DE69635953T2 - VERFAHREN ZUR HERSTELLUNG EINER Ta205 DIELEKTRISCHEN SCHICHT - Google Patents
VERFAHREN ZUR HERSTELLUNG EINER Ta205 DIELEKTRISCHEN SCHICHT Download PDFInfo
- Publication number
- DE69635953T2 DE69635953T2 DE69635953T DE69635953T DE69635953T2 DE 69635953 T2 DE69635953 T2 DE 69635953T2 DE 69635953 T DE69635953 T DE 69635953T DE 69635953 T DE69635953 T DE 69635953T DE 69635953 T2 DE69635953 T2 DE 69635953T2
- Authority
- DE
- Germany
- Prior art keywords
- capacitor
- electrically conductive
- diffusion barrier
- layer
- dielectric layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/682—Capacitors having no potential barriers having dielectrics comprising perovskite structures
- H10D1/684—Capacitors having no potential barriers having dielectrics comprising perovskite structures the dielectrics comprising multiple layers, e.g. comprising buffer layers, seed layers or gradient layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Semiconductor Memories (AREA)
- Semiconductor Integrated Circuits (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
- Inorganic Insulating Materials (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US444853 | 1995-05-19 | ||
| US08/444,853 US5663088A (en) | 1995-05-19 | 1995-05-19 | Method of forming a Ta2 O5 dielectric layer with amorphous diffusion barrier layer and method of forming a capacitor having a Ta2 O5 dielectric layer and amorphous diffusion barrier layer |
| PCT/US1996/007212 WO1996036993A1 (en) | 1995-05-19 | 1996-05-17 | METHOD OF FORMING A Ta2O5 DIELECTRIC LAYER |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69635953D1 DE69635953D1 (de) | 2006-05-11 |
| DE69635953T2 true DE69635953T2 (de) | 2007-02-01 |
Family
ID=23766625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69635953T Expired - Lifetime DE69635953T2 (de) | 1995-05-19 | 1996-05-17 | VERFAHREN ZUR HERSTELLUNG EINER Ta205 DIELEKTRISCHEN SCHICHT |
Country Status (9)
| Country | Link |
|---|---|
| US (4) | US5663088A (enExample) |
| EP (1) | EP0826237B1 (enExample) |
| JP (1) | JP4314413B2 (enExample) |
| KR (1) | KR100419921B1 (enExample) |
| AT (1) | ATE321359T1 (enExample) |
| AU (1) | AU5864596A (enExample) |
| DE (1) | DE69635953T2 (enExample) |
| TW (1) | TW293161B (enExample) |
| WO (1) | WO1996036993A1 (enExample) |
Families Citing this family (87)
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| US5665625A (en) | 1995-05-19 | 1997-09-09 | Micron Technology, Inc. | Method of forming capacitors having an amorphous electrically conductive layer |
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| JPH09260600A (ja) * | 1996-03-19 | 1997-10-03 | Sharp Corp | 半導体メモリ素子の製造方法 |
| US6455916B1 (en) * | 1996-04-08 | 2002-09-24 | Micron Technology, Inc. | Integrated circuit devices containing isolated dielectric material |
| US5843830A (en) * | 1996-06-26 | 1998-12-01 | Micron Technology, Inc. | Capacitor, and methods for forming a capacitor |
| US6251720B1 (en) | 1996-09-27 | 2001-06-26 | Randhir P. S. Thakur | High pressure reoxidation/anneal of high dielectric constant materials |
| US6548854B1 (en) * | 1997-12-22 | 2003-04-15 | Agere Systems Inc. | Compound, high-K, gate and capacitor insulator layer |
| US6075266A (en) * | 1997-01-09 | 2000-06-13 | Kabushiki Kaisha Toshiba | Semiconductor device having MIS transistors and capacitor |
| JPH10247723A (ja) * | 1997-03-04 | 1998-09-14 | Oki Electric Ind Co Ltd | 半導体装置のキャパシタの製造方法 |
| US5910880A (en) | 1997-08-20 | 1999-06-08 | Micron Technology, Inc. | Semiconductor circuit components and capacitors |
| JP3445925B2 (ja) * | 1997-10-07 | 2003-09-16 | シャープ株式会社 | 半導体記憶素子の製造方法 |
| US6156647A (en) * | 1997-10-27 | 2000-12-05 | Applied Materials, Inc. | Barrier layer structure which prevents migration of silicon into an adjacent metallic layer and the method of fabrication of the barrier layer |
| US6025228A (en) * | 1997-11-25 | 2000-02-15 | Advanced Micro Devices, Inc. | Method of fabricating an oxynitride-capped high dielectric constant interpolysilicon dielectric structure for a low voltage non-volatile memory |
| KR100285066B1 (ko) * | 1997-12-06 | 2001-04-02 | 윤종용 | 고유전체 물질을 갖는 커패시터의 형성방법 |
| US6165833A (en) * | 1997-12-19 | 2000-12-26 | Micron Technology, Inc. | Semiconductor processing method of forming a capacitor |
| US6911371B2 (en) | 1997-12-19 | 2005-06-28 | Micron Technology, Inc. | Capacitor forming methods with barrier layers to threshold voltage shift inducing material |
| US6682970B1 (en) | 1998-02-27 | 2004-01-27 | Micron Technology, Inc. | Capacitor/antifuse structure having a barrier-layer electrode and improved barrier layer |
| US6150706A (en) * | 1998-02-27 | 2000-11-21 | Micron Technology, Inc. | Capacitor/antifuse structure having a barrier-layer electrode and improved barrier layer |
| US7034353B2 (en) * | 1998-02-27 | 2006-04-25 | Micron Technology, Inc. | Methods for enhancing capacitors having roughened features to increase charge-storage capacity |
| US6162744A (en) * | 1998-02-28 | 2000-12-19 | Micron Technology, Inc. | Method of forming capacitors having high-K oxygen containing capacitor dielectric layers, method of processing high-K oxygen containing dielectric layers, method of forming a DRAM cell having having high-K oxygen containing capacitor dielectric layers |
| US6191443B1 (en) | 1998-02-28 | 2001-02-20 | Micron Technology, Inc. | Capacitors, methods of forming capacitors, and DRAM memory cells |
| US6111285A (en) | 1998-03-17 | 2000-08-29 | Micron Technology, Inc. | Boride electrodes and barriers for cell dielectrics |
| US6730559B2 (en) * | 1998-04-10 | 2004-05-04 | Micron Technology, Inc. | Capacitors and methods of forming capacitors |
| US6156638A (en) * | 1998-04-10 | 2000-12-05 | Micron Technology, Inc. | Integrated circuitry and method of restricting diffusion from one material to another |
| US6165834A (en) * | 1998-05-07 | 2000-12-26 | Micron Technology, Inc. | Method of forming capacitors, method of processing dielectric layers, method of forming a DRAM cell |
| US6255186B1 (en) | 1998-05-21 | 2001-07-03 | Micron Technology, Inc. | Methods of forming integrated circuitry and capacitors having a capacitor electrode having a base and a pair of walls projecting upwardly therefrom |
| US6331811B2 (en) * | 1998-06-12 | 2001-12-18 | Nec Corporation | Thin-film resistor, wiring substrate, and method for manufacturing the same |
| KR100290895B1 (ko) * | 1998-06-30 | 2001-07-12 | 김영환 | 반도체 소자의 커패시터 구조 및 이의 제조 방법 |
| JP4030193B2 (ja) | 1998-07-16 | 2008-01-09 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP3592535B2 (ja) * | 1998-07-16 | 2004-11-24 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6271131B1 (en) | 1998-08-26 | 2001-08-07 | Micron Technology, Inc. | Methods for forming rhodium-containing layers such as platinum-rhodium barrier layers |
| US6284655B1 (en) | 1998-09-03 | 2001-09-04 | Micron Technology, Inc. | Method for producing low carbon/oxygen conductive layers |
| US6239028B1 (en) | 1998-09-03 | 2001-05-29 | Micron Technology, Inc. | Methods for forming iridium-containing films on substrates |
| US6323081B1 (en) | 1998-09-03 | 2001-11-27 | Micron Technology, Inc. | Diffusion barrier layers and methods of forming same |
| DE19842704C2 (de) | 1998-09-17 | 2002-03-28 | Infineon Technologies Ag | Herstellverfahren für einen Kondensator mit einem Hoch-epsilon-Dielektrikum oder einem Ferroelektrikum nach dem Fin-Stack-Prinzip unter Einsatz einer Negativform |
| US6204203B1 (en) * | 1998-10-14 | 2001-03-20 | Applied Materials, Inc. | Post deposition treatment of dielectric films for interface control |
| US6177305B1 (en) | 1998-12-17 | 2001-01-23 | Lsi Logic Corporation | Fabrication of metal-insulator-metal capacitive structures |
| KR100293713B1 (ko) * | 1998-12-22 | 2001-07-12 | 박종섭 | 메모리소자의 커패시터 제조방법 |
| US6235594B1 (en) * | 1999-01-13 | 2001-05-22 | Agere Systems Guardian Corp. | Methods of fabricating an integrated circuit device with composite oxide dielectric |
| US6290822B1 (en) | 1999-01-26 | 2001-09-18 | Agere Systems Guardian Corp. | Sputtering method for forming dielectric films |
| US6387748B1 (en) * | 1999-02-16 | 2002-05-14 | Micron Technology, Inc. | Semiconductor circuit constructions, capacitor constructions, and methods of forming semiconductor circuit constructions and capacitor constructions |
| US6445023B1 (en) * | 1999-03-16 | 2002-09-03 | Micron Technology, Inc. | Mixed metal nitride and boride barrier layers |
| US6417041B1 (en) * | 1999-03-26 | 2002-07-09 | Advanced Micro Devices, Inc. | Method for fabricating high permitivity dielectric stacks having low buffer oxide |
| JP3473485B2 (ja) * | 1999-04-08 | 2003-12-02 | 日本電気株式会社 | 薄膜抵抗体およびその製造方法 |
| US7022623B2 (en) | 1999-04-22 | 2006-04-04 | Micron Technology, Inc. | Method of fabricating a semiconductor device with a dielectric film using a wet oxidation with steam process |
| US6329286B1 (en) | 1999-04-27 | 2001-12-11 | Micron Technology, Inc. | Methods for forming conformal iridium layers on substrates |
| US6208009B1 (en) | 1999-04-30 | 2001-03-27 | Digital Devices, Inc. | RC-networks in semiconductor devices and method therefor |
| US6281142B1 (en) | 1999-06-04 | 2001-08-28 | Micron Technology, Inc. | Dielectric cure for reducing oxygen vacancies |
| US6046081A (en) * | 1999-06-10 | 2000-04-04 | United Microelectronics Corp. | Method for forming dielectric layer of capacitor |
| KR100335775B1 (ko) * | 1999-06-25 | 2002-05-09 | 박종섭 | 반도체 소자의 캐패시터 제조 방법 |
| US6465828B2 (en) | 1999-07-30 | 2002-10-15 | Micron Technology, Inc. | Semiconductor container structure with diffusion barrier |
| WO2001024237A1 (en) * | 1999-09-28 | 2001-04-05 | Symetrix Corporation | Integrated circuits with barrier layers and methods of fabricating same |
| US6475854B2 (en) | 1999-12-30 | 2002-11-05 | Applied Materials, Inc. | Method of forming metal electrodes |
| US6417537B1 (en) | 2000-01-18 | 2002-07-09 | Micron Technology, Inc. | Metal oxynitride capacitor barrier layer |
| US7005695B1 (en) | 2000-02-23 | 2006-02-28 | Micron Technology, Inc. | Integrated circuitry including a capacitor with an amorphous and a crystalline high K capacitor dielectric region |
| JP3437832B2 (ja) * | 2000-03-22 | 2003-08-18 | 東京エレクトロン株式会社 | 成膜方法及び成膜装置 |
| US6476432B1 (en) | 2000-03-23 | 2002-11-05 | Micron Technology, Inc. | Structures and methods for enhancing capacitors in integrated circuits |
| US6507063B2 (en) | 2000-04-17 | 2003-01-14 | International Business Machines Corporation | Poly-poly/MOS capacitor having a gate encapsulating first electrode layer |
| US6579783B2 (en) | 2000-07-07 | 2003-06-17 | Applied Materials, Inc. | Method for high temperature metal deposition for reducing lateral silicidation |
| US6825522B1 (en) * | 2000-07-13 | 2004-11-30 | Micron Technology, Inc. | Capacitor electrode having an interface layer of different chemical composition formed on a bulk layer |
| US6461931B1 (en) | 2000-08-29 | 2002-10-08 | Micron Technology, Inc. | Thin dielectric films for DRAM storage capacitors |
| US6521544B1 (en) | 2000-08-31 | 2003-02-18 | Micron Technology, Inc. | Method of forming an ultra thin dielectric film |
| US6410968B1 (en) | 2000-08-31 | 2002-06-25 | Micron Technology, Inc. | Semiconductor device with barrier layer |
| US6660631B1 (en) * | 2000-08-31 | 2003-12-09 | Micron Technology, Inc. | Devices containing platinum-iridium films and methods of preparing such films and devices |
| US6576964B1 (en) | 2000-08-31 | 2003-06-10 | Micron Technology, Inc. | Dielectric layer for a semiconductor device having less current leakage and increased capacitance |
| US6682969B1 (en) * | 2000-08-31 | 2004-01-27 | Micron Technology, Inc. | Top electrode in a strongly oxidizing environment |
| US6373087B1 (en) * | 2000-08-31 | 2002-04-16 | Agere Systems Guardian Corp. | Methods of fabricating a metal-oxide-metal capacitor and associated apparatuses |
| US7378719B2 (en) * | 2000-12-20 | 2008-05-27 | Micron Technology, Inc. | Low leakage MIM capacitor |
| US6495428B1 (en) | 2001-07-11 | 2002-12-17 | Micron Technology, Inc. | Method of making a capacitor with oxygenated metal electrodes and high dielectric constant materials |
| US7037730B2 (en) * | 2001-07-11 | 2006-05-02 | Micron Technology, Inc. | Capacitor with high dielectric constant materials and method of making |
| US6727140B2 (en) * | 2001-07-11 | 2004-04-27 | Micron Technology, Inc. | Capacitor with high dielectric constant materials and method of making |
| US20090004850A1 (en) | 2001-07-25 | 2009-01-01 | Seshadri Ganguli | Process for forming cobalt and cobalt silicide materials in tungsten contact applications |
| US20030029715A1 (en) | 2001-07-25 | 2003-02-13 | Applied Materials, Inc. | An Apparatus For Annealing Substrates In Physical Vapor Deposition Systems |
| US8110489B2 (en) | 2001-07-25 | 2012-02-07 | Applied Materials, Inc. | Process for forming cobalt-containing materials |
| US9051641B2 (en) | 2001-07-25 | 2015-06-09 | Applied Materials, Inc. | Cobalt deposition on barrier surfaces |
| JP2005504885A (ja) | 2001-07-25 | 2005-02-17 | アプライド マテリアルズ インコーポレイテッド | 新規なスパッタ堆積方法を使用したバリア形成 |
| US7129128B2 (en) * | 2001-08-29 | 2006-10-31 | Micron Technology, Inc. | Method of improved high K dielectric-polysilicon interface for CMOS devices |
| EP1351321B1 (en) * | 2002-04-01 | 2013-12-25 | Konica Corporation | Support and organic electroluminescence element comprising the support |
| DE10216614B4 (de) * | 2002-04-15 | 2004-06-17 | Infineon Technologies Ag | Verfahren zur Verstärkung einer dielektrischen Schicht auf einem Halbleitersubstrat an Fehlstellen und Anordnung mit einer verstärkten dielektrischen Schicht |
| KR100465631B1 (ko) * | 2002-12-11 | 2005-01-13 | 주식회사 하이닉스반도체 | 반도체 소자의 캐패시터 형성방법 |
| US7385954B2 (en) * | 2003-07-16 | 2008-06-10 | Lucent Technologies Inc. | Method of transmitting or retransmitting packets in a communication system |
| US7256980B2 (en) * | 2003-12-30 | 2007-08-14 | Du Pont | Thin film capacitors on ceramic |
| DE112005003768A5 (de) * | 2005-12-09 | 2009-02-19 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Dünnfilmwiderstand mit Schichtstruktur und Verfahren zur Herstllunng eines Dünnfilmwiderstands mit Schichtstruktur |
| TWI274379B (en) * | 2005-12-26 | 2007-02-21 | Ind Tech Res Inst | MIM capacitor structure and method of manufacturing the same |
| KR20100084677A (ko) * | 2008-01-18 | 2010-07-27 | 도쿄엘렉트론가부시키가이샤 | 커패시터, 반도체 장치 및, 이들의 제작 방법 |
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|---|---|---|---|---|
| KR920009916B1 (ko) * | 1984-08-27 | 1992-11-06 | 아메리칸 텔리폰 앤드 텔레그라프 캄파니 | 직접 회로 소자용 확산 장벽층 및 그 형성 방법 |
| EP0205137A3 (en) * | 1985-06-14 | 1987-11-04 | E.I. Du Pont De Nemours And Company | Dielectric compositions |
| JP2633584B2 (ja) * | 1987-10-06 | 1997-07-23 | 株式会社東芝 | 半導体装置及びその製造方法 |
| JPH01222469A (ja) * | 1988-03-01 | 1989-09-05 | Fujitsu Ltd | 半導体記憶装置とその製造方法 |
| JPH03157965A (ja) * | 1989-11-15 | 1991-07-05 | Nec Corp | 半導体装置 |
| US5057447A (en) * | 1990-07-09 | 1991-10-15 | Texas Instruments Incorporated | Silicide/metal floating gate process |
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-
1995
- 1995-05-19 US US08/444,853 patent/US5663088A/en not_active Expired - Lifetime
-
1996
- 1996-05-17 AU AU58645/96A patent/AU5864596A/en not_active Abandoned
- 1996-05-17 JP JP53511196A patent/JP4314413B2/ja not_active Expired - Fee Related
- 1996-05-17 EP EP96920294A patent/EP0826237B1/en not_active Expired - Lifetime
- 1996-05-17 WO PCT/US1996/007212 patent/WO1996036993A1/en not_active Ceased
- 1996-05-17 DE DE69635953T patent/DE69635953T2/de not_active Expired - Lifetime
- 1996-05-17 KR KR1019970708189A patent/KR100419921B1/ko not_active Expired - Fee Related
- 1996-05-17 AT AT96920294T patent/ATE321359T1/de not_active IP Right Cessation
- 1996-05-18 TW TW085105915A patent/TW293161B/zh not_active IP Right Cessation
- 1996-06-11 US US08/664,305 patent/US5814852A/en not_active Expired - Lifetime
-
1997
- 1997-06-24 US US08/881,561 patent/US6017789A/en not_active Expired - Fee Related
-
1998
- 1998-05-28 US US09/086,389 patent/US6198124B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US6198124B1 (en) | 2001-03-06 |
| WO1996036993A1 (en) | 1996-11-21 |
| KR19990014845A (ko) | 1999-02-25 |
| TW293161B (enExample) | 1996-12-11 |
| JPH11509684A (ja) | 1999-08-24 |
| ATE321359T1 (de) | 2006-04-15 |
| JP4314413B2 (ja) | 2009-08-19 |
| AU5864596A (en) | 1996-11-29 |
| DE69635953D1 (de) | 2006-05-11 |
| US5663088A (en) | 1997-09-02 |
| EP0826237B1 (en) | 2006-03-22 |
| EP0826237A4 (en) | 1998-09-23 |
| US5814852A (en) | 1998-09-29 |
| KR100419921B1 (ko) | 2004-05-20 |
| US6017789A (en) | 2000-01-25 |
| EP0826237A1 (en) | 1998-03-04 |
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