DE69632567D1 - MOS-Transistor und Verfahren zur Herstellung desselben - Google Patents
MOS-Transistor und Verfahren zur Herstellung desselbenInfo
- Publication number
- DE69632567D1 DE69632567D1 DE69632567T DE69632567T DE69632567D1 DE 69632567 D1 DE69632567 D1 DE 69632567D1 DE 69632567 T DE69632567 T DE 69632567T DE 69632567 T DE69632567 T DE 69632567T DE 69632567 D1 DE69632567 D1 DE 69632567D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- same
- mos transistor
- mos
- transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26586—Bombardment with radiation with high-energy radiation producing ion implantation characterised by the angle between the ion beam and the crystal planes or the main crystal surface
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/28114—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor characterised by the sectional shape, e.g. T, inverted-T
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/28123—Lithography-related aspects, e.g. sub-lithography lengths; Isolation-related aspects, e.g. to solve problems arising at the crossing with the side of the device isolation; Planarisation aspects
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823814—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the source or drain structures, e.g. specific source or drain implants or silicided source or drain structures or raised source or drain structures
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- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823828—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes
- H01L21/82385—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes gate conductors with different shapes, lengths or dimensions
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
- H01L29/42376—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the length or the sectional shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66553—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using inside spacers, permanent or not
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66575—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
- H01L29/66583—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate with initial gate mask or masking layer complementary to the prospective gate location, e.g. with dummy source and drain contacts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66537—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using a self aligned punch through stopper or threshold implant under the gate region
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31444695A JP3239202B2 (ja) | 1995-12-01 | 1995-12-01 | Mosトランジスタ及びその製造方法 |
JP31444695 | 1995-12-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69632567D1 true DE69632567D1 (de) | 2004-07-01 |
DE69632567T2 DE69632567T2 (de) | 2005-06-02 |
Family
ID=18053462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69632567T Expired - Lifetime DE69632567T2 (de) | 1995-12-01 | 1996-08-15 | MOS-Transistor und Verfahren zur Herstellung desselben |
Country Status (6)
Country | Link |
---|---|
US (1) | US5734185A (de) |
EP (1) | EP0777269B1 (de) |
JP (1) | JP3239202B2 (de) |
KR (1) | KR100221063B1 (de) |
DE (1) | DE69632567T2 (de) |
TW (1) | TW319900B (de) |
Families Citing this family (47)
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KR100206876B1 (ko) * | 1995-12-28 | 1999-07-01 | 구본준 | 모스전계효과트랜지스터 제조방법 |
US6037627A (en) * | 1996-08-02 | 2000-03-14 | Seiko Instruments Inc. | MOS semiconductor device |
US6297111B1 (en) * | 1997-08-20 | 2001-10-02 | Advanced Micro Devices | Self-aligned channel transistor and method for making same |
DE19742397C2 (de) * | 1997-09-25 | 2000-07-06 | Siemens Ag | Verfahren zur Herstellung einer Halbleiterstruktur mit einer Mehrzahl von Gräben |
US6060733A (en) * | 1997-12-18 | 2000-05-09 | Advanced Micro Devices, Inc. | Formation of lightly doped regions under a gate having a reduced gate oxide |
US6127235A (en) | 1998-01-05 | 2000-10-03 | Advanced Micro Devices | Method for making asymmetrical gate oxide thickness in channel MOSFET region |
DE19837395C2 (de) * | 1998-08-18 | 2001-07-19 | Infineon Technologies Ag | Verfahren zur Herstellung eines eine strukturierte Isolationsschicht enthaltenden Halbleiterbauelements |
US6107667A (en) * | 1998-09-10 | 2000-08-22 | Advanced Micro Devices, Inc. | MOS transistor with low-k spacer to suppress capacitive coupling between gate and source/drain extensions |
US6117739A (en) * | 1998-10-02 | 2000-09-12 | Advanced Micro Devices, Inc. | Semiconductor device with layered doped regions and methods of manufacture |
US6018179A (en) * | 1998-11-05 | 2000-01-25 | Advanced Micro Devices | Transistors having a scaled channel length and integrated spacers with enhanced silicidation properties |
US6531713B1 (en) * | 1999-03-19 | 2003-03-11 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and manufacturing method thereof |
TW444257B (en) | 1999-04-12 | 2001-07-01 | Semiconductor Energy Lab | Semiconductor device and method for fabricating the same |
TW497210B (en) * | 1999-05-11 | 2002-08-01 | Mosel Vitelic Inc | Self-aligned contact via process |
US6184116B1 (en) | 2000-01-11 | 2001-02-06 | Taiwan Semiconductor Manufacturing Company | Method to fabricate the MOS gate |
US6433371B1 (en) | 2000-01-29 | 2002-08-13 | Advanced Micro Devices, Inc. | Controlled gate length and gate profile semiconductor device |
US20020113268A1 (en) * | 2000-02-01 | 2002-08-22 | Jun Koyama | Nonvolatile memory, semiconductor device and method of manufacturing the same |
KR100359773B1 (ko) * | 2000-05-01 | 2002-11-07 | 주식회사 하이닉스반도체 | 반도체 소자 제조방법 |
JP2002164442A (ja) * | 2000-11-28 | 2002-06-07 | Hitachi Ltd | 半導体装置およびその製造方法 |
JP2002198443A (ja) * | 2000-12-26 | 2002-07-12 | Nec Corp | 半導体装置及びその製造方法 |
JP2002299611A (ja) * | 2001-03-30 | 2002-10-11 | Fujitsu Ltd | ゲート電極を有する半導体素子の特性の計算方法及びプログラム |
KR100761547B1 (ko) * | 2001-06-22 | 2007-09-27 | 매그나칩 반도체 유한회사 | 트랜지스터 및 그의 제조 방법 |
US7002208B2 (en) | 2001-07-02 | 2006-02-21 | Oki Electric Industry Co., Ltd. | Semiconductor device and manufacturing method of the same |
US6534822B1 (en) * | 2001-07-17 | 2003-03-18 | Advanced Micro Devices, Inc. | Silicon on insulator field effect transistor with a double Schottky gate structure |
JP2003060073A (ja) * | 2001-08-10 | 2003-02-28 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
US20040018738A1 (en) * | 2002-07-22 | 2004-01-29 | Wei Liu | Method for fabricating a notch gate structure of a field effect transistor |
US6740535B2 (en) * | 2002-07-29 | 2004-05-25 | International Business Machines Corporation | Enhanced T-gate structure for modulation doped field effect transistors |
US20040121524A1 (en) * | 2002-12-20 | 2004-06-24 | Micron Technology, Inc. | Apparatus and method for controlling diffusion |
JP4793840B2 (ja) * | 2003-11-10 | 2011-10-12 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置の製造方法 |
US6885072B1 (en) * | 2003-11-18 | 2005-04-26 | Applied Intellectual Properties Co., Ltd. | Nonvolatile memory with undercut trapping structure |
KR101044380B1 (ko) * | 2004-01-08 | 2011-06-29 | 매그나칩 반도체 유한회사 | 반도체 소자의 제조방법 |
KR100598033B1 (ko) * | 2004-02-03 | 2006-07-07 | 삼성전자주식회사 | 반도체 소자의 듀얼 게이트 산화막 형성 방법 |
US7638400B2 (en) * | 2004-04-07 | 2009-12-29 | United Microelectronics Corp. | Method for fabricating semiconductor device |
US6975000B2 (en) * | 2004-04-08 | 2005-12-13 | Taiwan Semiconductor Manufacturing Company | Method of forming a recessed buried-diffusion device |
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US7294882B2 (en) * | 2004-09-28 | 2007-11-13 | Sandisk Corporation | Non-volatile memory with asymmetrical doping profile |
US7674697B2 (en) * | 2005-07-06 | 2010-03-09 | International Business Machines Corporation | MOSFET with multiple fully silicided gate and method for making the same |
JP4667279B2 (ja) * | 2006-03-14 | 2011-04-06 | Okiセミコンダクタ株式会社 | 半導体装置の製造方法 |
JP5630939B2 (ja) * | 2007-07-11 | 2014-11-26 | ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. | 半導体装置及びその製造方法 |
TWI471915B (zh) * | 2009-07-10 | 2015-02-01 | United Microelectronics Corp | 閘極結構及其製作方法 |
US8513712B2 (en) | 2009-09-28 | 2013-08-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for forming a semiconductor gate |
JP5267497B2 (ja) * | 2010-04-05 | 2013-08-21 | ソニー株式会社 | 固体撮像装置 |
US8541296B2 (en) * | 2011-09-01 | 2013-09-24 | The Institute of Microelectronics Chinese Academy of Science | Method of manufacturing dummy gates in gate last process |
US9029956B2 (en) | 2011-10-26 | 2015-05-12 | Global Foundries, Inc. | SRAM cell with individual electrical device threshold control |
US9048136B2 (en) | 2011-10-26 | 2015-06-02 | GlobalFoundries, Inc. | SRAM cell with individual electrical device threshold control |
JP6094159B2 (ja) * | 2012-11-13 | 2017-03-15 | 三菱電機株式会社 | 半導体装置の製造方法 |
US9893060B2 (en) * | 2015-12-17 | 2018-02-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device and manufacturing method thereof |
US10515969B2 (en) | 2016-11-17 | 2019-12-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device and manufacturing method thereof |
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JPS6336564A (ja) * | 1986-07-31 | 1988-02-17 | Nec Corp | 半導体装置の製造方法 |
JPS6430270A (en) * | 1987-07-24 | 1989-02-01 | Fujitsu Ltd | Manufacture of insulated-gate semiconductor device |
JPH07120705B2 (ja) * | 1987-11-17 | 1995-12-20 | 三菱電機株式会社 | 素子間分離領域を有する半導体装置の製造方法 |
US5102816A (en) * | 1990-03-27 | 1992-04-07 | Sematech, Inc. | Staircase sidewall spacer for improved source/drain architecture |
US5270234A (en) * | 1992-10-30 | 1993-12-14 | International Business Machines Corporation | Deep submicron transistor fabrication method |
JP3203845B2 (ja) * | 1992-12-22 | 2001-08-27 | ソニー株式会社 | ゲート電極の形成方法 |
US5342803A (en) * | 1993-02-03 | 1994-08-30 | Rohm, Co., Ltd. | Method for isolating circuit elements for semiconductor device |
DE4415137C1 (de) * | 1994-04-29 | 1995-07-20 | Gold Star Electronics | Halbleiter-Bauelement und Verfahren zu dessen Herstellung |
-
1995
- 1995-12-01 JP JP31444695A patent/JP3239202B2/ja not_active Expired - Fee Related
-
1996
- 1996-08-08 US US08/694,067 patent/US5734185A/en not_active Expired - Lifetime
- 1996-08-12 TW TW085109756A patent/TW319900B/zh not_active IP Right Cessation
- 1996-08-15 EP EP96305957A patent/EP0777269B1/de not_active Expired - Lifetime
- 1996-08-15 DE DE69632567T patent/DE69632567T2/de not_active Expired - Lifetime
- 1996-09-19 KR KR1019960041523A patent/KR100221063B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH09153612A (ja) | 1997-06-10 |
KR100221063B1 (ko) | 1999-09-15 |
KR970054487A (ko) | 1997-07-31 |
EP0777269A3 (de) | 1999-02-03 |
US5734185A (en) | 1998-03-31 |
EP0777269B1 (de) | 2004-05-26 |
DE69632567T2 (de) | 2005-06-02 |
JP3239202B2 (ja) | 2001-12-17 |
EP0777269A2 (de) | 1997-06-04 |
TW319900B (de) | 1997-11-11 |
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