EP2528088A3 - System zur Wiederherstellung eines beschädigten Wafers - Google Patents
System zur Wiederherstellung eines beschädigten Wafers Download PDFInfo
- Publication number
- EP2528088A3 EP2528088A3 EP12168068.0A EP12168068A EP2528088A3 EP 2528088 A3 EP2528088 A3 EP 2528088A3 EP 12168068 A EP12168068 A EP 12168068A EP 2528088 A3 EP2528088 A3 EP 2528088A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- recovery system
- broken wafer
- wafer recovery
- broken
- fabrication
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000011084 recovery Methods 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 235000012431 wafers Nutrition 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47L—DOMESTIC WASHING OR CLEANING; SUCTION CLEANERS IN GENERAL
- A47L9/00—Details or accessories of suction cleaners, e.g. mechanical means for controlling the suction or for effecting pulsating action; Storing devices specially adapted to suction cleaners or parts thereof; Carrying-vehicles specially adapted for suction cleaners
- A47L9/28—Installation of the electric equipment, e.g. adaptation or attachment to the suction cleaner; Controlling suction cleaners by electric means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/04—Cleaning by suction, with or without auxiliary action
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/115,064 US8459276B2 (en) | 2011-05-24 | 2011-05-24 | Broken wafer recovery system |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2528088A2 EP2528088A2 (de) | 2012-11-28 |
EP2528088A3 true EP2528088A3 (de) | 2014-06-18 |
EP2528088B1 EP2528088B1 (de) | 2018-11-07 |
Family
ID=46085474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP12168068.0A Active EP2528088B1 (de) | 2011-05-24 | 2012-05-15 | System zur Wiederherstellung eines beschädigten Wafers |
Country Status (5)
Country | Link |
---|---|
US (2) | US8459276B2 (de) |
EP (1) | EP2528088B1 (de) |
JP (1) | JP6080118B2 (de) |
CN (1) | CN102810497B (de) |
TW (1) | TWI470729B (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI436831B (zh) | 2009-12-10 | 2014-05-11 | Orbotech Lt Solar Llc | 真空處理裝置之噴灑頭總成 |
US8459276B2 (en) | 2011-05-24 | 2013-06-11 | Orbotech LT Solar, LLC. | Broken wafer recovery system |
TW201332871A (zh) * | 2011-12-07 | 2013-08-16 | Intevac Inc | 高載量太陽能晶圓裝載裝置 |
US8863349B2 (en) * | 2012-04-18 | 2014-10-21 | King Fahd University Of Petroleum And Minerals | Steering and cleaning mechanism for reflector arrays |
CN104103564B (zh) * | 2013-04-15 | 2017-06-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种基片传输方法和系统 |
JP6186940B2 (ja) * | 2013-06-26 | 2017-08-30 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の搬送方法 |
US10161033B2 (en) * | 2015-08-21 | 2018-12-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for cleaning load port of wafer processing apparatus |
CN108111117A (zh) * | 2017-12-21 | 2018-06-01 | 河南理工大学 | 太阳能供电设备及系统 |
CN107946220A (zh) * | 2017-12-22 | 2018-04-20 | 君泰创新(北京)科技有限公司 | 电池片翻片装置 |
FR3079761B1 (fr) * | 2018-04-10 | 2022-02-04 | Commissariat Energie Atomique | Embout de nettoyage et de ramassage de debris de plaquettes de semi-conducteurs et/ou de verre |
CN110854051B (zh) * | 2019-09-11 | 2022-03-01 | 深圳市奥维特机电有限公司 | 一种芯片拾取装置 |
CN111710635B (zh) * | 2020-08-19 | 2020-11-20 | 深圳新益昌科技股份有限公司 | 自动去晶机及去晶方法 |
TWI795105B (zh) * | 2021-11-30 | 2023-03-01 | 弘塑科技股份有限公司 | 攪碎機、晶圓震盪裝置和晶圓清洗系統 |
CN114715657B (zh) * | 2022-04-07 | 2023-09-12 | 九江聚鸿新材料有限公司 | 一种自动放料出料的开条机 |
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US20130269149A1 (en) | 2013-10-17 |
US20120298141A1 (en) | 2012-11-29 |
CN102810497B (zh) | 2017-05-31 |
EP2528088A2 (de) | 2012-11-28 |
TW201302584A (zh) | 2013-01-16 |
US9462921B2 (en) | 2016-10-11 |
CN102810497A (zh) | 2012-12-05 |
JP6080118B2 (ja) | 2017-02-15 |
EP2528088B1 (de) | 2018-11-07 |
US8459276B2 (en) | 2013-06-11 |
TWI470729B (zh) | 2015-01-21 |
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