DE69727113D1 - Vorrichtung und Verfahren zum Reinigen - Google Patents

Vorrichtung und Verfahren zum Reinigen

Info

Publication number
DE69727113D1
DE69727113D1 DE69727113T DE69727113T DE69727113D1 DE 69727113 D1 DE69727113 D1 DE 69727113D1 DE 69727113 T DE69727113 T DE 69727113T DE 69727113 T DE69727113 T DE 69727113T DE 69727113 D1 DE69727113 D1 DE 69727113D1
Authority
DE
Germany
Prior art keywords
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69727113T
Other languages
English (en)
Other versions
DE69727113T2 (de
Inventor
Shigeyoshi Netsu
Yasuysuki Harada
Kazuhiko Shiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pre Tech Co Ltd
Original Assignee
Pre Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pre Tech Co Ltd filed Critical Pre Tech Co Ltd
Publication of DE69727113D1 publication Critical patent/DE69727113D1/de
Application granted granted Critical
Publication of DE69727113T2 publication Critical patent/DE69727113T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B23/00—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture
    • G11B23/50—Reconditioning of record carriers; Cleaning of record carriers ; Carrying-off electrostatic charges
    • G11B23/505—Reconditioning of record carriers; Cleaning of record carriers ; Carrying-off electrostatic charges of disk carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/0288—Ultra or megasonic jets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
DE69727113T 1996-10-30 1997-10-30 Vorrichtung und Verfahren zum Reinigen Expired - Lifetime DE69727113T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP28848196 1996-10-30
JP28848196A JP3286539B2 (ja) 1996-10-30 1996-10-30 洗浄装置および洗浄方法

Publications (2)

Publication Number Publication Date
DE69727113D1 true DE69727113D1 (de) 2004-02-12
DE69727113T2 DE69727113T2 (de) 2004-11-18

Family

ID=17730773

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69727113T Expired - Lifetime DE69727113T2 (de) 1996-10-30 1997-10-30 Vorrichtung und Verfahren zum Reinigen

Country Status (8)

Country Link
US (1) US6003527A (de)
EP (1) EP0839586B1 (de)
JP (1) JP3286539B2 (de)
KR (1) KR100311180B1 (de)
CN (1) CN1084525C (de)
DE (1) DE69727113T2 (de)
MY (1) MY123121A (de)
TW (1) TW379147B (de)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7163588B2 (en) * 1997-05-09 2007-01-16 Semitool, Inc. Processing a workpiece using water, a base, and ozone
US20050194356A1 (en) * 1997-05-09 2005-09-08 Semitool, Inc. Removing photoresist from a workpiece using water and ozone and a photoresist penetrating additive
US7416611B2 (en) 1997-05-09 2008-08-26 Semitool, Inc. Process and apparatus for treating a workpiece with gases
US6701941B1 (en) * 1997-05-09 2004-03-09 Semitool, Inc. Method for treating the surface of a workpiece
JP3563605B2 (ja) * 1998-03-16 2004-09-08 東京エレクトロン株式会社 処理装置
US6202658B1 (en) * 1998-11-11 2001-03-20 Applied Materials, Inc. Method and apparatus for cleaning the edge of a thin disc
DE69940611D1 (de) * 1998-12-07 2009-04-30 Yuzo Mori Bearbeitungs-/reinigungsverfahren mit hilfe von hydroxyd-ionen in ultrareinem wasser
JP4127926B2 (ja) * 1999-04-08 2008-07-30 株式会社荏原製作所 ポリッシング方法
TW464970B (en) * 1999-04-21 2001-11-21 Sharp Kk Ultrasonic cleaning device and resist-stripping device
EP1050899B1 (de) * 1999-05-04 2003-12-17 Honda Electronics Co., Ltd. Ultraschallwascheinrichtung
US20010047810A1 (en) * 1999-06-29 2001-12-06 Jeff Farber High rpm megasonic cleaning
US7021319B2 (en) * 2000-06-26 2006-04-04 Applied Materials Inc. Assisted rinsing in a single wafer cleaning process
JP4602524B2 (ja) * 2000-08-25 2010-12-22 株式会社日立国際電気エンジニアリング 噴射形超音波洗浄装置
US7479205B2 (en) * 2000-09-22 2009-01-20 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
US6951221B2 (en) * 2000-09-22 2005-10-04 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
WO2002101798A2 (en) * 2001-06-12 2002-12-19 Verteq, Inc. Method of applying liquid to a megasonic apparatus for improved cleaning control
US6706641B2 (en) * 2001-09-13 2004-03-16 Micell Technologies, Inc. Spray member and method for using the same
US6890388B2 (en) * 2002-01-07 2005-05-10 International Business Machines Corporation Apparatus and method for using an acoustic-jet for cleaning hard disk drive heads in manufacturing
US7077916B2 (en) * 2002-03-11 2006-07-18 Matsushita Electric Industrial Co., Ltd. Substrate cleaning method and cleaning apparatus
US6861321B2 (en) * 2002-04-05 2005-03-01 Asm America, Inc. Method of loading a wafer onto a wafer holder to reduce thermal shock
US7022193B2 (en) * 2002-10-29 2006-04-04 In Kwon Jeong Apparatus and method for treating surfaces of semiconductor wafers using ozone
JP4428014B2 (ja) * 2003-02-25 2010-03-10 パナソニック電工株式会社 超音波生体洗浄装置
TW200419687A (en) * 2003-03-31 2004-10-01 Powerchip Semiconductor Corp Ion sampling system for wafer and method thereof
US20040256595A1 (en) * 2003-06-16 2004-12-23 Seagate Technology Llc Formulation of grinding coolant
US20050034742A1 (en) * 2003-08-11 2005-02-17 Kaijo Corporation Cleaning method and cleaning apparatus
US20050176252A1 (en) * 2004-02-10 2005-08-11 Goodman Matthew G. Two-stage load for processing both sides of a wafer
US7306681B2 (en) * 2004-05-12 2007-12-11 United Microelectronics Corp. Method of cleaning a semiconductor substrate
WO2006007639A1 (en) * 2004-07-16 2006-01-26 Soniclean Pty Ltd An improved apparatus and method for cleaning using a combination of electrolysis and ultrasonics
US7208095B2 (en) * 2004-12-15 2007-04-24 Infineon Technologies Ag Method for fabricating bottom electrodes of stacked capacitor memory cells and method for cleaning and drying a semiconductor wafer
KR100693252B1 (ko) * 2005-04-13 2007-03-13 삼성전자주식회사 기판 처리 장치, 기판 세정 장치 및 방법
KR100699340B1 (ko) * 2005-07-21 2007-03-26 한국서부발전 주식회사 이온교환수지 재생탱크에서 역세수 배출이 용이한 가변형가지관을 가진 역세관
EP2428557A1 (de) * 2005-12-30 2012-03-14 LAM Research Corporation Reinigungslösung
JP2007317790A (ja) * 2006-05-24 2007-12-06 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
DE202006020339U1 (de) * 2006-12-15 2008-04-10 Rena Sondermaschinen Gmbh Vorrichtung zum Reinigen von Gegenständen, insbesondere von dünnen Scheiben
GB2472998A (en) * 2009-08-26 2011-03-02 Univ Southampton Cleaning using acoustic energy and gas bubbles
CN102348331B (zh) * 2010-08-05 2013-10-02 宏恒胜电子科技（淮安）有限公司 电路板制作治具及电路板制作方法
US9293305B2 (en) * 2011-10-31 2016-03-22 Lam Research Corporation Mixed acid cleaning assemblies
JP6093569B2 (ja) * 2012-12-28 2017-03-08 株式会社荏原製作所 基板洗浄装置
JP6363876B2 (ja) * 2014-05-21 2018-07-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
GB2538276B (en) 2015-05-13 2017-05-10 Univ Southampton Cleaning apparatus and method
CN105478412A (zh) * 2015-11-24 2016-04-13 无锡普瑞腾传动机械有限公司 一种超声波清洗机
CN106076980B (zh) * 2016-06-01 2019-07-16 京东方科技集团股份有限公司 一种清洁设备及清洁方法
KR101722371B1 (ko) * 2016-08-05 2017-04-05 피에스테크놀러지(주) 전해연마법을 이용한 공정챔버의 세정방법
TWI675126B (zh) * 2018-02-14 2019-10-21 國立臺灣大學 針對矽晶圓之經製絨的表面上孔洞之擴孔方法
JP7287271B2 (ja) * 2019-12-26 2023-06-06 株式会社Sumco ワークの洗浄装置および洗浄方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4064885A (en) * 1976-10-26 1977-12-27 Branson Ultrasonics Corporation Apparatus for cleaning workpieces by ultrasonic energy
US4132567A (en) * 1977-10-13 1979-01-02 Fsi Corporation Apparatus for and method of cleaning and removing static charges from substrates
US4326553A (en) * 1980-08-28 1982-04-27 Rca Corporation Megasonic jet cleaner apparatus
US4994051A (en) * 1989-12-22 1991-02-19 Leopoldine Walsh External urine catheter for males
US5364512A (en) * 1992-10-15 1994-11-15 Pure The Ionizer Inc. Electrochemical ionization apparatus system for purifying water
JP2859081B2 (ja) * 1993-01-08 1999-02-17 日本電気株式会社 ウェット処理方法及び処理装置
EP0605882B1 (de) * 1993-01-08 1996-12-11 Nec Corporation Verfahren und Vorrichtung zur Nassbehandlung von festen Oberflächen
JPH0786218A (ja) * 1993-09-17 1995-03-31 Dainippon Screen Mfg Co Ltd 基板洗浄装置
US5591334A (en) * 1993-10-19 1997-01-07 Geochto Ltd. Apparatus for generating negative ions
JPH07155709A (ja) * 1993-11-30 1995-06-20 Shimada Phys & Chem Ind Co Ltd 精密洗浄方法及び装置
US5368054A (en) * 1993-12-17 1994-11-29 International Business Machines Corporation Ultrasonic jet semiconductor wafer cleaning apparatus
US5626913A (en) * 1994-03-09 1997-05-06 Tokyo Electron Limited Resist processing method and apparatus
JP2830733B2 (ja) * 1994-03-25 1998-12-02 日本電気株式会社 電解水生成方法および電解水生成機構
JP2832171B2 (ja) * 1995-04-28 1998-12-02 信越半導体株式会社 半導体基板の洗浄装置および洗浄方法

Also Published As

Publication number Publication date
KR19980033351A (ko) 1998-07-25
JPH10128249A (ja) 1998-05-19
EP0839586B1 (de) 2004-01-07
TW379147B (en) 2000-01-11
JP3286539B2 (ja) 2002-05-27
EP0839586A3 (de) 1999-12-08
CN1188326A (zh) 1998-07-22
KR100311180B1 (ko) 2001-12-17
DE69727113T2 (de) 2004-11-18
CN1084525C (zh) 2002-05-08
EP0839586A2 (de) 1998-05-06
US6003527A (en) 1999-12-21
MY123121A (en) 2006-05-31

Similar Documents

Publication Publication Date Title
DE69727113D1 (de) Vorrichtung und Verfahren zum Reinigen
DE69715254D1 (de) Vorrichtung und Verfahren zum Reinigen
DE69630519D1 (de) Vorrichtung und verfahren zum reinigen
DE59505668D1 (de) Verfahren und vorrichtung zum feinstreinigen von oberflächen
DE69927892D1 (de) Vorrichtung und Verfahren zum Reinigen
DE69522617T2 (de) Verfahren und Vorrichtung zum Reinigen von Werkstücken
DE69830681D1 (de) Verfahren und Vorrichtung zum Schmelzblasen
DE69811350D1 (de) Verfahren und vorrichtung zum entfernen von rippen
DE59805644D1 (de) Vorrichtung und verfahren zum halten und durchführen länglicher objekte
DE69633771D1 (de) Verfahren und gerät zum kontaktieren
DE69726240D1 (de) Vorrichtung und Verfahren zum Reinigen von Druckmasken
DE59809009D1 (de) Verfahren und Vorrichtung zum Reinigen von Garnen
DE69818487D1 (de) Vorrichtung und verfahren zum reinigen von zitzen
DE69717824T2 (de) Verfahren und vorrichtung zum software-test
ATE262368T1 (de) Verfahren und vorrichtung zum reinigen von filteroberflächen
DE69424315D1 (de) Vorrichtung und verfahren zum abbilden von bits
DE69924024D1 (de) Verfahren und vorrichtung zum entfernen von gussgraten
DE59703456D1 (de) Vorrichtung und Verfahren zum Schleifen von Garnituren
DE69729779D1 (de) Verfahren und Vorrichtung zum Polieren
DE69515535T2 (de) Verfahren und Vorrichtung zum Bildvergleich
DE69925282D1 (de) Vorrichtung und verfahren zum polieren
DE69821825D1 (de) Vorrichtung und Verfahren zum Sterilisieren
DE69530339T2 (de) Vorrichtung und Verfahren zum Drucken
DE59703590D1 (de) Verfahren und Vorrichtung zum Kommissionieren
DE69810624T2 (de) Verfahren und vorrichtung zum aufräumen von minen

Legal Events

Date Code Title Description
8364 No opposition during term of opposition