JPS5544534A - Coating of rhodium-ruthenium alloy film and alloy plating method thereof - Google Patents
Coating of rhodium-ruthenium alloy film and alloy plating method thereofInfo
- Publication number
- JPS5544534A JPS5544534A JP11673878A JP11673878A JPS5544534A JP S5544534 A JPS5544534 A JP S5544534A JP 11673878 A JP11673878 A JP 11673878A JP 11673878 A JP11673878 A JP 11673878A JP S5544534 A JPS5544534 A JP S5544534A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- alloy
- rhodium
- sulfate
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title abstract 9
- 229910000929 Ru alloy Inorganic materials 0.000 title abstract 2
- 229910045601 alloy Inorganic materials 0.000 title abstract 2
- 239000000956 alloy Substances 0.000 title abstract 2
- YPPQDPIIWDQYRY-UHFFFAOYSA-N [Ru].[Rh] Chemical compound [Ru].[Rh] YPPQDPIIWDQYRY-UHFFFAOYSA-N 0.000 title 1
- 239000011248 coating agent Substances 0.000 title 1
- 238000000576 coating method Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract 2
- 238000007654 immersion Methods 0.000 abstract 2
- 238000002347 injection Methods 0.000 abstract 2
- 239000007924 injection Substances 0.000 abstract 2
- YWFDDXXMOPZFFM-UHFFFAOYSA-H rhodium(3+);trisulfate Chemical compound [Rh+3].[Rh+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O YWFDDXXMOPZFFM-UHFFFAOYSA-H 0.000 abstract 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000002932 luster Substances 0.000 abstract 1
- 150000002681 magnesium compounds Chemical class 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 abstract 1
- 239000010948 rhodium Substances 0.000 abstract 1
- YBCAZPLXEGKKFM-UHFFFAOYSA-K ruthenium(iii) chloride Chemical compound [Cl-].[Cl-].[Cl-].[Ru+3] YBCAZPLXEGKKFM-UHFFFAOYSA-K 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
PURPOSE: To form Rh-Ru alloy plating layer, having luster, white color, high dignity, and enough thickness, not causing crack, by using a plating bath containing Rh in the form of sulfate and Ru as soluble salt.
CONSTITUTION: A plating bath is an aqueous solution containing rhodium sulfate, ruthenium chloride, free sulfuric acid, sulfamic acid, and soluble magnesium compound. The quantity of rhodium sulfate should be 1W10g/l in the case of immersion electroplating, or up to 30g/l in the case of injection plating. The quantity of Ru should be properly 10W1000mg/l in both immersion plating and injection plating. As for the plating condition, the bath temperature should be 40W60°C, and current density within 0.5W2A/dm2. When the material being plated is coated with Ag, Au or alloy thereof as the base plating preliminarily, it is effective when using as electrical contact.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11673878A JPS5544534A (en) | 1978-09-25 | 1978-09-25 | Coating of rhodium-ruthenium alloy film and alloy plating method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11673878A JPS5544534A (en) | 1978-09-25 | 1978-09-25 | Coating of rhodium-ruthenium alloy film and alloy plating method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5544534A true JPS5544534A (en) | 1980-03-28 |
Family
ID=14694557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11673878A Pending JPS5544534A (en) | 1978-09-25 | 1978-09-25 | Coating of rhodium-ruthenium alloy film and alloy plating method thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5544534A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012509400A (en) * | 2008-11-21 | 2012-04-19 | ユミコア ガルヴァノテヒニク ゲゼルシャフト ミット ベシュレンクテル ハフツング | Precious metal-containing layer continuum for decorative articles |
FR3074193A1 (en) * | 2017-11-28 | 2019-05-31 | Linxens Holding | ELECTRIC CIRCUIT, ELECTRONIC MODULE FOR A CHIP CARD COMPRISING ON THIS ELECTRIC CIRCUIT, AND METHOD FOR PRODUCING SUCH ELECTRIC CIRCUIT. |
CN113186572A (en) * | 2021-04-30 | 2021-07-30 | 东莞市环侨金属制品有限公司 | Rhodium ruthenium alloy electroplating process |
-
1978
- 1978-09-25 JP JP11673878A patent/JPS5544534A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012509400A (en) * | 2008-11-21 | 2012-04-19 | ユミコア ガルヴァノテヒニク ゲゼルシャフト ミット ベシュレンクテル ハフツング | Precious metal-containing layer continuum for decorative articles |
FR3074193A1 (en) * | 2017-11-28 | 2019-05-31 | Linxens Holding | ELECTRIC CIRCUIT, ELECTRONIC MODULE FOR A CHIP CARD COMPRISING ON THIS ELECTRIC CIRCUIT, AND METHOD FOR PRODUCING SUCH ELECTRIC CIRCUIT. |
WO2019106284A1 (en) * | 2017-11-28 | 2019-06-06 | Linxens Holding | Electric circuit, electronic module for a chip card formed on the electric circuit, and method for the production of such an electric circuit |
KR20200092326A (en) * | 2017-11-28 | 2020-08-03 | 랑셍 홀딩 | Electrical circuits, electronic modules for chip cards formed on electrical circuits, and methods of manufacturing such electrical circuits |
US11047060B2 (en) | 2017-11-28 | 2021-06-29 | Linxens Holding | Electric circuit, electronic module for a chip card formed on the electric circuit, and method for the production of such an electric circuit |
CN113186572A (en) * | 2021-04-30 | 2021-07-30 | 东莞市环侨金属制品有限公司 | Rhodium ruthenium alloy electroplating process |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3380898A (en) | Electrolyte and method for electrodepositing a pink gold alloy | |
US4100039A (en) | Method for plating palladium-nickel alloy | |
JPH05505853A (en) | Method for forming silver-graphite dispersion coating | |
JPS5544534A (en) | Coating of rhodium-ruthenium alloy film and alloy plating method thereof | |
US3892638A (en) | Electrolyte and method for electrodepositing rhodium-ruthenium alloys | |
JPS6223078B2 (en) | ||
US3104212A (en) | Electroplating smooth ductile gold | |
US2351940A (en) | Method of making plated articles | |
JPH02175895A (en) | Method for plating nonconductor | |
CA2105814A1 (en) | Platinum alloy electrodeposition bath and process for manufacturing platinum alloy electrodeposited product using the same | |
CA1050471A (en) | Electroplating of rhodium-ruthenium alloys | |
JPS55107795A (en) | Gold tin alloy electroplating bath and plating method | |
JPS5770286A (en) | Plating bath composition and plating method | |
JPS5554589A (en) | Plating method of electronic parts which prevent production of zinc whisker | |
JPS5576089A (en) | Rhodium-ruthenium alloy film coated product and production thereof | |
GB1072352A (en) | Process for electroplating on aluminium or on alloy thereof | |
JPS575856A (en) | Plating method | |
JPS5620190A (en) | Substrate steel sheet for coating | |
JPS61201794A (en) | Partial plating method | |
JPS57140884A (en) | Plating method for silver | |
KR0168321B1 (en) | Method and composition for underplating a copper alloy or iron nickel alloy substrate | |
JPS55119198A (en) | Insoluble anode for electroplating | |
JPS59100286A (en) | Method for plating nickel on steel battery case | |
KR890005182B1 (en) | Electrolyte composition of a electroforming | |
JPS62238393A (en) | Method for electroplating aluminum material |