DE69926137D1 - Verfahren und vorrichtung zur befestigung eines bauelementes - Google Patents

Verfahren und vorrichtung zur befestigung eines bauelementes

Info

Publication number
DE69926137D1
DE69926137D1 DE69926137T DE69926137T DE69926137D1 DE 69926137 D1 DE69926137 D1 DE 69926137D1 DE 69926137 T DE69926137 T DE 69926137T DE 69926137 T DE69926137 T DE 69926137T DE 69926137 D1 DE69926137 D1 DE 69926137D1
Authority
DE
Germany
Prior art keywords
fixing
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69926137T
Other languages
English (en)
Other versions
DE69926137T2 (de
Inventor
Nobuya Matsumura
Shoji Sato
Akihiro Yamamoto
Yoshifumi Kitayama
Yoichi Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Application granted granted Critical
Publication of DE69926137D1 publication Critical patent/DE69926137D1/de
Publication of DE69926137T2 publication Critical patent/DE69926137T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1712—Indefinite or running length work
    • Y10T156/1734—Means bringing articles into association with web
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5193—Electrical connector or terminal
DE69926137T 1998-10-27 1999-10-18 Verfahren und vorrichtung zur befestigung eines bauelementes Expired - Fee Related DE69926137T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP30488398 1998-10-27
JP30488398A JP3838797B2 (ja) 1998-10-27 1998-10-27 部品の貼り着け方法とその装置
PCT/JP1999/005737 WO2000025349A1 (en) 1998-10-27 1999-10-18 Component affixing method and apparatus

Publications (2)

Publication Number Publication Date
DE69926137D1 true DE69926137D1 (de) 2005-08-18
DE69926137T2 DE69926137T2 (de) 2006-04-20

Family

ID=17938433

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69926137T Expired - Fee Related DE69926137T2 (de) 1998-10-27 1999-10-18 Verfahren und vorrichtung zur befestigung eines bauelementes

Country Status (7)

Country Link
US (1) US6370750B1 (de)
EP (1) EP1125316B8 (de)
JP (1) JP3838797B2 (de)
KR (1) KR100606513B1 (de)
CN (1) CN1155052C (de)
DE (1) DE69926137T2 (de)
WO (1) WO2000025349A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040217472A1 (en) * 2001-02-16 2004-11-04 Integral Technologies, Inc. Low cost chip carrier with integrated antenna, heat sink, or EMI shielding functions manufactured from conductive loaded resin-based materials
US7220095B2 (en) * 2001-05-24 2007-05-22 Lyndaker David W Self-threading component tape feeder
JP2005511426A (ja) * 2001-12-05 2005-04-28 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 電子部品包装方法及び装置、並びに同方法で包装した電子部品
DE10159976A1 (de) * 2001-12-06 2003-08-14 Michael Geringer Vorrichtung zum Handhaben von Bauelementen mit kleinen Abmessungen
DE10215083C1 (de) * 2002-04-05 2003-12-04 Infineon Technologies Ag Verfahren zum Vereinzeln von Halbleiterchips von einem Wafer und zum Handhaben vereinzelter Halbleiterchips
US7023347B2 (en) * 2002-08-02 2006-04-04 Symbol Technologies, Inc. Method and system for forming a die frame and for transferring dies therewith
JP2004200386A (ja) * 2002-12-18 2004-07-15 Matsushita Electric Ind Co Ltd 部品実装機の配線配管装置
JP2004241595A (ja) * 2003-02-06 2004-08-26 Matsushita Electric Ind Co Ltd 部品実装機
EP1642325A2 (de) * 2003-06-12 2006-04-05 Symbol Technologies, Inc. Verfahren und system für hochvolumigen transfer von chips zu substraten
US20060225273A1 (en) * 2005-03-29 2006-10-12 Symbol Technologies, Inc. Transferring die(s) from an intermediate surface to a substrate
US20070107186A1 (en) * 2005-11-04 2007-05-17 Symbol Technologies, Inc. Method and system for high volume transfer of dies to substrates
KR100825491B1 (ko) * 2006-09-04 2008-04-25 (주)코스탯아이앤씨 다열 포켓을 갖는 캐리어 테이프
JP6151925B2 (ja) * 2013-02-06 2017-06-21 ヤマハ発動機株式会社 基板固定装置、基板作業装置および基板固定方法
TWI575674B (zh) * 2014-12-19 2017-03-21 Youngtek Electronics Corp Stacked wafer bonding process
US20190026613A1 (en) * 2017-07-18 2019-01-24 Norman E. O'Shea Systems and methods for automated assembly of dynamic magnetic stripe communications devices
WO2019118244A1 (en) * 2017-12-11 2019-06-20 Delphon Industries, Llc Carrier for reversibly immobilizing one or more objects
CN110707024A (zh) * 2019-09-20 2020-01-17 深圳市矽电半导体设备有限公司 一种芯粒分选方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59152639A (ja) * 1983-02-21 1984-08-31 Nec Home Electronics Ltd 半導体ウエ−ハ仮固着方法
JPS60236242A (ja) * 1984-05-10 1985-11-25 Yamagata Nippon Denki Kk 粘着テ−プ張り付け方法
US4714511A (en) * 1985-02-07 1987-12-22 Fujitsu Limited Method and apparatus for adhering a tape or sheet to a semiconductor wafer
JPH0725463B2 (ja) * 1986-07-02 1995-03-22 富士通株式会社 半導体装置の製造方法
JPS6417903U (de) * 1987-07-23 1989-01-30
JP2925758B2 (ja) * 1991-01-14 1999-07-28 古河電気工業株式会社 半導体ウェーハ用テープ貼着装置
US5448450A (en) * 1991-08-15 1995-09-05 Staktek Corporation Lead-on-chip integrated circuit apparatus
JPH05299425A (ja) * 1992-04-24 1993-11-12 Nec Kansai Ltd ボールバンプボンダ
JP3123263B2 (ja) * 1992-11-17 2001-01-09 松下電器産業株式会社 導電膜の貼着状態の良否判定方法
KR0163366B1 (ko) * 1993-11-26 1999-02-01 오쿠라 고이치 펠레트 본딩장치
US6022443A (en) * 1994-01-25 2000-02-08 Kimberly-Clark Worldwide, Inc. Method and apparatus for placing discrete parts onto a moving web
US6007654A (en) * 1996-12-31 1999-12-28 Texas Instruments Incorporated Noncontact method of adhering a wafer to a wafer tape
JPH10218107A (ja) * 1997-02-06 1998-08-18 Denso Corp 部品を接着テープに貼付けるテープ貼付け方法
JP3673051B2 (ja) * 1997-02-28 2005-07-20 松下電器産業株式会社 バンプ形成方法及びバンプボンダー
JP4322328B2 (ja) * 1997-06-05 2009-08-26 テキサス インスツルメンツ インコーポレイテツド ウエハをウエハテープに接着する方法および装置
US5908114A (en) * 1997-09-09 1999-06-01 Gelpak, Llc Tape carrier for electronic and electrical parts
JP2000124385A (ja) * 1998-10-21 2000-04-28 Toppan Printing Co Ltd リードフレーム及びその製造方法

Also Published As

Publication number Publication date
EP1125316A1 (de) 2001-08-22
JP3838797B2 (ja) 2006-10-25
JP2000133659A (ja) 2000-05-12
US6370750B1 (en) 2002-04-16
KR100606513B1 (ko) 2006-07-31
DE69926137T2 (de) 2006-04-20
WO2000025349A1 (en) 2000-05-04
EP1125316B8 (de) 2005-09-07
KR20010083925A (ko) 2001-09-03
CN1155052C (zh) 2004-06-23
CN1325539A (zh) 2001-12-05
EP1125316B1 (de) 2005-07-13

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD., KADOMA,

8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8339 Ceased/non-payment of the annual fee