JPS5544534A - Coating of rhodium-ruthenium alloy film and alloy plating method thereof - Google Patents

Coating of rhodium-ruthenium alloy film and alloy plating method thereof

Info

Publication number
JPS5544534A
JPS5544534A JP11673878A JP11673878A JPS5544534A JP S5544534 A JPS5544534 A JP S5544534A JP 11673878 A JP11673878 A JP 11673878A JP 11673878 A JP11673878 A JP 11673878A JP S5544534 A JPS5544534 A JP S5544534A
Authority
JP
Japan
Prior art keywords
plating
alloy
rhodium
sulfate
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11673878A
Other languages
Japanese (ja)
Inventor
Kazuhiro Higuchi
Mitsuru Shibata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EEJA Ltd
Original Assignee
Electroplating Engineers of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electroplating Engineers of Japan Ltd filed Critical Electroplating Engineers of Japan Ltd
Priority to JP11673878A priority Critical patent/JPS5544534A/en
Publication of JPS5544534A publication Critical patent/JPS5544534A/en
Pending legal-status Critical Current

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  • Electroplating And Plating Baths Therefor (AREA)

Abstract

PURPOSE: To form Rh-Ru alloy plating layer, having luster, white color, high dignity, and enough thickness, not causing crack, by using a plating bath containing Rh in the form of sulfate and Ru as soluble salt.
CONSTITUTION: A plating bath is an aqueous solution containing rhodium sulfate, ruthenium chloride, free sulfuric acid, sulfamic acid, and soluble magnesium compound. The quantity of rhodium sulfate should be 1W10g/l in the case of immersion electroplating, or up to 30g/l in the case of injection plating. The quantity of Ru should be properly 10W1000mg/l in both immersion plating and injection plating. As for the plating condition, the bath temperature should be 40W60°C, and current density within 0.5W2A/dm2. When the material being plated is coated with Ag, Au or alloy thereof as the base plating preliminarily, it is effective when using as electrical contact.
COPYRIGHT: (C)1980,JPO&Japio
JP11673878A 1978-09-25 1978-09-25 Coating of rhodium-ruthenium alloy film and alloy plating method thereof Pending JPS5544534A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11673878A JPS5544534A (en) 1978-09-25 1978-09-25 Coating of rhodium-ruthenium alloy film and alloy plating method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11673878A JPS5544534A (en) 1978-09-25 1978-09-25 Coating of rhodium-ruthenium alloy film and alloy plating method thereof

Publications (1)

Publication Number Publication Date
JPS5544534A true JPS5544534A (en) 1980-03-28

Family

ID=14694557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11673878A Pending JPS5544534A (en) 1978-09-25 1978-09-25 Coating of rhodium-ruthenium alloy film and alloy plating method thereof

Country Status (1)

Country Link
JP (1) JPS5544534A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012509400A (en) * 2008-11-21 2012-04-19 ユミコア ガルヴァノテヒニク ゲゼルシャフト ミット ベシュレンクテル ハフツング Precious metal-containing layer continuum for decorative articles
FR3074193A1 (en) * 2017-11-28 2019-05-31 Linxens Holding ELECTRIC CIRCUIT, ELECTRONIC MODULE FOR A CHIP CARD COMPRISING ON THIS ELECTRIC CIRCUIT, AND METHOD FOR PRODUCING SUCH ELECTRIC CIRCUIT.
CN113186572A (en) * 2021-04-30 2021-07-30 东莞市环侨金属制品有限公司 Rhodium ruthenium alloy electroplating process

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012509400A (en) * 2008-11-21 2012-04-19 ユミコア ガルヴァノテヒニク ゲゼルシャフト ミット ベシュレンクテル ハフツング Precious metal-containing layer continuum for decorative articles
FR3074193A1 (en) * 2017-11-28 2019-05-31 Linxens Holding ELECTRIC CIRCUIT, ELECTRONIC MODULE FOR A CHIP CARD COMPRISING ON THIS ELECTRIC CIRCUIT, AND METHOD FOR PRODUCING SUCH ELECTRIC CIRCUIT.
WO2019106284A1 (en) * 2017-11-28 2019-06-06 Linxens Holding Electric circuit, electronic module for a chip card formed on the electric circuit, and method for the production of such an electric circuit
KR20200092326A (en) * 2017-11-28 2020-08-03 랑셍 홀딩 Electrical circuits, electronic modules for chip cards formed on electrical circuits, and methods of manufacturing such electrical circuits
US11047060B2 (en) 2017-11-28 2021-06-29 Linxens Holding Electric circuit, electronic module for a chip card formed on the electric circuit, and method for the production of such an electric circuit
CN113186572A (en) * 2021-04-30 2021-07-30 东莞市环侨金属制品有限公司 Rhodium ruthenium alloy electroplating process

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