CN107946220A - 电池片翻片装置 - Google Patents

电池片翻片装置 Download PDF

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CN107946220A
CN107946220A CN201711404936.0A CN201711404936A CN107946220A CN 107946220 A CN107946220 A CN 107946220A CN 201711404936 A CN201711404936 A CN 201711404936A CN 107946220 A CN107946220 A CN 107946220A
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portal frame
turning device
cell piece
silicon chip
sucker
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杨斌
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Deyun Chuangxin (Beijing) Technology Co.,Ltd.
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Beijing Juntai Innovation Technology Co Ltd
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Priority to CN201711404936.0A priority Critical patent/CN107946220A/zh
Publication of CN107946220A publication Critical patent/CN107946220A/zh
Priority to PCT/CN2018/096644 priority patent/WO2019119801A1/zh
Priority to JP2018150546A priority patent/JP2019114770A/ja
Priority to KR1020180092840A priority patent/KR20190076824A/ko
Priority to US16/059,758 priority patent/US20190198360A1/en
Priority to EP18188139.2A priority patent/EP3503220A3/en
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Abstract

本发明公开了一种电池片翻片装置,其包括翻片机构和装载机构,其中,翻片机构包括滑动设置的第一龙门架,第一龙门架用于翻转硅片;装载机构包括滑动设置的第二龙门架,第二龙门架用于将翻转后的硅片敷设到载板上。本发明提供的电池片翻片装置,通过第一龙门架和第二龙门架的配合,实现了硅片翻片和敷设的自动化,解决了现有技术中需要通过人工翻片或人工敷设而影响生产效率的问题,同时实现了硅片在载板上的及时翻片和敷设,无需将硅片收集到硅片料盒中后再进行整体翻片,由此有效简化了翻片工艺,提高了生产节拍。

Description

电池片翻片装置
技术领域
本发明涉及太阳能电池技术领域,尤其涉及一种电池片翻片装置。
背景技术
对于异质结太阳能电池硅片的镀膜工艺,通常会用到PVD、CVD等真空镀膜设备,在对硅片进行双面镀膜过程中,需要硅片在镀膜设备中完成单面镀膜后,进行一次硅片翻转,然后再次进入镀膜设备进行另外一面镀膜。
在现有技术中,硅片通过人工或自动装载的方式敷设在载板上,载板通过自动传输机构通过上料台传入工艺腔室,以进行硅片的正面镀膜,正面镀膜完成后从工艺腔室传输到下料台;在下料台进行人工手动翻片,或者使硅片经过自动下料台收集至硅片料盒,待硅片料盒中所有硅片均完成正面镀膜后,再将硅片料盒翻转,以实现硅片料盒中所有硅片翻转到背面,然后通过人工或自动装载机构将硅片敷设到载板上,并重新传输至工艺腔室中,以进行硅片的反面镀膜;在硅片反面镀膜完成后,可以经过通过人工或自动卸载机构完成硅片的卸载,从而完成硅片的双面镀膜。
然而,现有技术中人工翻片的方式会导致工作效率低,误操作率高,同时伴随着生产节拍降低以及硅片破损率高等问题;如果采用自动卸载的方式,比如使用多关节机械手等装置对硅片先进行卸载,整体翻片后,再进行装载,这样会导致操作流程复杂,整个工艺流程需要进行两次硅片装、卸载,降低工作效率,延迟生产流程节拍,同时也存在硅片破损率变高的问题。
发明内容
本发明的目的是提供一种电池片翻片装置,以解决上述现有技术中的问题,简化翻片工艺,提高生产效率,降低硅片破损率。
本发明提供了一种电池片翻片装置,其中,包括:
翻片机构,所述翻片机构包括滑动设置的第一龙门架,所述第一龙门架用于翻转硅片;
装载机构,所述装载机构包括滑动设置的第二龙门架,所述第二龙门架用于将翻转后的所述硅片敷设到载板上。
如上所述的电池片翻片装置,其中,优选的是,所述第一龙门架包括第一支撑梁、传动臂和第一拾取机构,所述传动臂与所述第一支撑梁转动连接,所述第一拾取机构与所述传动臂转动连接。
如上所述的电池片翻片装置,其中,优选的是,所如上所述的电池片翻片装置,其中,优选的是,端与所述传动臂转动连接,所述第一升降装置的另一端与所述第一吸盘相连。
如上所述的电池片翻片装置,其中,优选的是,所述第一升降装置为第一升降气缸,所述第一升降气缸的缸体与所述传动臂转动连接,所述第一升降气缸的活塞杆与所述第一吸盘相连。
如上所述的电池片翻片装置,其中,优选的是,所述第一龙门架还包括连接梁,所述连接梁与所述第一升降气缸的活塞杆固定连接;
所述第一吸盘的数量有多组,多组所述第一吸盘均匀分布在所述连接梁上。
如上所述的电池片翻片装置,其中,优选的是,所述翻片机构还包括对称设置在所述第一龙门架两侧的第一滑轨,所述第一龙门架与所述第一滑轨滑动连接。
如上所述的电池片翻片装置,其中,优选的是,所述第二龙门架包括第二支撑梁、第二升降装置和第二拾取机构,所述第二升降装置固定设置在所述第二支撑梁上,所述第二拾取机构与所述第二升降装置滑动连接。
如上所述的电池片翻片装置,其中,优选的是,所述第二拾取机构包括连接支架和第二吸盘,所述连接支架的一端与所述第二升降装置相连,所述连接支架的另一端与所述第二吸盘相连。
如上所述的电池片翻片装置,其中,优选的是,所述第二升降装置包括伺服电机、丝杠和限位支架,所述伺服电机的输出轴与所述丝杠固定连接;
所述限位支架固定于所述第二支撑梁固定连接,所述限位支架中设置有空心腔体,所述丝杠伸入到所述空心腔体中,所述限位支架的侧壁上设置有与所述连接支架滑动连接的限位槽;
所述连接支架的一端设置有与所述丝杠配合的螺纹孔。
如上所述的电池片翻片装置,其中,优选的是,所述装载机构还包括对称设置在所述第二龙门架两侧的第二滑轨,所述第二龙门架与所述第二滑轨滑动连接。
本发明提供的电池片翻片装置,通过第一龙门架和第二龙门架的配合,实现了硅片翻片和敷设的自动化,解决了现有技术中需要通过人工翻片或人工敷设而影响生产效率的问题,同时实现了硅片在载板上的及时翻片和敷设,无需将硅片收集到硅片料盒中后再进行整体翻片,由此有效简化了翻片工艺,提高了生产节拍。
附图说明
下面结合附图对本发明的具体实施方式作进一步详细的说明。
图1为本发明实施例提供的电池片翻片装置的俯视图;
图2为第一龙门架的主视图;
图3为第一龙门架的侧视图;
图4为第二龙门架的主视图;
图5为第二龙门架的侧视图;
图6为第一龙门架在翻片前的状态图;
图7为第一龙门架在翻片后的状态图;
图8为第二龙门架拾取第一龙门架上的硅片的状态图;
图9为第二龙门架将硅片敷设在载板上的状态图。
附图标记说明:
100-载板 200-第一龙门架 210-第一支撑梁
220-传动臂 230-第一升降装置 240-第一吸盘
250-连接梁 260-伺服电机 300-第二龙门架
310-第二支撑梁 320-伺服电机 330-限位支架
340-第二吸盘 350-连接支架 400-第一滑轨
500-第二滑轨 600-硅片
具体实施方式
下面详细描述本发明的实施例,所述实施例的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的,仅用于解释本发明,而不能解释为对本发明的限制。
如图1所示,本发明实施例提供了一种电池片翻片装置,其包括翻片机构和装载机构,其中,翻片机构包括滑动设置的第一龙门架200,第一龙门架200用于翻转硅片600;装载机构包括滑动设置的第二龙门架300,第二龙门架300用于将翻转后的硅片600敷设到载板100上。
当硅片600的正面镀膜完成后被传输至下料台或传送带设定位置时,第一龙门架200可以将硅片600拾起并翻转,第二龙门架300拾取翻转后的硅片600后,可以将翻转后的硅片600敷设到载板100上,载有翻转后的硅片600的载板100可以通过自动传输设备输送至上料台,以进行硅片600反面的镀膜。由此,本发明实施例提供的电池片翻片装置,实现了硅片600翻片和敷设的自动化,解决了现有技术中需要通过人工翻片或人工敷设而影响生产效率的问题,同时实现了硅片600在载板100上的及时翻片和敷设,无需将硅片600收集到硅片600料盒中后再进行整体翻片,由此有效简化了翻片工艺,提高了生产节拍。
请同时参照图2和图3,第一龙门架200包括第一支撑梁210、传动臂220和第一拾取机构,传动臂220与第一支撑梁210转动连接,第一拾取机构与传动臂220转动连接。如图6所示,在第一龙门架200运动至待拾取的硅片600上方时,可以通过第一拾取机构对硅片600进行拾取操作;拾取硅片600后,如图7所示,传动臂220转动至垂直于支撑梁的位置,同时带有硅片600的第一拾取机构转动至垂直于传动臂220的位置,由此实现了对硅片600翻转180°,以便于第二龙门架300的拾取。
其中,传动臂220和第一拾取机构可以通过伺服电机260控制转动,具体地,伺服电机260可以分别设置在传动臂220与第一支撑梁210的连接处以及传动臂220与第一拾取机构的连接处。
具体而言,参照图3,第一拾取机构包括第一升降装置230和第一吸盘240,第一升降装置230的一端与传动臂220转动连接,第一升降装置230的另一端与第一吸盘240相连。在对载板100上的硅片600进行拾取前,第一龙门架200保持如图3所示的状态,此时控制第一升降装置230推动第一吸盘240运动,使第一吸盘240将硅片600吸起,如图6所示;其中,第一龙门架200上还可以设置真空泵及传感器,当传感器检测到第一吸盘240与硅片600接触时,真空泵启动,以使第一吸盘240将硅片600吸起。当然,第一拾取机构也可以包括机械夹钳,以通过控制夹钳的开合来实现硅片600的夹起与放下,但是机械夹钳的夹紧力不易控制,容易损伤硅片600;而吸盘采用控制气压的原理来实现硅片600的拾取,因此不易对硅片600造成损伤,容易控制。
具体地,第一升降装置230可以为第一升降气缸,第一升降气缸的缸体与传动臂220转动连接,第一升降气缸的活塞杆与第一吸盘240相连。
进一步地,如图2所示,第一龙门架200还包括连接梁250,连接梁250与第一升降气缸的活塞杆固定连接;第一吸盘240的数量可以有多组,多组第一吸盘240均匀分布在连接梁250上。
需要说明的是,载板100上可以设置有多个用于敷设硅片600的敷设区,如图1,在本实施例中,敷设区的数量为30个,分布为六行五列,由此可以同时对30个硅片600进行镀膜加工;而连接梁250可以为一种横梁,在本实施例中,连接梁250上设置有六个第一吸盘240,每一个第一吸盘240对应一个敷设区,由此可以对同一列上的硅片600进行同时翻转,有效提高了生产效率。
具体而言,如图1所示,翻片机构还包括对称设置在第一龙门架200两侧的第一滑轨400,第一龙门架200与第一滑轨400滑动连接。优先地,将载板100放置在第一龙门架200的正下方,此时载板100中的每列敷设区与第一龙门架200平行,在将第一列敷设区上的硅片600翻转完成后,第一龙门架200可以沿第一滑轨400滑动至下一列敷设区,由此方便了第一龙门架200的移动和控制。
进一步地,参照图4和图5,第二龙门架300包括第二支撑梁310、第二升降装置和第二拾取机构,第二升降装置固定设置在第二支撑梁310上,第二拾取机构与第二升降装置滑动连接。当第一龙门架200将硅片600翻转后,可以通过第二升降装置控制第二拾取机构拾取第一吸盘240上的硅片600,如图8所示;然后,控制第一龙门架200恢复至翻片前的状态,以防止阻挡带有硅片600的第二拾取机构运动;在第一龙门架200恢复至翻片前的状态后,再通过第二升降装置控制第二拾取机构向载板100所在方向运动,以将翻转后的硅片600敷设在载板100上,如图9所示;敷设完成后,控制第二拾取机构回到拾取硅片600前的位置,并控制第二龙门架300和第一龙门架200移动至下一列待翻转的硅片600的位置,从而实现了对硅片600的连续翻转和敷设。
具体地,如图5所示,第二拾取机构包括连接支架350和第二吸盘340,连接支架350的一端与第二升降装置相连,连接支架350的另一端与第二吸盘340相连。其中,连接支架350与第二吸盘340之间可以转动连接,以便于调整第二吸盘340的角度,以使第二吸盘340可以与第一吸盘240配合;当然,连接支架350与第二吸盘340之间也可以固定连接,以保证第二吸盘340位置的稳定性,具体的连接方式以满足第二吸盘340和第一吸盘240配合要求为准,对此本实施例不作限定。
进一步地,如图5所示,第二升降装置包括伺服电机320和限位支架330,伺服电机320的输出轴与丝杠固定连接;限位支架330固定于第二支撑梁310固定连接,限位支架330中设置有空心腔体,丝杠伸入到空心腔体中,限位支架330的侧壁上设置有与连接支架350滑动连接的限位槽;连接支架的350一端设置有与丝杠配合的螺纹孔。当伺服电机320启动时,可以通过其输出轴带动丝杠转动,由于连接支架350与丝杠螺纹连接,从而可以使连接支架350在丝杠轴线方向上运动;其中,连接支架350上设置有螺纹孔的一端与限位槽滑动配合,由此可以防止第二吸盘340过度运动,同时保证第二吸盘340运动的准确性。
当然,第二吸盘340的数量与设置位置可以与第一吸盘240对应,由此可以通过第一吸盘240和第二吸盘340的配合实现硅片600的翻转和敷设。
可以理解的是,如图1所示,为了便于第二龙门架300的移动和控制,装载机构还可以包括对称设置在第二龙门架300两侧的第二滑轨500,第二龙门架300与第二滑轨500滑动连接。
本发明实施例提供的电池片翻片装置,通过第一龙门架和第二龙门架的配合,实现了硅片翻片和敷设的自动化,解决了现有技术中需要通过人工翻片或人工敷设而影响生产效率的问题,同时实现了硅片在载板上的及时翻片和敷设,无需将硅片收集到硅片料盒中后再进行整体翻片,由此有效简化了翻片工艺,提高了生产节拍。
以上依据图式所示的实施例详细说明了本发明的构造、特征及作用效果,以上所述仅为本发明的较佳实施例,但本发明不以图面所示限定实施范围,凡是依照本发明的构想所作的改变,或修改为等同变化的等效实施例,仍未超出说明书与图示所涵盖的精神时,均应在本发明的保护范围内。

Claims (10)

1.一种电池片翻片装置,其特征在于,包括:
翻片机构,所述翻片机构包括滑动设置的第一龙门架,所述第一龙门架用于翻转硅片;
装载机构,所述装载机构包括滑动设置的第二龙门架,所述第二龙门架用于将翻转后的所述硅片敷设到载板上。
2.根据权利要求1所述的电池片翻片装置,其特征在于,所述第一龙门架包括第一支撑梁、传动臂和第一拾取机构,所述传动臂与所述第一支撑梁转动连接,所述第一拾取机构与所述传动臂转动连接。
3.根据权利要求2所述的电池片翻片装置,其特征在于,所述第一拾取机构包括第一升降装置和第一吸盘,所述第一升降装置的一端与所述传动臂转动连接,所述第一升降装置的另一端与所述第一吸盘相连。
4.根据权利要求3所述的电池片翻片装置,其特征在于,所述第一升降装置为第一升降气缸,所述第一升降气缸的缸体与所述传动臂转动连接,所述第一升降气缸的活塞杆与所述第一吸盘相连。
5.根据权利要求4所述的电池片翻片装置,其特征在于,所述第一龙门架还包括连接梁,所述连接梁与所述第一升降气缸的活塞杆固定连接;
所述第一吸盘的数量有多组,多组所述第一吸盘均匀分布在所述连接梁上。
6.根据权利要求1-5任一项所述的电池片翻片装置,其特征在于,所述翻片机构还包括对称设置在所述第一龙门架两侧的第一滑轨,所述第一龙门架与所述第一滑轨滑动连接。
7.根据权利要求1所述的电池片翻片装置,其特征在于,所述第二龙门架包括第二支撑梁、第二升降装置和第二拾取机构,所述第二升降装置固定设置在所述第二支撑梁上,所述第二拾取机构与所述第二升降装置滑动连接。
8.根据权利要求7所述的电池片翻片装置,其特征在于,所述第二拾取机构包括连接支架和第二吸盘,所述连接支架的一端与所述第二升降装置相连,所述连接支架的另一端与所述第二吸盘相连。
9.根据权利要求8所述的电池片翻片装置,其特征在于,所述第二升降装置包括伺服电机、丝杠和限位支架,所述伺服电机的输出轴与所述丝杠固定连接;
所述限位支架固定于所述第二支撑梁固定连接,所述限位支架中设置有空心腔体,所述丝杠伸入到所述空心腔体中,所述限位支架的侧壁上设置有与所述连接支架滑动连接的限位槽;
所述连接支架的一端设置有与所述丝杠配合的螺纹孔。
10.根据权利要求7-9任一项所述的电池片翻片装置,其特征在于,所述装载机构还包括对称设置在所述第二龙门架两侧的第二滑轨,所述第二龙门架与所述第二滑轨滑动连接。
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019119801A1 (zh) * 2017-12-22 2019-06-27 君泰创新(北京)科技有限公司 电池片翻片装置及电池片翻片方法
CN110299421A (zh) * 2019-07-09 2019-10-01 理想晶延半导体设备(上海)有限公司 介质膜沉积方法
CN110311015A (zh) * 2019-07-09 2019-10-08 理想晶延半导体设备上海(有限)公司 晶硅太阳能电池的薄膜沉积方法
CN110416354A (zh) * 2019-06-28 2019-11-05 徐州谷阳新能源科技有限公司 一种管式镀膜机二合一方法
CN111312638A (zh) * 2019-10-25 2020-06-19 深圳市拉普拉斯能源技术有限公司 一种能够进行原料暂存的自动化上下料装置
CN111463161A (zh) * 2019-10-22 2020-07-28 国家电投集团西安太阳能电力有限公司 一种太阳能电池刻蚀后的翻片器装置
CN111769064A (zh) * 2020-06-18 2020-10-13 无锡先导智能装备股份有限公司 上下料装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114335253B (zh) * 2021-12-31 2023-08-08 湖南红太阳光电科技有限公司 一种硅片取放装置及取放方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204053287U (zh) * 2014-08-22 2014-12-31 刘阁海 太阳能电池片自动串焊机的太阳能电池片转送装置
CN204230214U (zh) * 2014-12-08 2015-03-25 新奥光伏能源有限公司 一种翻转台
CN106611729A (zh) * 2016-12-22 2017-05-03 新奥光伏能源有限公司 一种用于片材的自动翻片装置、方法及太阳能电池生产线
CN207529912U (zh) * 2017-12-22 2018-06-22 君泰创新(北京)科技有限公司 电池片翻片装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1519248A (en) * 1923-12-08 1924-12-16 Pittsburgh Plate Glass Co Process and apparatus for handling glass plates
FR1299695A (fr) * 1961-06-16 1962-07-27 Saint Gobain Dispositif pour la manutention de feuilles de verre déplacées par un transporteur
US4921387A (en) * 1988-09-16 1990-05-01 The Budd Company Combination transfer/turnover machine
JPH09298229A (ja) * 1996-05-08 1997-11-18 Mitsubishi Materials Shilicon Corp 半導体ウェ−ハの搬送装置
US6570356B2 (en) * 2000-04-07 2003-05-27 Kawasaki Jukogyo Kabushiki Kaisha Robot system
JP4467367B2 (ja) * 2004-06-22 2010-05-26 大日本スクリーン製造株式会社 基板反転装置、基板搬送装置、基板処理装置、基板反転方法、基板搬送方法および基板処理方法
JP2008172160A (ja) * 2007-01-15 2008-07-24 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
TWI334749B (en) * 2008-01-04 2010-12-11 Foxconn Advanced Tech Inc Releasing and collecting system for printed circuit board and turn-over method using the same
US8459276B2 (en) * 2011-05-24 2013-06-11 Orbotech LT Solar, LLC. Broken wafer recovery system
US9190307B2 (en) * 2012-02-16 2015-11-17 Asm Technology Singapore Pte Ltd Apparatus for transferring a solar wafer or solar cell during its fabrication
US9064920B2 (en) * 2012-07-22 2015-06-23 Varian Semiconductor Equipment Associates, Inc. Electrostatic charge removal for solar cell grippers
CN103659411B (zh) * 2012-08-31 2016-03-09 鸿富锦精密工业(深圳)有限公司 翻转装置
GB2507057A (en) * 2012-10-17 2014-04-23 Dtg Int Gmbh Apparatus for and method of inverting workpieces
CN203602097U (zh) * 2013-10-28 2014-05-21 富鼎电子科技(嘉善)有限公司 翻面机
CN205666249U (zh) * 2016-06-07 2016-10-26 东莞市启天自动化设备有限公司 一种太阳能硅片翻转机
CN206379365U (zh) * 2017-01-18 2017-08-04 蚌埠凯盛工程技术有限公司 薄膜太阳能电池基板的提升翻转装置
CN107946220A (zh) * 2017-12-22 2018-04-20 君泰创新(北京)科技有限公司 电池片翻片装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204053287U (zh) * 2014-08-22 2014-12-31 刘阁海 太阳能电池片自动串焊机的太阳能电池片转送装置
CN204230214U (zh) * 2014-12-08 2015-03-25 新奥光伏能源有限公司 一种翻转台
CN106611729A (zh) * 2016-12-22 2017-05-03 新奥光伏能源有限公司 一种用于片材的自动翻片装置、方法及太阳能电池生产线
CN207529912U (zh) * 2017-12-22 2018-06-22 君泰创新(北京)科技有限公司 电池片翻片装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019119801A1 (zh) * 2017-12-22 2019-06-27 君泰创新(北京)科技有限公司 电池片翻片装置及电池片翻片方法
CN110416354A (zh) * 2019-06-28 2019-11-05 徐州谷阳新能源科技有限公司 一种管式镀膜机二合一方法
CN110299421A (zh) * 2019-07-09 2019-10-01 理想晶延半导体设备(上海)有限公司 介质膜沉积方法
CN110311015A (zh) * 2019-07-09 2019-10-08 理想晶延半导体设备上海(有限)公司 晶硅太阳能电池的薄膜沉积方法
CN111463161A (zh) * 2019-10-22 2020-07-28 国家电投集团西安太阳能电力有限公司 一种太阳能电池刻蚀后的翻片器装置
CN111312638A (zh) * 2019-10-25 2020-06-19 深圳市拉普拉斯能源技术有限公司 一种能够进行原料暂存的自动化上下料装置
CN111769064A (zh) * 2020-06-18 2020-10-13 无锡先导智能装备股份有限公司 上下料装置
CN111769064B (zh) * 2020-06-18 2023-07-14 无锡先导智能装备股份有限公司 上下料装置

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