DE69426694T2 - Flaches tauchankerrelais und verfahren zu seiner herstellung - Google Patents
Flaches tauchankerrelais und verfahren zu seiner herstellungInfo
- Publication number
- DE69426694T2 DE69426694T2 DE69426694T DE69426694T DE69426694T2 DE 69426694 T2 DE69426694 T2 DE 69426694T2 DE 69426694 T DE69426694 T DE 69426694T DE 69426694 T DE69426694 T DE 69426694T DE 69426694 T2 DE69426694 T2 DE 69426694T2
- Authority
- DE
- Germany
- Prior art keywords
- movable plate
- substrate
- semiconductor substrate
- flat
- electromagnetic relay
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 28
- 238000000034 method Methods 0.000 title description 13
- 238000004353 relayed correlation spectroscopy Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 claims description 135
- 239000004065 semiconductor Substances 0.000 claims description 52
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- 229910052802 copper Inorganic materials 0.000 claims description 23
- 239000010949 copper Substances 0.000 claims description 23
- 229910052759 nickel Inorganic materials 0.000 claims description 17
- 238000009713 electroplating Methods 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 13
- 238000004544 sputter deposition Methods 0.000 claims description 11
- 239000010409 thin film Substances 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 9
- 230000000873 masking effect Effects 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 28
- 239000011521 glass Substances 0.000 description 26
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 21
- 229910052710 silicon Inorganic materials 0.000 description 21
- 239000010703 silicon Substances 0.000 description 21
- 230000004907 flux Effects 0.000 description 19
- 238000004364 calculation method Methods 0.000 description 13
- 239000010408 film Substances 0.000 description 9
- 238000009826 distribution Methods 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 238000005452 bending Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 238000006073 displacement reaction Methods 0.000 description 6
- 230000004044 response Effects 0.000 description 6
- 239000011241 protective layer Substances 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000003754 machining Methods 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 229910018503 SF6 Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005094 computer simulation Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/005—Details of electromagnetic relays using micromechanics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H51/00—Electromagnetic relays
- H01H51/22—Polarised relays
- H01H51/26—Polarised relays with intermediate neutral position of rest
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/12—Contacts characterised by the manner in which co-operating contacts engage
- H01H1/14—Contacts characterised by the manner in which co-operating contacts engage by abutting
- H01H1/20—Bridging contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/005—Details of electromagnetic relays using micromechanics
- H01H2050/007—Relays of the polarised type, e.g. the MEMS relay beam having a preferential magnetisation direction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/02—Bases; Casings; Covers
- H01H50/023—Details concerning sealing, e.g. sealing casing with resin
- H01H2050/025—Details concerning sealing, e.g. sealing casing with resin containing inert or dielectric gasses, e.g. SF6, for arc prevention or arc extinction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H59/00—Electrostatic relays; Electro-adhesion relays
- H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
- H01H2059/0054—Rocking contacts or actuating members
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Micromachines (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32052593A JP3465940B2 (ja) | 1993-12-20 | 1993-12-20 | プレーナー型電磁リレー及びその製造方法 |
| PCT/JP1994/002063 WO1995017760A1 (en) | 1993-12-20 | 1994-12-08 | Planar solenoid relay and production method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69426694D1 DE69426694D1 (de) | 2001-03-22 |
| DE69426694T2 true DE69426694T2 (de) | 2001-07-05 |
Family
ID=18122411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69426694T Expired - Fee Related DE69426694T2 (de) | 1993-12-20 | 1994-12-08 | Flaches tauchankerrelais und verfahren zu seiner herstellung |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5872496A (enExample) |
| EP (1) | EP0685864B1 (enExample) |
| JP (1) | JP3465940B2 (enExample) |
| KR (1) | KR100351271B1 (enExample) |
| DE (1) | DE69426694T2 (enExample) |
| TW (1) | TW280922B (enExample) |
| WO (1) | WO1995017760A1 (enExample) |
Families Citing this family (75)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3425814B2 (ja) * | 1994-12-28 | 2003-07-14 | 日本信号株式会社 | 電磁アクチュエータ及びその製造方法 |
| FR2742917B1 (fr) * | 1995-12-22 | 1998-02-13 | Suisse Electronique Microtech | Dispositif miniature pour executer une fonction predeterminee, notamment microrelais |
| US5778513A (en) * | 1996-02-09 | 1998-07-14 | Denny K. Miu | Bulk fabricated electromagnetic micro-relays/micro-switches and method of making same |
| CH692829A5 (de) * | 1997-11-20 | 2002-11-15 | Axicom Ltd | Mikrorelais als miniaturisiertes Flachspul-Relais. |
| DE19820821C1 (de) * | 1998-05-09 | 1999-12-16 | Inst Mikrotechnik Mainz Gmbh | Elektromagnetisches Relais |
| US6246305B1 (en) * | 1998-12-30 | 2001-06-12 | Honeywell International Inc | Apparatus and method for operating a micromechanical switch |
| US6040749A (en) * | 1998-12-30 | 2000-03-21 | Honeywell Inc. | Apparatus and method for operating a micromechanical switch |
| US6410360B1 (en) * | 1999-01-26 | 2002-06-25 | Teledyne Industries, Inc. | Laminate-based apparatus and method of fabrication |
| DE19918368A1 (de) * | 1999-04-22 | 2000-11-02 | Tyco Electronics Logistics Ag | Elektromagnetisches Relais und Verfahren zu dessen Herstellung |
| US6262463B1 (en) | 1999-07-08 | 2001-07-17 | Integrated Micromachines, Inc. | Micromachined acceleration activated mechanical switch and electromagnetic sensor |
| US6366186B1 (en) * | 2000-01-20 | 2002-04-02 | Jds Uniphase Inc. | Mems magnetically actuated switches and associated switching arrays |
| US6384353B1 (en) * | 2000-02-01 | 2002-05-07 | Motorola, Inc. | Micro-electromechanical system device |
| DE10004393C1 (de) * | 2000-02-02 | 2002-02-14 | Infineon Technologies Ag | Mikrorelais |
| US7064879B1 (en) * | 2000-04-07 | 2006-06-20 | Microsoft Corporation | Magnetically actuated microelectrochemical systems actuator |
| US6639713B2 (en) | 2000-04-25 | 2003-10-28 | Umachines, Inc. | Silicon micromachined optical device |
| US6709886B2 (en) | 2000-04-25 | 2004-03-23 | Umachines, Inc. | Method of fabricating micromachined devices |
| US6587021B1 (en) | 2000-11-09 | 2003-07-01 | Raytheon Company | Micro-relay contact structure for RF applications |
| JP2004533710A (ja) | 2001-01-18 | 2004-11-04 | アリゾナ ステイト ユニバーシティ | 永久磁石のアライメント要件が緩和されたマイクロ磁気ラッチスイッチ |
| US20020097118A1 (en) * | 2001-01-25 | 2002-07-25 | Siekkinen James W. | Current actuated switch |
| US20030025580A1 (en) | 2001-05-18 | 2003-02-06 | Microlab, Inc. | Apparatus utilizing latching micromagnetic switches |
| JP3750574B2 (ja) * | 2001-08-16 | 2006-03-01 | 株式会社デンソー | 薄膜電磁石およびこれを用いたスイッチング素子 |
| DE10222959B4 (de) * | 2002-05-23 | 2007-12-13 | Schott Ag | Mikro-elektromechanisches Bauelement und Verfahren zur Herstellung von mikro-elektromechanischen Bauelementen |
| CN100441068C (zh) * | 2001-09-17 | 2008-12-03 | 约翰·斯塔福德 | 微型磁性闭锁继电器组件及封装方法 |
| US6836194B2 (en) | 2001-12-21 | 2004-12-28 | Magfusion, Inc. | Components implemented using latching micro-magnetic switches |
| US20030169135A1 (en) | 2001-12-21 | 2003-09-11 | Jun Shen | Latching micro-magnetic switch array |
| US20030179057A1 (en) | 2002-01-08 | 2003-09-25 | Jun Shen | Packaging of a micro-magnetic switch with a patterned permanent magnet |
| US20030137374A1 (en) | 2002-01-18 | 2003-07-24 | Meichun Ruan | Micro-Magnetic Latching switches with a three-dimensional solenoid coil |
| JP2003242873A (ja) * | 2002-02-19 | 2003-08-29 | Fujitsu Component Ltd | マイクロリレー |
| US20030222740A1 (en) | 2002-03-18 | 2003-12-04 | Microlab, Inc. | Latching micro-magnetic switch with improved thermal reliability |
| KR100547217B1 (ko) | 2002-07-31 | 2006-01-26 | 마츠시다 덴코 가부시키가이샤 | 마이크로 릴레이 |
| EP1547189A4 (en) * | 2002-08-03 | 2006-11-08 | Siverta Inc | INTEGRATED AND SEALED SWITCH FOR MICRO-ELECTRO-MECHANICAL SYSTEMS |
| JP4804546B2 (ja) * | 2002-08-08 | 2011-11-02 | 富士通コンポーネント株式会社 | マイクロリレー |
| US7551048B2 (en) | 2002-08-08 | 2009-06-23 | Fujitsu Component Limited | Micro-relay and method of fabricating the same |
| JP2006524880A (ja) | 2002-09-18 | 2006-11-02 | マグフュージョン， インコーポレイテッド | 積層電気機械構造の組み立て方法 |
| US20040121505A1 (en) | 2002-09-30 | 2004-06-24 | Magfusion, Inc. | Method for fabricating a gold contact on a microswitch |
| KR100893893B1 (ko) * | 2002-12-02 | 2009-04-20 | 삼성전자주식회사 | 점착현상을 방지할 수 있는 ｒｆ ｍｅｍｓ 스위치 |
| US7202765B2 (en) | 2003-05-14 | 2007-04-10 | Schneider Electric Industries Sas | Latchable, magnetically actuated, ground plane-isolated radio frequency microswitch |
| US7432788B2 (en) | 2003-06-27 | 2008-10-07 | Memscap, Inc. | Microelectromechanical magnetic switches having rotors that rotate into a recess in a substrate |
| US7275424B2 (en) * | 2003-09-08 | 2007-10-02 | Analog Devices, Inc. | Wafer level capped sensor |
| US20050054133A1 (en) * | 2003-09-08 | 2005-03-10 | Felton Lawrence E. | Wafer level capped sensor |
| US7215229B2 (en) | 2003-09-17 | 2007-05-08 | Schneider Electric Industries Sas | Laminated relays with multiple flexible contacts |
| US20050083157A1 (en) | 2003-10-15 | 2005-04-21 | Magfusion, Inc. | Micro magnetic latching switches and methods of making same |
| US7183884B2 (en) | 2003-10-15 | 2007-02-27 | Schneider Electric Industries Sas | Micro magnetic non-latching switches and methods of making same |
| KR100530010B1 (ko) * | 2003-11-13 | 2005-11-22 | 한국과학기술원 | 전자기력과 정전기력을 이용하여 구동하는 토글방식의저전압, 저전력 초고주파 ｓｐｄｔ 마이크로 스위치 |
| US20050170609A1 (en) * | 2003-12-15 | 2005-08-04 | Alie Susan A. | Conductive bond for through-wafer interconnect |
| US6936918B2 (en) * | 2003-12-15 | 2005-08-30 | Analog Devices, Inc. | MEMS device with conductive path through substrate |
| CN1319096C (zh) * | 2004-01-16 | 2007-05-30 | 北京工业大学 | 一种微机械电磁继电器及其制备方法 |
| JP4059201B2 (ja) * | 2004-01-27 | 2008-03-12 | 松下電工株式会社 | マイクロリレー |
| WO2005071707A1 (ja) | 2004-01-27 | 2005-08-04 | Matsushita Electric Works, Ltd. | マイクロリレー |
| US7342473B2 (en) | 2004-04-07 | 2008-03-11 | Schneider Electric Industries Sas | Method and apparatus for reducing cantilever stress in magnetically actuated relays |
| US7816999B2 (en) * | 2004-04-12 | 2010-10-19 | Siverta, Inc. | Single-pole double-throw MEMS switch |
| US7608534B2 (en) * | 2004-06-02 | 2009-10-27 | Analog Devices, Inc. | Interconnection of through-wafer vias using bridge structures |
| CN100373516C (zh) * | 2004-09-15 | 2008-03-05 | 中国科学院上海微系统与信息技术研究所 | 翘曲膜结构的单刀双掷射频和微波微机械开关及制作方法 |
| CN1305091C (zh) * | 2004-11-03 | 2007-03-14 | 重庆大学 | 双稳态电磁微机械继电器 |
| JP2006179252A (ja) * | 2004-12-21 | 2006-07-06 | Fujitsu Component Ltd | スイッチデバイス |
| JP5074693B2 (ja) * | 2005-01-26 | 2012-11-14 | パナソニック株式会社 | 微小電気機械デバイス |
| TWI416081B (zh) * | 2005-08-17 | 2013-11-21 | Star Trading Yugen Kaisha | Small inclination, vibration sensor and manufacturing method thereof |
| JP2007207498A (ja) * | 2006-01-31 | 2007-08-16 | Oki Sensor Device Corp | 機構デバイス |
| US8581678B2 (en) * | 2006-07-19 | 2013-11-12 | University Of Florida Research Foundation, Inc. | Method and apparatus for electromagnetic actuation |
| US20080087979A1 (en) * | 2006-10-13 | 2008-04-17 | Analog Devices, Inc. | Integrated Circuit with Back Side Conductive Paths |
| FR2909831B1 (fr) * | 2006-12-08 | 2009-01-16 | Schneider Electric Ind Sas | Dispositif a eclairage variable a diodes electroluminescentes |
| US20100141366A1 (en) | 2008-12-04 | 2010-06-10 | Microvision, Inc. | Magnetically Actuated System |
| US8836454B2 (en) * | 2009-08-11 | 2014-09-16 | Telepath Networks, Inc. | Miniature magnetic switch structures |
| US8159320B2 (en) * | 2009-09-14 | 2012-04-17 | Meichun Ruan | Latching micro-magnetic relay and method of operating same |
| US8432240B2 (en) * | 2010-07-16 | 2013-04-30 | Telepath Networks, Inc. | Miniature magnetic switch structures |
| US8957747B2 (en) | 2010-10-27 | 2015-02-17 | Telepath Networks, Inc. | Multi integrated switching device structures |
| US8941461B2 (en) | 2011-02-02 | 2015-01-27 | Tyco Electronics Corporation | Three-function reflowable circuit protection device |
| US9455106B2 (en) * | 2011-02-02 | 2016-09-27 | Littelfuse, Inc. | Three-function reflowable circuit protection device |
| KR101354405B1 (ko) * | 2011-06-07 | 2014-01-22 | 후지쯔 콤포넌트 가부시끼가이샤 | 전자계전기 및 전자계전기의 제조방법 |
| WO2013049196A2 (en) | 2011-09-30 | 2013-04-04 | Telepath Networks, Inc. | Multi integrated switching device structures |
| JP2017060205A (ja) * | 2013-08-01 | 2017-03-23 | インテル・コーポレーション | ミラー装置 |
| US10283582B2 (en) * | 2013-02-25 | 2019-05-07 | Analog Devices Global | Microelectronic circuits and integrated circuits including a non-silicon substrate |
| CN106291405B (zh) * | 2016-08-31 | 2020-11-24 | 宁波中车时代传感技术有限公司 | 一次成型螺线管线圈微型磁通门的制备方法 |
| US10210978B2 (en) * | 2017-01-26 | 2019-02-19 | Immersion Corporation | Haptic actuator incorporating conductive coil and moving element with magnets |
| US11170906B2 (en) * | 2018-10-31 | 2021-11-09 | Ge-Hitachi Nuclear Energy Americas Llc | Passive electrical component for safety system shutdown using Gauss' law of magnetism |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB874965A (en) * | 1958-07-09 | 1961-08-16 | G V Planer Ltd | Improvements in or relating to electrical circuits or circuit elements |
| JPS60107229A (ja) * | 1983-11-15 | 1985-06-12 | オムロン株式会社 | フラツトリレ− |
| US4668928A (en) * | 1986-06-23 | 1987-05-26 | Tektronix, Inc. | Bi-stable switch with pivoted armature |
| US4993787A (en) * | 1987-03-13 | 1991-02-19 | Omron Tateisi Electronics Co. | Electromagnetic relay |
| JP2625884B2 (ja) * | 1988-05-18 | 1997-07-02 | オムロン株式会社 | リレー |
| DE3914031C2 (de) * | 1989-04-28 | 1993-10-28 | Deutsche Aerospace | Mikromechanischer Aktuator |
| JP2713801B2 (ja) * | 1990-06-26 | 1998-02-16 | 松下電工株式会社 | 静電リレーおよびその製造方法 |
| JPH056832A (ja) * | 1991-06-28 | 1993-01-14 | Toshiba Corp | 平面コイルの製造方法 |
| DE4205029C1 (en) * | 1992-02-19 | 1993-02-11 | Siemens Ag, 8000 Muenchen, De | Micro-mechanical electrostatic relay - has tongue-shaped armature etched from surface of silicon@ substrate |
| JP2714736B2 (ja) * | 1992-06-01 | 1998-02-16 | シャープ株式会社 | マイクロリレー |
| JP2560629B2 (ja) * | 1993-12-08 | 1996-12-04 | 日本電気株式会社 | シリコン超小形リレー |
-
1993
- 1993-12-20 JP JP32052593A patent/JP3465940B2/ja not_active Expired - Fee Related
-
1994
- 1994-12-08 EP EP95902925A patent/EP0685864B1/en not_active Expired - Lifetime
- 1994-12-08 KR KR1019950703489A patent/KR100351271B1/ko not_active Expired - Fee Related
- 1994-12-08 US US08/505,321 patent/US5872496A/en not_active Expired - Fee Related
- 1994-12-08 DE DE69426694T patent/DE69426694T2/de not_active Expired - Fee Related
- 1994-12-08 WO PCT/JP1994/002063 patent/WO1995017760A1/ja not_active Ceased
- 1994-12-20 TW TW083111922A patent/TW280922B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| KR960701459A (ko) | 1996-02-24 |
| EP0685864A4 (en) | 1997-10-29 |
| KR100351271B1 (ko) | 2002-12-28 |
| EP0685864A1 (en) | 1995-12-06 |
| TW280922B (enExample) | 1996-07-11 |
| WO1995017760A1 (en) | 1995-06-29 |
| US5872496A (en) | 1999-02-16 |
| JP3465940B2 (ja) | 2003-11-10 |
| EP0685864B1 (en) | 2001-02-14 |
| DE69426694D1 (de) | 2001-03-22 |
| JPH07176255A (ja) | 1995-07-14 |
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