DE69426694D1 - Flaches tauchankerrelais und verfahren zu seiner herstellung - Google Patents

Flaches tauchankerrelais und verfahren zu seiner herstellung

Info

Publication number
DE69426694D1
DE69426694D1 DE69426694T DE69426694T DE69426694D1 DE 69426694 D1 DE69426694 D1 DE 69426694D1 DE 69426694 T DE69426694 T DE 69426694T DE 69426694 T DE69426694 T DE 69426694T DE 69426694 D1 DE69426694 D1 DE 69426694D1
Authority
DE
Germany
Prior art keywords
production
submersible anchor
anchor relay
flat
flat submersible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69426694T
Other languages
English (en)
Other versions
DE69426694T2 (de
Inventor
Masayoshi Esashi
Norihiro Asada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Signal Co Ltd
Original Assignee
Nippon Signal Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Signal Co Ltd filed Critical Nippon Signal Co Ltd
Publication of DE69426694D1 publication Critical patent/DE69426694D1/de
Application granted granted Critical
Publication of DE69426694T2 publication Critical patent/DE69426694T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/005—Details of electromagnetic relays using micromechanics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H51/00—Electromagnetic relays
    • H01H51/22—Polarised relays
    • H01H51/26—Polarised relays with intermediate neutral position of rest
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/12—Contacts characterised by the manner in which co-operating contacts engage
    • H01H1/14—Contacts characterised by the manner in which co-operating contacts engage by abutting
    • H01H1/20—Bridging contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/005—Details of electromagnetic relays using micromechanics
    • H01H2050/007—Relays of the polarised type, e.g. the MEMS relay beam having a preferential magnetisation direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/02—Bases; Casings; Covers
    • H01H50/023—Details concerning sealing, e.g. sealing casing with resin
    • H01H2050/025—Details concerning sealing, e.g. sealing casing with resin containing inert or dielectric gasses, e.g. SF6, for arc prevention or arc extinction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • H01H2059/0054—Rocking contacts or actuating members

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Micromachines (AREA)
DE69426694T 1993-12-20 1994-12-08 Flaches tauchankerrelais und verfahren zu seiner herstellung Expired - Fee Related DE69426694T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP32052593A JP3465940B2 (ja) 1993-12-20 1993-12-20 プレーナー型電磁リレー及びその製造方法
PCT/JP1994/002063 WO1995017760A1 (fr) 1993-12-20 1994-12-08 Relais a aimant plongeur plan et procede de production dudit relais

Publications (2)

Publication Number Publication Date
DE69426694D1 true DE69426694D1 (de) 2001-03-22
DE69426694T2 DE69426694T2 (de) 2001-07-05

Family

ID=18122411

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69426694T Expired - Fee Related DE69426694T2 (de) 1993-12-20 1994-12-08 Flaches tauchankerrelais und verfahren zu seiner herstellung

Country Status (7)

Country Link
US (1) US5872496A (de)
EP (1) EP0685864B1 (de)
JP (1) JP3465940B2 (de)
KR (1) KR100351271B1 (de)
DE (1) DE69426694T2 (de)
TW (1) TW280922B (de)
WO (1) WO1995017760A1 (de)

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FR2742917B1 (fr) * 1995-12-22 1998-02-13 Suisse Electronique Microtech Dispositif miniature pour executer une fonction predeterminee, notamment microrelais
US5778513A (en) * 1996-02-09 1998-07-14 Denny K. Miu Bulk fabricated electromagnetic micro-relays/micro-switches and method of making same
CH692829A5 (de) * 1997-11-20 2002-11-15 Axicom Ltd Mikrorelais als miniaturisiertes Flachspul-Relais.
DE19820821C1 (de) * 1998-05-09 1999-12-16 Inst Mikrotechnik Mainz Gmbh Elektromagnetisches Relais
US6040749A (en) * 1998-12-30 2000-03-21 Honeywell Inc. Apparatus and method for operating a micromechanical switch
US6246305B1 (en) * 1998-12-30 2001-06-12 Honeywell International Inc Apparatus and method for operating a micromechanical switch
US6410360B1 (en) 1999-01-26 2002-06-25 Teledyne Industries, Inc. Laminate-based apparatus and method of fabrication
DE19918368A1 (de) * 1999-04-22 2000-11-02 Tyco Electronics Logistics Ag Elektromagnetisches Relais und Verfahren zu dessen Herstellung
US6262463B1 (en) 1999-07-08 2001-07-17 Integrated Micromachines, Inc. Micromachined acceleration activated mechanical switch and electromagnetic sensor
US6366186B1 (en) * 2000-01-20 2002-04-02 Jds Uniphase Inc. Mems magnetically actuated switches and associated switching arrays
US6384353B1 (en) * 2000-02-01 2002-05-07 Motorola, Inc. Micro-electromechanical system device
DE10004393C1 (de) * 2000-02-02 2002-02-14 Infineon Technologies Ag Mikrorelais
US7064879B1 (en) * 2000-04-07 2006-06-20 Microsoft Corporation Magnetically actuated microelectrochemical systems actuator
US6639713B2 (en) 2000-04-25 2003-10-28 Umachines, Inc. Silicon micromachined optical device
US6709886B2 (en) 2000-04-25 2004-03-23 Umachines, Inc. Method of fabricating micromachined devices
US6587021B1 (en) 2000-11-09 2003-07-01 Raytheon Company Micro-relay contact structure for RF applications
EP1352408B1 (de) * 2001-01-18 2007-03-21 Arizona State University Mikromagnetischer verriegelbarer schalter mit weniger beschränktem ausrichtungsbedarf
US20020097118A1 (en) * 2001-01-25 2002-07-25 Siekkinen James W. Current actuated switch
US6894592B2 (en) 2001-05-18 2005-05-17 Magfusion, Inc. Micromagnetic latching switch packaging
JP3750574B2 (ja) 2001-08-16 2006-03-01 株式会社デンソー 薄膜電磁石およびこれを用いたスイッチング素子
DE10222959B4 (de) * 2002-05-23 2007-12-13 Schott Ag Mikro-elektromechanisches Bauelement und Verfahren zur Herstellung von mikro-elektromechanischen Bauelementen
DE60235389D1 (de) * 2001-09-17 2010-04-01 John Stafford Kapselung fuer polarisiertes mems relais und verfahren zur kapselung
US20030169135A1 (en) 2001-12-21 2003-09-11 Jun Shen Latching micro-magnetic switch array
US6836194B2 (en) 2001-12-21 2004-12-28 Magfusion, Inc. Components implemented using latching micro-magnetic switches
US20030179057A1 (en) 2002-01-08 2003-09-25 Jun Shen Packaging of a micro-magnetic switch with a patterned permanent magnet
US20030137374A1 (en) 2002-01-18 2003-07-24 Meichun Ruan Micro-Magnetic Latching switches with a three-dimensional solenoid coil
JP2003242873A (ja) * 2002-02-19 2003-08-29 Fujitsu Component Ltd マイクロリレー
US20030222740A1 (en) 2002-03-18 2003-12-04 Microlab, Inc. Latching micro-magnetic switch with improved thermal reliability
EP1441375A4 (de) * 2002-07-31 2007-03-28 Matsushita Electric Works Ltd Mikrorelay
AU2003258020A1 (en) * 2002-08-03 2004-02-23 Siverta, Inc. Sealed integral mems switch
US7551048B2 (en) 2002-08-08 2009-06-23 Fujitsu Component Limited Micro-relay and method of fabricating the same
JP4804546B2 (ja) * 2002-08-08 2011-11-02 富士通コンポーネント株式会社 マイクロリレー
AU2003272500A1 (en) 2002-09-18 2004-04-08 Mark Goranson Method of assembling a laminated electro-mechanical structure
US20040121505A1 (en) 2002-09-30 2004-06-24 Magfusion, Inc. Method for fabricating a gold contact on a microswitch
KR100893893B1 (ko) * 2002-12-02 2009-04-20 삼성전자주식회사 점착현상을 방지할 수 있는 ｒｆ ｍｅｍｓ 스위치
US7202765B2 (en) 2003-05-14 2007-04-10 Schneider Electric Industries Sas Latchable, magnetically actuated, ground plane-isolated radio frequency microswitch
US7432788B2 (en) 2003-06-27 2008-10-07 Memscap, Inc. Microelectromechanical magnetic switches having rotors that rotate into a recess in a substrate
US20050054133A1 (en) * 2003-09-08 2005-03-10 Felton Lawrence E. Wafer level capped sensor
US7275424B2 (en) * 2003-09-08 2007-10-02 Analog Devices, Inc. Wafer level capped sensor
US7215229B2 (en) 2003-09-17 2007-05-08 Schneider Electric Industries Sas Laminated relays with multiple flexible contacts
US20050083157A1 (en) 2003-10-15 2005-04-21 Magfusion, Inc. Micro magnetic latching switches and methods of making same
US7183884B2 (en) 2003-10-15 2007-02-27 Schneider Electric Industries Sas Micro magnetic non-latching switches and methods of making same
KR100530010B1 (ko) * 2003-11-13 2005-11-22 한국과학기술원 전자기력과 정전기력을 이용하여 구동하는 토글방식의저전압, 저전력 초고주파 ｓｐｄｔ 마이크로 스위치
US6936918B2 (en) * 2003-12-15 2005-08-30 Analog Devices, Inc. MEMS device with conductive path through substrate
US20050170609A1 (en) * 2003-12-15 2005-08-04 Alie Susan A. Conductive bond for through-wafer interconnect
CN1319096C (zh) * 2004-01-16 2007-05-30 北京工业大学 一种微机械电磁继电器及其制备方法
KR100662724B1 (ko) 2004-01-27 2006-12-28 마츠시다 덴코 가부시키가이샤 마이크로 릴레이
JP4059201B2 (ja) * 2004-01-27 2008-03-12 松下電工株式会社 マイクロリレー
US7342473B2 (en) 2004-04-07 2008-03-11 Schneider Electric Industries Sas Method and apparatus for reducing cantilever stress in magnetically actuated relays
US7816999B2 (en) * 2004-04-12 2010-10-19 Siverta, Inc. Single-pole double-throw MEMS switch
US7608534B2 (en) * 2004-06-02 2009-10-27 Analog Devices, Inc. Interconnection of through-wafer vias using bridge structures
CN100373516C (zh) * 2004-09-15 2008-03-05 中国科学院上海微系统与信息技术研究所 翘曲膜结构的单刀双掷射频和微波微机械开关及制作方法
CN1305091C (zh) * 2004-11-03 2007-03-14 重庆大学 双稳态电磁微机械继电器
JP2006179252A (ja) * 2004-12-21 2006-07-06 Fujitsu Component Ltd スイッチデバイス
JP5074693B2 (ja) * 2005-01-26 2012-11-14 パナソニック株式会社 微小電気機械デバイス
TWI416081B (zh) * 2005-08-17 2013-11-21 Star Trading Yugen Kaisha Small inclination, vibration sensor and manufacturing method thereof
JP2007207498A (ja) * 2006-01-31 2007-08-16 Oki Sensor Device Corp 機構デバイス
US8581678B2 (en) * 2006-07-19 2013-11-12 University Of Florida Research Foundation, Inc. Method and apparatus for electromagnetic actuation
US20080087979A1 (en) * 2006-10-13 2008-04-17 Analog Devices, Inc. Integrated Circuit with Back Side Conductive Paths
FR2909831B1 (fr) * 2006-12-08 2009-01-16 Schneider Electric Ind Sas Dispositif a eclairage variable a diodes electroluminescentes
US20100141366A1 (en) 2008-12-04 2010-06-10 Microvision, Inc. Magnetically Actuated System
US8836454B2 (en) * 2009-08-11 2014-09-16 Telepath Networks, Inc. Miniature magnetic switch structures
US8159320B2 (en) 2009-09-14 2012-04-17 Meichun Ruan Latching micro-magnetic relay and method of operating same
US8432240B2 (en) * 2010-07-16 2013-04-30 Telepath Networks, Inc. Miniature magnetic switch structures
US8957747B2 (en) 2010-10-27 2015-02-17 Telepath Networks, Inc. Multi integrated switching device structures
US8941461B2 (en) 2011-02-02 2015-01-27 Tyco Electronics Corporation Three-function reflowable circuit protection device
US9455106B2 (en) * 2011-02-02 2016-09-27 Littelfuse, Inc. Three-function reflowable circuit protection device
KR101354405B1 (ko) * 2011-06-07 2014-01-22 후지쯔 콤포넌트 가부시끼가이샤 전자계전기 및 전자계전기의 제조방법
WO2013049196A2 (en) 2011-09-30 2013-04-04 Telepath Networks, Inc. Multi integrated switching device structures
JP2017060205A (ja) * 2013-08-01 2017-03-23 インテル・コーポレーション ミラー装置
US10283582B2 (en) * 2013-02-25 2019-05-07 Analog Devices Global Microelectronic circuits and integrated circuits including a non-silicon substrate
CN106291405B (zh) * 2016-08-31 2020-11-24 宁波中车时代传感技术有限公司 一次成型螺线管线圈微型磁通门的制备方法
US10210978B2 (en) * 2017-01-26 2019-02-19 Immersion Corporation Haptic actuator incorporating conductive coil and moving element with magnets
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GB874965A (en) * 1958-07-09 1961-08-16 G V Planer Ltd Improvements in or relating to electrical circuits or circuit elements
JPS60107229A (ja) * 1983-11-15 1985-06-12 オムロン株式会社 フラツトリレ−
US4668928A (en) * 1986-06-23 1987-05-26 Tektronix, Inc. Bi-stable switch with pivoted armature
US4993787A (en) * 1987-03-13 1991-02-19 Omron Tateisi Electronics Co. Electromagnetic relay
JP2625884B2 (ja) * 1988-05-18 1997-07-02 オムロン株式会社 リレー
DE3914031C2 (de) * 1989-04-28 1993-10-28 Deutsche Aerospace Mikromechanischer Aktuator
JP2713801B2 (ja) * 1990-06-26 1998-02-16 松下電工株式会社 静電リレーおよびその製造方法
JPH056832A (ja) * 1991-06-28 1993-01-14 Toshiba Corp 平面コイルの製造方法
DE4205029C1 (en) * 1992-02-19 1993-02-11 Siemens Ag, 8000 Muenchen, De Micro-mechanical electrostatic relay - has tongue-shaped armature etched from surface of silicon@ substrate
JP2714736B2 (ja) * 1992-06-01 1998-02-16 シャープ株式会社 マイクロリレー
JP2560629B2 (ja) * 1993-12-08 1996-12-04 日本電気株式会社 シリコン超小形リレー

Also Published As

Publication number Publication date
EP0685864B1 (de) 2001-02-14
TW280922B (de) 1996-07-11
KR960701459A (ko) 1996-02-24
JPH07176255A (ja) 1995-07-14
EP0685864A4 (de) 1997-10-29
WO1995017760A1 (fr) 1995-06-29
DE69426694T2 (de) 2001-07-05
JP3465940B2 (ja) 2003-11-10
EP0685864A1 (de) 1995-12-06
US5872496A (en) 1999-02-16
KR100351271B1 (ko) 2002-12-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee