DE69531090D1 - Speicherzelle und Wortleitungstreiber für ASIC-hergestellten integrierten DRAM-Speicher - Google Patents

Speicherzelle und Wortleitungstreiber für ASIC-hergestellten integrierten DRAM-Speicher

Info

Publication number
DE69531090D1
DE69531090D1 DE69531090T DE69531090T DE69531090D1 DE 69531090 D1 DE69531090 D1 DE 69531090D1 DE 69531090 T DE69531090 T DE 69531090T DE 69531090 T DE69531090 T DE 69531090T DE 69531090 D1 DE69531090 D1 DE 69531090D1
Authority
DE
Germany
Prior art keywords
asic
word line
line driver
memory
memory cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69531090T
Other languages
English (en)
Other versions
DE69531090T2 (de
Inventor
Karl Skjaveland
Peter B Gillingham
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nvidia Corp
Original Assignee
Mosaid Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mosaid Technologies Inc filed Critical Mosaid Technologies Inc
Publication of DE69531090D1 publication Critical patent/DE69531090D1/de
Application granted granted Critical
Publication of DE69531090T2 publication Critical patent/DE69531090T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/408—Address circuits
    • G11C11/4085—Word line control circuits, e.g. word line drivers, - boosters, - pull-up, - pull-down, - precharge
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/403—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh
    • G11C11/404—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh with one charge-transfer gate, e.g. MOS transistor, per cell
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C8/00—Arrangements for selecting an address in a digital store
    • G11C8/08—Word line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, for word lines
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C2207/00—Indexing scheme relating to arrangements for writing information into, or reading information out from, a digital store
    • G11C2207/10—Aspects relating to interfaces of memory device to external buses
    • G11C2207/104—Embedded memory devices, e.g. memories with a processing device on the same die or ASIC memory designs

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Dram (AREA)
  • Semiconductor Memories (AREA)
DE69531090T 1994-12-14 1995-12-08 Speicherzelle und Wortleitungstreiber für ASIC-hergestellten integrierten DRAM-Speicher Expired - Lifetime DE69531090T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/355,956 US5600598A (en) 1994-12-14 1994-12-14 Memory cell and wordline driver for embedded DRAM in ASIC process
US355956 1994-12-14

Publications (2)

Publication Number Publication Date
DE69531090D1 true DE69531090D1 (de) 2003-07-24
DE69531090T2 DE69531090T2 (de) 2004-05-13

Family

ID=23399483

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69531090T Expired - Lifetime DE69531090T2 (de) 1994-12-14 1995-12-08 Speicherzelle und Wortleitungstreiber für ASIC-hergestellten integrierten DRAM-Speicher
DE69536143T Expired - Lifetime DE69536143D1 (de) 1994-12-14 1995-12-08 Speicherzelle und Wortleitungtreiber für einen eingebetteten DRAM-Speicher im ASIC-Herstellungsverfahren

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69536143T Expired - Lifetime DE69536143D1 (de) 1994-12-14 1995-12-08 Speicherzelle und Wortleitungtreiber für einen eingebetteten DRAM-Speicher im ASIC-Herstellungsverfahren

Country Status (4)

Country Link
US (2) US5600598A (de)
EP (2) EP1336970B1 (de)
JP (1) JP3182067B2 (de)
DE (2) DE69531090T2 (de)

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US20050036363A1 (en) * 1996-05-24 2005-02-17 Jeng-Jye Shau High performance embedded semiconductor memory devices with multiple dimension first-level bit-lines
US5835438A (en) * 1996-12-24 1998-11-10 Mosaid Technologies Incorporated Precharge-enable self boosting word line driver for an embedded DRAM
US6136677A (en) * 1997-09-25 2000-10-24 Siemens Aktiengesellschaft Method of fabricating semiconductor chips with silicide and implanted junctions
US5896331A (en) * 1997-12-23 1999-04-20 Lsi Logic Corporation Reprogrammable addressing process for embedded DRAM
US6034433A (en) * 1997-12-23 2000-03-07 Intel Corporation Interconnect structure for protecting a transistor gate from charge damage
US5907511A (en) * 1997-12-23 1999-05-25 Lsi Logic Corporation Electrically selectable redundant components for an embedded DRAM
US5999440A (en) * 1998-03-30 1999-12-07 Lsi Logic Corporation Embedded DRAM with noise-protecting substrate isolation well
US6064588A (en) * 1998-03-30 2000-05-16 Lsi Logic Corporation Embedded dram with noise-protected differential capacitor memory cells
US6180998B1 (en) 1998-03-30 2001-01-30 Lsi Logic Corporation DRAM with built-in noise protection
US5973952A (en) * 1998-03-30 1999-10-26 Lsi Logic Corporation Embedded DRAM with noise protecting shielding conductor
US6005824A (en) * 1998-06-30 1999-12-21 Lsi Logic Corporation Inherently compensated clocking circuit for dynamic random access memory
US6509595B1 (en) 1999-06-14 2003-01-21 Monolithic System Technology, Inc. DRAM cell fabricated using a modified logic process and method for operating same
US6573548B2 (en) 1998-08-14 2003-06-03 Monolithic System Technology, Inc. DRAM cell having a capacitor structure fabricated partially in a cavity and method for operating same
US6468855B2 (en) 1998-08-14 2002-10-22 Monolithic System Technology, Inc. Reduced topography DRAM cell fabricated using a modified logic process and method for operating same
US6075720A (en) * 1998-08-14 2000-06-13 Monolithic System Tech Inc Memory cell for DRAM embedded in logic
US6087690A (en) * 1998-10-13 2000-07-11 Worldwide Semiconductor Manufacturing Corporation Single polysilicon DRAM cell with current gain
US6136638A (en) * 1998-11-19 2000-10-24 Taiwan Semiconductor Manufacturing Company Process technology architecture of embedded DRAM
US6177340B1 (en) 1999-02-18 2001-01-23 Taiwan Semiconductor Manufacturing Company Method to reduce contact hole aspect ratio for embedded DRAM arrays and logic devices, via the use of a tungsten bit line structure
JP2000349172A (ja) * 1999-02-26 2000-12-15 Sony Corp 半導体メモリセル
JP3506633B2 (ja) * 1999-04-09 2004-03-15 沖電気工業株式会社 半導体装置
US6219270B1 (en) * 1999-05-24 2001-04-17 U.S. Philips Corporation Integrated circuit having dynamic memory with boosted plateline
US6457108B1 (en) 1999-10-07 2002-09-24 Monolithic System Technology, Inc. Method of operating a system-on-a-chip including entering a standby state in a non-volatile memory while operating the system-on-a-chip from a volatile memory
US6329240B1 (en) 1999-10-07 2001-12-11 Monolithic System Technology, Inc. Non-volatile memory cell and methods of fabricating and operating same
US6841821B2 (en) * 1999-10-07 2005-01-11 Monolithic System Technology, Inc. Non-volatile memory cell fabricated with slight modification to a conventional logic process and methods of operating same
CA2299991A1 (en) * 2000-03-03 2001-09-03 Mosaid Technologies Incorporated A memory cell for embedded memories
US6359802B1 (en) * 2000-03-28 2002-03-19 Intel Corporation One-transistor and one-capacitor DRAM cell for logic process technology
JP2002083942A (ja) * 2000-09-06 2002-03-22 Matsushita Electric Ind Co Ltd 半導体集積回路装置
JP2002208275A (ja) * 2001-01-11 2002-07-26 Matsushita Electric Ind Co Ltd 半導体集積回路およびその検査方法
US6901052B2 (en) * 2001-05-04 2005-05-31 Slt Logic Llc System and method for policing multiple data flows and multi-protocol data flows
US6944168B2 (en) * 2001-05-04 2005-09-13 Slt Logic Llc System and method for providing transformation of multi-protocol packets in a data stream
US7042848B2 (en) * 2001-05-04 2006-05-09 Slt Logic Llc System and method for hierarchical policing of flows and subflows of a data stream
US6904057B2 (en) * 2001-05-04 2005-06-07 Slt Logic Llc Method and apparatus for providing multi-protocol, multi-stage, real-time frame classification
JP2003257178A (ja) * 2002-03-06 2003-09-12 Matsushita Electric Ind Co Ltd 半導体メモリ装置
JP4323749B2 (ja) * 2002-03-25 2009-09-02 パナソニック株式会社 ダイナミックランダムアクセスメモリ
US20110026323A1 (en) * 2009-07-30 2011-02-03 International Business Machines Corporation Gated Diode Memory Cells
US8445946B2 (en) * 2003-12-11 2013-05-21 International Business Machines Corporation Gated diode memory cells
US7341765B2 (en) * 2004-01-27 2008-03-11 Battelle Energy Alliance, Llc Metallic coatings on silicon substrates, and methods of forming metallic coatings on silicon substrates
US7323379B2 (en) * 2005-02-03 2008-01-29 Mosys, Inc. Fabrication process for increased capacitance in an embedded DRAM memory
US7382658B2 (en) * 2006-01-26 2008-06-03 Mosys, Inc. Non-volatile memory embedded in a conventional logic process and methods for operating same
US20070170489A1 (en) * 2006-01-26 2007-07-26 Fang Gang-Feng Method to increase charge retention of non-volatile memory manufactured in a single-gate logic process
JP5352077B2 (ja) 2007-11-12 2013-11-27 ルネサスエレクトロニクス株式会社 半導体集積回路
TWI359422B (en) * 2008-04-15 2012-03-01 Faraday Tech Corp 2t sram and associated cell structure
US7929359B2 (en) * 2008-11-13 2011-04-19 Mosys, Inc. Embedded DRAM with bias-independent capacitance
US9911470B2 (en) 2011-12-15 2018-03-06 Nvidia Corporation Fast-bypass memory circuit
US8929128B2 (en) * 2012-05-17 2015-01-06 Semiconductor Energy Laboratory Co., Ltd. Storage device and writing method of the same
CN103632712A (zh) 2012-08-27 2014-03-12 辉达公司 存储单元和存储器
US9685207B2 (en) 2012-12-04 2017-06-20 Nvidia Corporation Sequential access memory with master-slave latch pairs and method of operating
US10141930B2 (en) 2013-06-04 2018-11-27 Nvidia Corporation Three state latch
US9361972B1 (en) * 2015-03-20 2016-06-07 Intel Corporation Charge level maintenance in a memory

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DE2441385C3 (de) * 1974-08-29 1981-05-07 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Vergrößern des Lesesignals bei einem Ein- Transistor-Speicherelement
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Also Published As

Publication number Publication date
EP0717413A2 (de) 1996-06-19
DE69536143D1 (de) 2011-04-07
EP0717413A3 (de) 1999-01-07
US5600598A (en) 1997-02-04
DE69531090T2 (de) 2004-05-13
EP1336970B1 (de) 2011-02-23
JPH08264730A (ja) 1996-10-11
JP3182067B2 (ja) 2001-07-03
EP0717413B1 (de) 2003-06-18
EP1336970A2 (de) 2003-08-20
EP1336970A3 (de) 2005-01-05
US5694355A (en) 1997-12-02

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Owner name: NVIDIA CORP., SANTA CLARA, CALIF., US

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