrationsregulierung von Stoffen in Elektrolyten und Vorrichtung zur Durchführung des Verfahrens
US7147827B1 (en) * 1998-05-01 2006-12-12 Applied Materials, Inc. Chemical mixing, replenishment, and waste management system
KR100683268B1 (ko) * 1998-09-08 2007-02-15 가부시키가이샤 에바라 세이사꾸쇼 기판도금장치
JP3374130B2 (ja) * 1999-01-21 2003-02-04 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング 集積回路製造に際し高純度銅から成る導体構造を電解形成するための方法
JP2000256898A (ja) * 1999-03-03 2000-09-19 Permelec Electrode Ltd ウェーハの銅めっき方法
JP2001053188A (ja) * 1999-08-12 2001-02-23 Shinko Electric Ind Co Ltd 多層配線基板の製造方法
US6503375B1 (en) * 2000-02-11 2003-01-07 Applied Materials, Inc Electroplating apparatus using a perforated phosphorus doped consumable anode
DE10013339C1 (de) 2000-03-17 2001-06-13 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum Regulieren der Konzentration von Metallionen in einer Elektrolytflüssigkeit sowie Anwendung des Verfahrens und Verwendung der Vorrichtung
JP2001267726A (ja) * 2000-03-22 2001-09-28 Toyota Autom Loom Works Ltd 配線基板の電解メッキ方法及び配線基板の電解メッキ装置
US6348142B1 (en) * 2000-08-07 2002-02-19 Advanced Micro Devices, Inc. Electroplating multi-trace circuit board substrates using single tie bar
US6432291B1 (en) * 2000-08-18 2002-08-13 Advanced Micro Devices, Inc. Simultaneous electroplating of both sides of a dual-sided substrate
WO2002048430A2 (en) * 2000-09-27 2002-06-20 Innovative Technology Licensing, Llc. Oxide-reducing agent composition, system and process
US6527934B1 (en) * 2000-10-31 2003-03-04 Galvan Industries, Inc. Method for electrolytic deposition of copper
WO2002086196A1 (en) * 2001-04-19 2002-10-31 Rd Chemical Company Copper acid baths, system and method for electroplating high aspect ratio substrates
SE523309E (sv) * 2001-06-15 2010-03-02 Replisaurus Technologies Ab Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt
WO2003038158A2 (de) * 2001-10-25 2003-05-08 Infineon Technologies Ag Galvanisiereinrichtung und galvanisiersystem zum beschichten von bereits leitfähig ausgebildeten strukturen
JP3725083B2 (ja) 2002-02-21 2005-12-07 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング メッキ設備における金属イオン供給源の有効保存を可能とする方法
US6676823B1 (en) 2002-03-18 2004-01-13 Taskem, Inc. High speed acid copper plating
JP3819840B2 (ja) * 2002-07-17 2006-09-13 大日本スクリーン製造株式会社 メッキ装置およびメッキ方法
US20040159551A1 (en) * 2003-02-14 2004-08-19 Robert Barcell Plating using an insoluble anode and separately supplied plating material
DE10311575B4 (de) * 2003-03-10 2007-03-22 Atotech Deutschland Gmbh Verfahren zum elektrolytischen Metallisieren von Werkstücken mit Bohrungen mit einem hohen Aspektverhältnis
DE10325101A1 (de) * 2003-06-03 2004-12-30 Atotech Deutschland Gmbh Verfahren zum Auffüllen von µ-Blind-Vias (µ-BVs)
US20050016857A1 (en) * 2003-07-24 2005-01-27 Applied Materials, Inc. Stabilization of additives concentration in electroplating baths for interconnect formation
US7181837B2 (en) * 2004-06-04 2007-02-27 Micron Technology, Inc. Plating buss and a method of use thereof
EP1769452A4 (en) 2004-06-29 2008-07-02 Textura Corp CONSTRUCTION PAYMENT MANAGEMENT SYSTEM AND METHOD
JP2006283072A (ja) * 2005-03-31 2006-10-19 Atotech Deutsche Gmbh マイクロビアやスルーホールをめっきする方法
US7851222B2 (en) 2005-07-26 2010-12-14 Applied Materials, Inc. System and methods for measuring chemical concentrations of a plating solution
DE502007005345D1 (de) * 2006-03-30 2010-11-25 Atotech Deutschland Gmbh Elektrolytisches verfahren zum füllen von löchern und vertiefungen mit metallen
EP1961842A1 (en) * 2007-02-22 2008-08-27 Atotech Deutschland Gmbh Device and method for the electrolytic plating of a metal
JP5293276B2 (ja) 2008-03-11 2013-09-18 上村工業株式会社 連続電気銅めっき方法
DE102008031003B4 (de) 2008-06-30 2010-04-15 Siemens Aktiengesellschaft Verfahren zum Erzeugen einer CNT enthaltenen Schicht aus einer ionischen Flüssigkeit
US20100206737A1 (en) * 2009-02-17 2010-08-19 Preisser Robert F Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv)
DE102009043594B4 (de) 2009-09-25 2013-05-16 Siemens Aktiengesellschaft Verfahren zum elektrochemischen Beschichten und Einbau von Partikeln in die Schicht
DE102009060937A1 (de) 2009-12-22 2011-06-30 Siemens Aktiengesellschaft, 80333 Verfahren zum elektrochemischen Beschichten
US20120024713A1 (en) * 2010-07-29 2012-02-02 Preisser Robert F Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv) with heated substrate and cooled electrolyte
US9017528B2 (en) 2011-04-14 2015-04-28 Tel Nexx, Inc. Electro chemical deposition and replenishment apparatus
US9005409B2 (en) 2011-04-14 2015-04-14 Tel Nexx, Inc. Electro chemical deposition and replenishment apparatus
DE102012206800B3 (de) * 2012-04-25 2013-09-05 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrolytischen Abscheiden eines Abscheidemetalls auf einem Werkstück
JP5876767B2 (ja) * 2012-05-15 2016-03-02 株式会社荏原製作所 めっき装置及びめっき液管理方法
KR20140034529A (ko) * 2012-09-12 2014-03-20 삼성전기주식회사 전기 동도금 장치
EP2735627A1 (en) 2012-11-26 2014-05-28 ATOTECH Deutschland GmbH Copper plating bath composition
JP2015021154A (ja) * 2013-07-18 2015-02-02 ペルメレック電極株式会社 電解金属箔の連続製造方法及び電解金属箔連続製造装置
US9303329B2 (en) 2013-11-11 2016-04-05 Tel Nexx, Inc. Electrochemical deposition apparatus with remote catholyte fluid management
MY186922A (en) 2015-04-20 2021-08-26 Atotech Deutschland Gmbh Electrolytic copper plating bath compositions and a method for their use
EP3135709B1 (en) 2015-08-31 2018-01-10 ATOTECH Deutschland GmbH Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions
WO2017037040A1 (en) 2015-08-31 2017-03-09 Atotech Deutschland Gmbh Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate
ES2681836T3 (es) 2015-09-10 2018-09-17 Atotech Deutschland Gmbh Composición de baño para chapado de cobre
JP7064115B2 (ja) 2016-08-15 2022-05-10 アトテック ドイチュラント ゲー・エム・ベー・ハー ウント コー． カー・ゲー 電解銅めっきのための酸性水性組成物
CN106591932B (zh) * 2016-12-30 2023-09-29 宁波工程学院 用于深孔电镀的电镀制具及电镀方法
EP3360988B1 (en) 2017-02-09 2019-06-26 ATOTECH Deutschland GmbH Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths
EP3470552B1 (en) 2017-10-13 2020-12-30 ATOTECH Deutschland GmbH An acidic aqueous composition for electrolytically depositing a copper deposit
PL3483307T3 (pl) 2017-11-09 2020-11-16 Atotech Deutschland Gmbh Kompozycje powlekające do elektrolitycznego osadzania miedzi, ich zastosowanie i sposób elektrolitycznego osadzania warstwy miedzi lub stopu miedzi na co najmniej jednej powierzchni podłoża
EP3508620B1 (en) 2018-01-09 2021-05-19 ATOTECH Deutschland GmbH Ureylene additive, its use and a preparation method therefor
EP3511444B1 (en) 2018-01-16 2020-07-22 ATOTECH Deutschland GmbH Metal or metal alloy deposition composition and plating compound
US12063751B2 (en) 2019-08-19 2024-08-13 Atotech Deutschland GmbH & Co. KG Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board
WO2021032776A1 (en) 2019-08-19 2021-02-25 Atotech Deutschland Gmbh Method of preparing a high density interconnect printed circuit board including microvias filled with copper
EP3901331A1 (en) 2020-04-23 2021-10-27 ATOTECH Deutschland GmbH Acidic aqueous composition for electrolytically depositing a copper deposit
EP3933073B1 (en) 2020-06-29 2023-11-29 Atotech Deutschland GmbH & Co. KG Copper electroplating bath
CN112888169B (zh) * 2020-12-30 2022-11-08 深圳市迅捷兴科技股份有限公司 图形电镀电流分流方法
EP4032930B1 (en) 2021-01-22 2023-08-30 Atotech Deutschland GmbH & Co. KG Biuret-based quaternized polymers and their use in metal or metal alloy plating baths
CN114808057B (zh) * 2021-01-29 2024-06-21 泰科电子(上海)有限公司 电镀装置和电镀系统
EP4400634A1 (en) 2023-01-13 2024-07-17 Atotech Deutschland GmbH & Co. KG Process for producing copper foil by electrolytic deposition of copper

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE215589C (es) *
US4270984A (en) * 1978-11-29 1981-06-02 Nasa Catalyst surfaces for the chromous/chromic REDOX couple
JPS6021240B2 (ja) * 1980-01-12 1985-05-25 株式会社小糸製作所 堆積される銅をメッキ液に補給する方法及び装置
ZM2281A1 (en) * 1980-03-17 1981-12-21 Nat Res Dev Anode-assisted action reduction
JPS59170299A (ja) * 1983-03-14 1984-09-26 Nippon Steel Corp 鉄系電気めつき浴中のＦｅ↑３↑＋イオン還元方法
DD215589B5 (de) * 1983-05-11 1994-06-01 Heinz Dr Rer Nat Liebscher Verfahren zur elektrolytischen Metallabscheidung bei erzwungener Konvektion
JPS6148599A (ja) * 1984-08-13 1986-03-10 Nippon Steel Corp 鉄系又は鉄系合金電気めつきのイオン補給方法
NL8602730A (nl) * 1986-10-30 1988-05-16 Hoogovens Groep Bv Werkwijze voor het electrolytisch vertinnen van blik met behulp van een onoplosbare anode.
DD261613A1 (de) * 1987-06-05 1988-11-02 Leipzig Galvanotechnik Verfahren zur elektrolytischen kupferabscheidung aus sauren elektrolyten mit dimensionsstabiler anode
US5262020A (en) * 1991-03-13 1993-11-16 M.A. Industries, Inc. Hydrometallurgical method of producing metallic lead from materials containing oxides, particularly from the active material of accumulators
US5304297A (en) * 1993-02-26 1994-04-19 Rockwell International Corporation Reducing agent regeneration system
US5312539A (en) * 1993-06-15 1994-05-17 Learonal Inc. Electrolytic tin plating method

Also Published As

Publication number Publication date
DE59406281D1 (de) 1998-07-23
DE4344387C2 (de) 1996-09-05
EP0690934B1 (de) 1998-06-17
EP0690934A1 (de) 1996-01-10
US5976341A (en) 1999-11-02
DE4344387A1 (de) 1995-06-29
JPH08507106A (ja) 1996-07-30
SG52609A1 (en) 1998-09-28
WO1995018251A1 (de) 1995-07-06
JP3436936B2 (ja) 2003-08-18
TW418263B (en) 2001-01-11
ATE167532T1 (de) 1998-07-15
CA2156407C (en) 2003-09-02
CA2156407A1 (en) 1995-07-06

Similar Documents

Publication Publication Date Title
ES2118549T3 (es) Procedimiento y dispositivo para la deposicion por electrolisis de las capas metalicas.
JP2662635B2 (ja) 電気アルミニウムめっき浴およびその浴によるめっき方法
CA2275214C (en) Process to electrolytically deposit copper layers
EP0862665B1 (de) Verfahren zur elektrolytischen abscheidung von metallschichten
AU6898187A (en) Electroplating metal foil
FR2529582A1 (fr) Procede perfectionne de revetement electrolytique de surfaces non metalliques
KR920019971A (ko) 강선에 구리층을 적용시키는 방법
Nakamura et al. Surface morphology and crystal orientation of electrodeposited tin from acid stannous sulphate solutions containing various additives
CA2372730A1 (en) Electrolytic phosphate chemical treatment method
JPS6270592A (ja) 電気アルミニウムめつき浴およびそのめつき浴によるめつき方法
JPH10511743A (ja) メッキ設備
JPH02175894A (ja) スズ、スズ合金電気めっき方法及び同電気めっき装置
Kalantary et al. Unipolar and bipolar pulsed current electrodeposition for PCB production
GB2242440A (en) Electrodeposition of lithium from organic solvent.
JP2657991B2 (ja) 電気アルミニウムめっき浴およびその浴によるめっき方法
JPH05311484A (ja) リフロー錫または錫合金めっき浴
JP2623485B2 (ja) めっき皮膜の面方位をそろえる電気アルミニウムめっき方法
Johal et al. Electrodeposition of thallium from a sulphamate solution
RU94022873A (ru) Способ непрерывного травления меди и устройство для его осуществления
Cooke et al. Electroplating Aluminum Articles
CN1186127A (zh) 在铅框制造过程中所用的电解银溶脱剂
Lin Electrodeposition of tin-lead solder alloys from methane sulfonate electrolytes
JPH07243100A (ja) 銀の電解剥離液及びそれを用いた電解剥離方法
JPH01272789A (ja) 電気アルミニウムめっき浴およびその浴によるめっき方法
JPS5558395A (en) Production of tinfree steel

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 690934

Country of ref document: ES