KR100419921B1 - Ta205유전층형성방법 - Google Patents

Ta205유전층형성방법 Download PDF

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Publication number
KR100419921B1
KR100419921B1 KR1019970708189A KR19970708189A KR100419921B1 KR 100419921 B1 KR100419921 B1 KR 100419921B1 KR 1019970708189 A KR1019970708189 A KR 1019970708189A KR 19970708189 A KR19970708189 A KR 19970708189A KR 100419921 B1 KR100419921 B1 KR 100419921B1
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South Korea
Prior art keywords
diffusion barrier
barrier layer
electrically conductive
amorphous diffusion
tic
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Expired - Fee Related
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KR1019970708189A
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English (en)
Korean (ko)
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KR19990014845A (ko
Inventor
구르테 에스. 샌드후
피에르 씨. 파잔
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마이크론 테크놀로지, 인크.
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/682—Capacitors having no potential barriers having dielectrics comprising perovskite structures
    • H10D1/684—Capacitors having no potential barriers having dielectrics comprising perovskite structures the dielectrics comprising multiple layers, e.g. comprising buffer layers, seed layers or gradient layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Semiconductor Memories (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Chemical Vapour Deposition (AREA)
  • Formation Of Insulating Films (AREA)
  • Inorganic Insulating Materials (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
KR1019970708189A 1995-05-19 1996-05-17 Ta205유전층형성방법 Expired - Fee Related KR100419921B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/444853 1995-05-19
US08/444,853 US5663088A (en) 1995-05-19 1995-05-19 Method of forming a Ta2 O5 dielectric layer with amorphous diffusion barrier layer and method of forming a capacitor having a Ta2 O5 dielectric layer and amorphous diffusion barrier layer
US8/444,853 1995-05-19

Publications (2)

Publication Number Publication Date
KR19990014845A KR19990014845A (ko) 1999-02-25
KR100419921B1 true KR100419921B1 (ko) 2004-05-20

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KR1019970708189A Expired - Fee Related KR100419921B1 (ko) 1995-05-19 1996-05-17 Ta205유전층형성방법

Country Status (9)

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US (4) US5663088A (enExample)
EP (1) EP0826237B1 (enExample)
JP (1) JP4314413B2 (enExample)
KR (1) KR100419921B1 (enExample)
AT (1) ATE321359T1 (enExample)
AU (1) AU5864596A (enExample)
DE (1) DE69635953T2 (enExample)
TW (1) TW293161B (enExample)
WO (1) WO1996036993A1 (enExample)

Families Citing this family (87)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5665625A (en) * 1995-05-19 1997-09-09 Micron Technology, Inc. Method of forming capacitors having an amorphous electrically conductive layer
US5786248A (en) * 1995-10-12 1998-07-28 Micron Technology, Inc. Semiconductor processing method of forming a tantalum oxide containing capacitor
KR100189982B1 (ko) * 1995-11-29 1999-06-01 윤종용 고유전체 캐패시터의 제조방법
US5754390A (en) 1996-01-23 1998-05-19 Micron Technology, Inc. Integrated capacitor bottom electrode for use with conformal dielectric
JPH09260600A (ja) * 1996-03-19 1997-10-03 Sharp Corp 半導体メモリ素子の製造方法
US6455916B1 (en) * 1996-04-08 2002-09-24 Micron Technology, Inc. Integrated circuit devices containing isolated dielectric material
US5843830A (en) 1996-06-26 1998-12-01 Micron Technology, Inc. Capacitor, and methods for forming a capacitor
US6251720B1 (en) 1996-09-27 2001-06-26 Randhir P. S. Thakur High pressure reoxidation/anneal of high dielectric constant materials
US6548854B1 (en) * 1997-12-22 2003-04-15 Agere Systems Inc. Compound, high-K, gate and capacitor insulator layer
US6075266A (en) * 1997-01-09 2000-06-13 Kabushiki Kaisha Toshiba Semiconductor device having MIS transistors and capacitor
JPH10247723A (ja) * 1997-03-04 1998-09-14 Oki Electric Ind Co Ltd 半導体装置のキャパシタの製造方法
US5910880A (en) 1997-08-20 1999-06-08 Micron Technology, Inc. Semiconductor circuit components and capacitors
JP3445925B2 (ja) * 1997-10-07 2003-09-16 シャープ株式会社 半導体記憶素子の製造方法
US6156647A (en) * 1997-10-27 2000-12-05 Applied Materials, Inc. Barrier layer structure which prevents migration of silicon into an adjacent metallic layer and the method of fabrication of the barrier layer
US6025228A (en) * 1997-11-25 2000-02-15 Advanced Micro Devices, Inc. Method of fabricating an oxynitride-capped high dielectric constant interpolysilicon dielectric structure for a low voltage non-volatile memory
TW396610B (en) * 1997-12-06 2000-07-01 Samsung Electronics Co Ltd A capacitor formed by high dielectric constant stuff
US6911371B2 (en) 1997-12-19 2005-06-28 Micron Technology, Inc. Capacitor forming methods with barrier layers to threshold voltage shift inducing material
US6165833A (en) * 1997-12-19 2000-12-26 Micron Technology, Inc. Semiconductor processing method of forming a capacitor
US7034353B2 (en) * 1998-02-27 2006-04-25 Micron Technology, Inc. Methods for enhancing capacitors having roughened features to increase charge-storage capacity
US6150706A (en) 1998-02-27 2000-11-21 Micron Technology, Inc. Capacitor/antifuse structure having a barrier-layer electrode and improved barrier layer
US6682970B1 (en) 1998-02-27 2004-01-27 Micron Technology, Inc. Capacitor/antifuse structure having a barrier-layer electrode and improved barrier layer
US6162744A (en) * 1998-02-28 2000-12-19 Micron Technology, Inc. Method of forming capacitors having high-K oxygen containing capacitor dielectric layers, method of processing high-K oxygen containing dielectric layers, method of forming a DRAM cell having having high-K oxygen containing capacitor dielectric layers
US6191443B1 (en) 1998-02-28 2001-02-20 Micron Technology, Inc. Capacitors, methods of forming capacitors, and DRAM memory cells
US6111285A (en) * 1998-03-17 2000-08-29 Micron Technology, Inc. Boride electrodes and barriers for cell dielectrics
US6730559B2 (en) 1998-04-10 2004-05-04 Micron Technology, Inc. Capacitors and methods of forming capacitors
US6156638A (en) * 1998-04-10 2000-12-05 Micron Technology, Inc. Integrated circuitry and method of restricting diffusion from one material to another
US6165834A (en) * 1998-05-07 2000-12-26 Micron Technology, Inc. Method of forming capacitors, method of processing dielectric layers, method of forming a DRAM cell
US6255186B1 (en) 1998-05-21 2001-07-03 Micron Technology, Inc. Methods of forming integrated circuitry and capacitors having a capacitor electrode having a base and a pair of walls projecting upwardly therefrom
US6331811B2 (en) * 1998-06-12 2001-12-18 Nec Corporation Thin-film resistor, wiring substrate, and method for manufacturing the same
KR100290895B1 (ko) * 1998-06-30 2001-07-12 김영환 반도체 소자의 커패시터 구조 및 이의 제조 방법
JP4030193B2 (ja) 1998-07-16 2008-01-09 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP3592535B2 (ja) 1998-07-16 2004-11-24 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6271131B1 (en) 1998-08-26 2001-08-07 Micron Technology, Inc. Methods for forming rhodium-containing layers such as platinum-rhodium barrier layers
US6323081B1 (en) 1998-09-03 2001-11-27 Micron Technology, Inc. Diffusion barrier layers and methods of forming same
US6284655B1 (en) 1998-09-03 2001-09-04 Micron Technology, Inc. Method for producing low carbon/oxygen conductive layers
US6239028B1 (en) 1998-09-03 2001-05-29 Micron Technology, Inc. Methods for forming iridium-containing films on substrates
DE19842704C2 (de) * 1998-09-17 2002-03-28 Infineon Technologies Ag Herstellverfahren für einen Kondensator mit einem Hoch-epsilon-Dielektrikum oder einem Ferroelektrikum nach dem Fin-Stack-Prinzip unter Einsatz einer Negativform
US6204203B1 (en) * 1998-10-14 2001-03-20 Applied Materials, Inc. Post deposition treatment of dielectric films for interface control
US6177305B1 (en) 1998-12-17 2001-01-23 Lsi Logic Corporation Fabrication of metal-insulator-metal capacitive structures
KR100293713B1 (ko) * 1998-12-22 2001-07-12 박종섭 메모리소자의 커패시터 제조방법
US6235594B1 (en) * 1999-01-13 2001-05-22 Agere Systems Guardian Corp. Methods of fabricating an integrated circuit device with composite oxide dielectric
US6290822B1 (en) 1999-01-26 2001-09-18 Agere Systems Guardian Corp. Sputtering method for forming dielectric films
US6387748B1 (en) * 1999-02-16 2002-05-14 Micron Technology, Inc. Semiconductor circuit constructions, capacitor constructions, and methods of forming semiconductor circuit constructions and capacitor constructions
US6445023B1 (en) 1999-03-16 2002-09-03 Micron Technology, Inc. Mixed metal nitride and boride barrier layers
US6417041B1 (en) * 1999-03-26 2002-07-09 Advanced Micro Devices, Inc. Method for fabricating high permitivity dielectric stacks having low buffer oxide
JP3473485B2 (ja) * 1999-04-08 2003-12-02 日本電気株式会社 薄膜抵抗体およびその製造方法
US7022623B2 (en) 1999-04-22 2006-04-04 Micron Technology, Inc. Method of fabricating a semiconductor device with a dielectric film using a wet oxidation with steam process
US6329286B1 (en) 1999-04-27 2001-12-11 Micron Technology, Inc. Methods for forming conformal iridium layers on substrates
US6208009B1 (en) 1999-04-30 2001-03-27 Digital Devices, Inc. RC-networks in semiconductor devices and method therefor
US6281142B1 (en) 1999-06-04 2001-08-28 Micron Technology, Inc. Dielectric cure for reducing oxygen vacancies
US6046081A (en) * 1999-06-10 2000-04-04 United Microelectronics Corp. Method for forming dielectric layer of capacitor
KR100335775B1 (ko) * 1999-06-25 2002-05-09 박종섭 반도체 소자의 캐패시터 제조 방법
US6465828B2 (en) 1999-07-30 2002-10-15 Micron Technology, Inc. Semiconductor container structure with diffusion barrier
KR20020035620A (ko) * 1999-09-28 2002-05-11 시메트릭스 코포레이션 배리어층을 갖는 집적회로와 그 제조방법
US6475854B2 (en) 1999-12-30 2002-11-05 Applied Materials, Inc. Method of forming metal electrodes
US6417537B1 (en) 2000-01-18 2002-07-09 Micron Technology, Inc. Metal oxynitride capacitor barrier layer
US7005695B1 (en) 2000-02-23 2006-02-28 Micron Technology, Inc. Integrated circuitry including a capacitor with an amorphous and a crystalline high K capacitor dielectric region
JP3437832B2 (ja) * 2000-03-22 2003-08-18 東京エレクトロン株式会社 成膜方法及び成膜装置
US6476432B1 (en) 2000-03-23 2002-11-05 Micron Technology, Inc. Structures and methods for enhancing capacitors in integrated circuits
US6507063B2 (en) 2000-04-17 2003-01-14 International Business Machines Corporation Poly-poly/MOS capacitor having a gate encapsulating first electrode layer
US6579783B2 (en) 2000-07-07 2003-06-17 Applied Materials, Inc. Method for high temperature metal deposition for reducing lateral silicidation
US6825522B1 (en) * 2000-07-13 2004-11-30 Micron Technology, Inc. Capacitor electrode having an interface layer of different chemical composition formed on a bulk layer
US6461931B1 (en) 2000-08-29 2002-10-08 Micron Technology, Inc. Thin dielectric films for DRAM storage capacitors
US6373087B1 (en) * 2000-08-31 2002-04-16 Agere Systems Guardian Corp. Methods of fabricating a metal-oxide-metal capacitor and associated apparatuses
US6410968B1 (en) * 2000-08-31 2002-06-25 Micron Technology, Inc. Semiconductor device with barrier layer
US6660631B1 (en) * 2000-08-31 2003-12-09 Micron Technology, Inc. Devices containing platinum-iridium films and methods of preparing such films and devices
US6682969B1 (en) * 2000-08-31 2004-01-27 Micron Technology, Inc. Top electrode in a strongly oxidizing environment
US6521544B1 (en) * 2000-08-31 2003-02-18 Micron Technology, Inc. Method of forming an ultra thin dielectric film
US6576964B1 (en) * 2000-08-31 2003-06-10 Micron Technology, Inc. Dielectric layer for a semiconductor device having less current leakage and increased capacitance
US7378719B2 (en) * 2000-12-20 2008-05-27 Micron Technology, Inc. Low leakage MIM capacitor
US6495428B1 (en) 2001-07-11 2002-12-17 Micron Technology, Inc. Method of making a capacitor with oxygenated metal electrodes and high dielectric constant materials
US6727140B2 (en) 2001-07-11 2004-04-27 Micron Technology, Inc. Capacitor with high dielectric constant materials and method of making
US7037730B2 (en) 2001-07-11 2006-05-02 Micron Technology, Inc. Capacitor with high dielectric constant materials and method of making
WO2003030224A2 (en) 2001-07-25 2003-04-10 Applied Materials, Inc. Barrier formation using novel sputter-deposition method
US20090004850A1 (en) 2001-07-25 2009-01-01 Seshadri Ganguli Process for forming cobalt and cobalt silicide materials in tungsten contact applications
US20030029715A1 (en) 2001-07-25 2003-02-13 Applied Materials, Inc. An Apparatus For Annealing Substrates In Physical Vapor Deposition Systems
US9051641B2 (en) 2001-07-25 2015-06-09 Applied Materials, Inc. Cobalt deposition on barrier surfaces
US8110489B2 (en) 2001-07-25 2012-02-07 Applied Materials, Inc. Process for forming cobalt-containing materials
US7129128B2 (en) * 2001-08-29 2006-10-31 Micron Technology, Inc. Method of improved high K dielectric-polysilicon interface for CMOS devices
EP2249413A3 (en) * 2002-04-01 2011-02-02 Konica Corporation Support and organic electroluminescence element comprising the support
DE10216614B4 (de) * 2002-04-15 2004-06-17 Infineon Technologies Ag Verfahren zur Verstärkung einer dielektrischen Schicht auf einem Halbleitersubstrat an Fehlstellen und Anordnung mit einer verstärkten dielektrischen Schicht
KR100465631B1 (ko) * 2002-12-11 2005-01-13 주식회사 하이닉스반도체 반도체 소자의 캐패시터 형성방법
US7385954B2 (en) * 2003-07-16 2008-06-10 Lucent Technologies Inc. Method of transmitting or retransmitting packets in a communication system
US7256980B2 (en) * 2003-12-30 2007-08-14 Du Pont Thin film capacitors on ceramic
WO2007065460A1 (de) * 2005-12-09 2007-06-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Dünnfilmwiderstand mit schichtstruktur und verfahren zur herstellung eines dünnfilmwiderstands mit schichtstruktur
TWI274379B (en) * 2005-12-26 2007-02-21 Ind Tech Res Inst MIM capacitor structure and method of manufacturing the same
WO2009090979A1 (ja) * 2008-01-18 2009-07-23 Tokyo Electron Limited キャパシタ、半導体装置、およびこれらの作製方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR900001479B1 (ko) * 1985-06-14 1990-03-12 이 아이 듀우판 디 네모아 앤드 캄파니 유전성 조성물, 유전성 그린테이프 및 축전기

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH065733B2 (ja) * 1984-08-27 1994-01-19 アメリカン テレフオン アンド テレグラフ カムパニ− 集積回路デバイスおよびその製造方法
JP2633584B2 (ja) * 1987-10-06 1997-07-23 株式会社東芝 半導体装置及びその製造方法
JPH01222469A (ja) * 1988-03-01 1989-09-05 Fujitsu Ltd 半導体記憶装置とその製造方法
JPH03157965A (ja) * 1989-11-15 1991-07-05 Nec Corp 半導体装置
US5057447A (en) * 1990-07-09 1991-10-15 Texas Instruments Incorporated Silicide/metal floating gate process
US5082797A (en) * 1991-01-22 1992-01-21 Micron Technology, Inc. Method of making stacked textured container capacitor
KR920018987A (ko) * 1991-03-23 1992-10-22 김광호 캐패시터의 제조방법
US5234857A (en) * 1991-03-23 1993-08-10 Samsung Electronics, Co., Ltd. Method of making semiconductor device having a capacitor of large capacitance
US5665431A (en) * 1991-09-03 1997-09-09 Valenite Inc. Titanium carbonitride coated stratified substrate and cutting inserts made from the same
US5192589A (en) * 1991-09-05 1993-03-09 Micron Technology, Inc. Low-pressure chemical vapor deposition process for depositing thin titanium nitride films having low and stable resistivity
US5571572A (en) * 1991-09-05 1996-11-05 Micron Technology, Inc. Method of depositing titanium carbonitride films on semiconductor wafers
JP3055242B2 (ja) * 1991-09-19 2000-06-26 日本電気株式会社 半導体装置およびその製造方法
US5142438A (en) * 1991-11-15 1992-08-25 Micron Technology, Inc. Dram cell having a stacked capacitor with a tantalum lower plate, a tantalum oxide dielectric layer, and a silicide buried contact
KR940009628B1 (ko) * 1991-11-16 1994-10-15 삼성전자 주식회사 커패시터 및 그 제조방법
JP2827661B2 (ja) * 1992-02-19 1998-11-25 日本電気株式会社 容量素子及びその製造方法
EP0551117A2 (en) * 1992-01-08 1993-07-14 Mitsubishi Denki Kabushiki Kaisha Large scale integrated circuit device and thin film forming method and apparatus for the same
US5162248A (en) * 1992-03-13 1992-11-10 Micron Technology, Inc. Optimized container stacked capacitor DRAM cell utilizing sacrificial oxide deposition and chemical mechanical polishing
JPH0685187A (ja) * 1992-09-07 1994-03-25 Nec Corp 半導体記憶装置
US5348894A (en) * 1993-01-27 1994-09-20 Texas Instruments Incorporated Method of forming electrical connections to high dielectric constant materials
US5340763A (en) * 1993-02-12 1994-08-23 Micron Semiconductor, Inc. Multi-pin stacked capacitor utilizing micro villus patterning in a container cell and method to fabricate same
US5338700A (en) * 1993-04-14 1994-08-16 Micron Semiconductor, Inc. Method of forming a bit line over capacitor array of memory cells
US5471364A (en) * 1993-03-31 1995-11-28 Texas Instruments Incorporated Electrode interface for high-dielectric-constant materials
US5246881A (en) * 1993-04-14 1993-09-21 Micron Semiconductor, Inc. Low-pressure chemical vapor deposition process for depositing high-density, highly-conformal, titanium nitride films of low bulk resistivity
US5278091A (en) * 1993-05-04 1994-01-11 Micron Semiconductor, Inc. Process to manufacture crown stacked capacitor structures with HSG-rugged polysilicon on all sides of the storage node
US5340765A (en) * 1993-08-13 1994-08-23 Micron Semiconductor, Inc. Method for forming enhanced capacitance stacked capacitor structures using hemi-spherical grain polysilicon
US5489548A (en) * 1994-08-01 1996-02-06 Texas Instruments Incorporated Method of forming high-dielectric-constant material electrodes comprising sidewall spacers
US5504041A (en) * 1994-08-01 1996-04-02 Texas Instruments Incorporated Conductive exotic-nitride barrier layer for high-dielectric-constant materials

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR900001479B1 (ko) * 1985-06-14 1990-03-12 이 아이 듀우판 디 네모아 앤드 캄파니 유전성 조성물, 유전성 그린테이프 및 축전기

Also Published As

Publication number Publication date
US5663088A (en) 1997-09-02
DE69635953D1 (de) 2006-05-11
EP0826237A4 (en) 1998-09-23
TW293161B (enExample) 1996-12-11
DE69635953T2 (de) 2007-02-01
EP0826237B1 (en) 2006-03-22
JP4314413B2 (ja) 2009-08-19
AU5864596A (en) 1996-11-29
JPH11509684A (ja) 1999-08-24
EP0826237A1 (en) 1998-03-04
US6017789A (en) 2000-01-25
US5814852A (en) 1998-09-29
WO1996036993A1 (en) 1996-11-21
ATE321359T1 (de) 2006-04-15
KR19990014845A (ko) 1999-02-25
US6198124B1 (en) 2001-03-06

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