EP2192210B1 - Edelmetallhaltige Schichtfolge für dekorative Artikel - Google Patents
Edelmetallhaltige Schichtfolge für dekorative Artikel Download PDFInfo
- Publication number
- EP2192210B1 EP2192210B1 EP08020286A EP08020286A EP2192210B1 EP 2192210 B1 EP2192210 B1 EP 2192210B1 EP 08020286 A EP08020286 A EP 08020286A EP 08020286 A EP08020286 A EP 08020286A EP 2192210 B1 EP2192210 B1 EP 2192210B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- alloy
- rhodium
- ruthenium
- layer
- platinum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Revoked
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
-
- A—HUMAN NECESSITIES
- A44—HABERDASHERY; JEWELLERY
- A44C—PERSONAL ADORNMENTS, e.g. JEWELLERY; COINS
- A44C27/00—Making jewellery or other personal adornments
- A44C27/001—Materials for manufacturing jewellery
- A44C27/005—Coating layers for jewellery
- A44C27/006—Metallic coatings
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/623—Porosity of the layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/005—Jewels; Clockworks; Coins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12875—Platinum group metal-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Adornments (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Laminated Bodies (AREA)
- Contacts (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08020286A EP2192210B1 (de) | 2008-11-21 | 2008-11-21 | Edelmetallhaltige Schichtfolge für dekorative Artikel |
ES08020286T ES2355283T3 (es) | 2008-11-21 | 2008-11-21 | Secuencia de capas con contenido en metales preciosos para artículos decorativos. |
DE502008001789T DE502008001789D1 (de) | 2008-11-21 | 2008-11-21 | Edelmetallhaltige Schichtfolge für dekorative Artikel |
AT08020286T ATE487812T1 (de) | 2008-11-21 | 2008-11-21 | Edelmetallhaltige schichtfolge für dekorative artikel |
TW098135602A TWI464052B (zh) | 2008-11-21 | 2009-10-21 | 用於裝飾性物件之含貴金屬的層序 |
CN2009801464180A CN102224280B (zh) | 2008-11-21 | 2009-11-03 | 用于装饰制品的含贵金属的序列层 |
PCT/EP2009/007853 WO2010057573A1 (en) | 2008-11-21 | 2009-11-03 | Noble metal-containing layer sequence for decorative articles |
US13/130,154 US20110236720A1 (en) | 2008-11-21 | 2009-11-03 | Noble metal-containing layer sequence for decorative articles |
KR1020117014122A KR20110086631A (ko) | 2008-11-21 | 2009-11-03 | 장식품용 귀금속 함유 층 연속물 |
JP2011536756A JP5436569B2 (ja) | 2008-11-21 | 2009-11-03 | 装飾物品のための貴金属含有層連続物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08020286A EP2192210B1 (de) | 2008-11-21 | 2008-11-21 | Edelmetallhaltige Schichtfolge für dekorative Artikel |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2192210A1 EP2192210A1 (de) | 2010-06-02 |
EP2192210B1 true EP2192210B1 (de) | 2010-11-10 |
Family
ID=40548612
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08020286A Revoked EP2192210B1 (de) | 2008-11-21 | 2008-11-21 | Edelmetallhaltige Schichtfolge für dekorative Artikel |
Country Status (10)
Country | Link |
---|---|
US (1) | US20110236720A1 (ja) |
EP (1) | EP2192210B1 (ja) |
JP (1) | JP5436569B2 (ja) |
KR (1) | KR20110086631A (ja) |
CN (1) | CN102224280B (ja) |
AT (1) | ATE487812T1 (ja) |
DE (1) | DE502008001789D1 (ja) |
ES (1) | ES2355283T3 (ja) |
TW (1) | TWI464052B (ja) |
WO (1) | WO2010057573A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2873752B1 (en) * | 2012-07-13 | 2020-05-20 | Toyo Kohan Co., Ltd. | Electroless gold plating method and gold-plate-coated material |
AT514818B1 (de) * | 2013-09-18 | 2015-10-15 | W Garhöfer Ges M B H Ing | Abscheidung von Cu, Sn, Zn-Beschichtungen auf metallischen Substraten |
AT516876B1 (de) * | 2015-03-09 | 2016-11-15 | Ing W Garhöfer Ges M B H | Abscheidung von dekorativen Palladium-Eisen-Legierungsbeschichtungen auf metallischen Substanzen |
EP3550057A3 (de) * | 2018-04-03 | 2019-11-13 | Supro GmbH | Mehrschichtige oberflächenbeschichtung |
DE102019109188B4 (de) * | 2019-04-08 | 2022-08-11 | Umicore Galvanotechnik Gmbh | Verwendung eines Elektrolyten zur Abscheidung von anthrazit/schwarzen Rhodium/Ruthenium Legierungsschichten |
WO2020250174A1 (en) * | 2019-06-11 | 2020-12-17 | Legor Group Spa | Galvanic bath and process for producing a ruthenium/platinum alloy by means of electro-galvanic deposition |
CN110965088A (zh) * | 2019-08-27 | 2020-04-07 | 周大福珠宝金行(深圳)有限公司 | 一种黄金的复古工艺以及复古黄金 |
IT202100003875A1 (it) * | 2021-02-19 | 2022-08-19 | Legor Group S P A | Bagno galvanico e procedimento al fine di produrre una lega di platino-rutenio tramite deposizione elettrogalvanica |
IT202100027197A1 (it) | 2021-10-22 | 2023-04-22 | Berkem Srl | Bagno galvanico per la deposizione elettrochimica di leghe rodio-rutenio avente colore simile al rodio puro ed elevata resistenza meccanica e deposito così ottenuto |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE412665A (ja) * | 1935-01-16 | |||
NL127936C (ja) * | 1964-03-04 | |||
CH512590A (fr) | 1970-03-20 | 1971-09-15 | Sel Rex Corp | Procédé pour le dépôt électrolytique d'alliages de ruthénium, bain aqueux pour la mise en oeuvre de ce procédé, et article revêtu d'un alliage de ruthénium obtenu par ce procédé |
JPS5544157B2 (ja) * | 1971-08-21 | 1980-11-11 | ||
DE2429275A1 (de) | 1973-06-21 | 1975-01-16 | Oxy Metal Industries Corp | Elektrolyt fuer die abscheidung von rhodium-rtheniumlegierungen |
JPS5544534A (en) * | 1978-09-25 | 1980-03-28 | Electroplating Eng Of Japan Co | Coating of rhodium-ruthenium alloy film and alloy plating method thereof |
JPS5576089A (en) * | 1978-11-30 | 1980-06-07 | Electroplating Eng Of Japan Co | Rhodium-ruthenium alloy film coated product and production thereof |
JPH0170867U (ja) * | 1987-10-27 | 1989-05-11 | ||
US5178745A (en) * | 1991-05-03 | 1993-01-12 | At&T Bell Laboratories | Acidic palladium strike bath |
JP2952541B2 (ja) * | 1992-04-15 | 1999-09-27 | セイコーインスツルメンツ株式会社 | 白色または金色めっき製品 |
WO1997020970A1 (fr) * | 1995-08-23 | 1997-06-12 | Citizen Watch Co., Ltd. | Element ornemental |
US5792565A (en) * | 1996-10-18 | 1998-08-11 | Avon Products, Inc. | Multiple layered article having a bright copper layer |
US6168873B1 (en) * | 1997-05-29 | 2001-01-02 | Canon Kabushiki Kaisha | Electrode substrate and recording medium |
US6607846B1 (en) * | 2002-09-25 | 2003-08-19 | Titanium Metals Corporation | Titanium article having improved corrosion resistance |
CN101096769A (zh) * | 2006-06-26 | 2008-01-02 | 比亚迪股份有限公司 | 一种电镀方法 |
-
2008
- 2008-11-21 AT AT08020286T patent/ATE487812T1/de active
- 2008-11-21 EP EP08020286A patent/EP2192210B1/de not_active Revoked
- 2008-11-21 ES ES08020286T patent/ES2355283T3/es active Active
- 2008-11-21 DE DE502008001789T patent/DE502008001789D1/de active Active
-
2009
- 2009-10-21 TW TW098135602A patent/TWI464052B/zh active
- 2009-11-03 WO PCT/EP2009/007853 patent/WO2010057573A1/en active Application Filing
- 2009-11-03 JP JP2011536756A patent/JP5436569B2/ja active Active
- 2009-11-03 CN CN2009801464180A patent/CN102224280B/zh active Active
- 2009-11-03 KR KR1020117014122A patent/KR20110086631A/ko not_active Application Discontinuation
- 2009-11-03 US US13/130,154 patent/US20110236720A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
DE502008001789D1 (de) | 2010-12-23 |
WO2010057573A1 (en) | 2010-05-27 |
ES2355283T3 (es) | 2011-03-24 |
CN102224280A (zh) | 2011-10-19 |
ATE487812T1 (de) | 2010-11-15 |
JP5436569B2 (ja) | 2014-03-05 |
TW201032997A (en) | 2010-09-16 |
CN102224280B (zh) | 2013-10-23 |
KR20110086631A (ko) | 2011-07-28 |
JP2012509400A (ja) | 2012-04-19 |
TWI464052B (zh) | 2014-12-11 |
EP2192210A1 (de) | 2010-06-02 |
US20110236720A1 (en) | 2011-09-29 |
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