DE69826538D1 - Verfahren und Einrichtung zur Reinigung eines Gegenstandes - Google Patents

Verfahren und Einrichtung zur Reinigung eines Gegenstandes

Info

Publication number
DE69826538D1
DE69826538D1 DE69826538T DE69826538T DE69826538D1 DE 69826538 D1 DE69826538 D1 DE 69826538D1 DE 69826538 T DE69826538 T DE 69826538T DE 69826538 T DE69826538 T DE 69826538T DE 69826538 D1 DE69826538 D1 DE 69826538D1
Authority
DE
Germany
Prior art keywords
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69826538T
Other languages
English (en)
Other versions
DE69826538T2 (de
Inventor
Yuji Kamikawa
Kinya Ueno
Satoshi Nakashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of DE69826538D1 publication Critical patent/DE69826538D1/de
Publication of DE69826538T2 publication Critical patent/DE69826538T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/08Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00Cleaning and liquid contact with solids
    • Y10S134/902Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Drying Of Solid Materials (AREA)
DE69826538T 1997-01-24 1998-01-23 Verfahren und Einrichtung zur Reinigung eines Gegenstandes Expired - Lifetime DE69826538T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP01155397A JP3171807B2 (ja) 1997-01-24 1997-01-24 洗浄装置及び洗浄方法
JP1155397 1997-01-24

Publications (2)

Publication Number Publication Date
DE69826538D1 true DE69826538D1 (de) 2004-11-04
DE69826538T2 DE69826538T2 (de) 2005-03-03

Family

ID=11781148

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69826538T Expired - Lifetime DE69826538T2 (de) 1997-01-24 1998-01-23 Verfahren und Einrichtung zur Reinigung eines Gegenstandes

Country Status (7)

Country Link
US (3) US6131588A (de)
EP (1) EP0855736B1 (de)
JP (1) JP3171807B2 (de)
KR (1) KR100385037B1 (de)
CN (1) CN1205651C (de)
DE (1) DE69826538T2 (de)
TW (1) TW406330B (de)

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JP7314634B2 (ja) * 2019-06-11 2023-07-26 東京エレクトロン株式会社 塗布装置及び塗布方法
CN110335839B (zh) * 2019-07-05 2022-02-22 西安奕斯伟材料科技有限公司 一种片盒清洗装置及方法
CN110694991A (zh) * 2019-10-22 2020-01-17 长江存储科技有限责任公司 晶圆清洗装置
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CN112371611B (zh) * 2020-10-13 2022-02-01 江苏亚电科技有限公司 一种无篮晶圆清洗装置
TWI809449B (zh) * 2020-10-22 2023-07-21 南亞科技股份有限公司 氣體沖洗裝置以及氣體沖洗方法
CN112744419B (zh) * 2020-11-27 2023-11-03 乐金显示光电科技(中国)有限公司 显示面板斑点抑制方法及抑制设备

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US6131588A (en) 2000-10-17
TW406330B (en) 2000-09-21
DE69826538T2 (de) 2005-03-03
JPH10209110A (ja) 1998-08-07
CN1194454A (zh) 1998-09-30
US6319329B1 (en) 2001-11-20
JP3171807B2 (ja) 2001-06-04
EP0855736A2 (de) 1998-07-29
EP0855736B1 (de) 2004-09-29
US6491045B2 (en) 2002-12-10
KR19980070821A (ko) 1998-10-26
CN1205651C (zh) 2005-06-08
KR100385037B1 (ko) 2003-08-21
US20020017315A1 (en) 2002-02-14
EP0855736A3 (de) 1998-08-19

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