TW280922B - - Google Patents

Info

Publication number
TW280922B
TW280922B TW083111922A TW83111922A TW280922B TW 280922 B TW280922 B TW 280922B TW 083111922 A TW083111922 A TW 083111922A TW 83111922 A TW83111922 A TW 83111922A TW 280922 B TW280922 B TW 280922B
Authority
TW
Taiwan
Application number
TW083111922A
Original Assignee
Nippon Signal Co Ltd
Esashi Masayoshi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Signal Co Ltd, Esashi Masayoshi filed Critical Nippon Signal Co Ltd
Application granted granted Critical
Publication of TW280922B publication Critical patent/TW280922B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00Details of electromagnetic relays
    • H01H50/005Details of electromagnetic relays using micromechanics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H51/00Electromagnetic relays
    • H01H51/22Polarised relays
    • H01H51/26Polarised relays with intermediate neutral position of rest
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00Contacts
    • H01H1/12Contacts characterised by the manner in which co-operating contacts engage
    • H01H1/14Contacts characterised by the manner in which co-operating contacts engage by abutting
    • H01H1/20Bridging contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00Details of electromagnetic relays
    • H01H50/005Details of electromagnetic relays using micromechanics
    • H01H2050/007Relays of the polarised type, e.g. the MEMS relay beam having a preferential magnetisation direction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00Details of electromagnetic relays
    • H01H50/02Bases; Casings; Covers
    • H01H50/023Details concerning sealing, e.g. sealing casing with resin
    • H01H2050/025Details concerning sealing, e.g. sealing casing with resin containing inert or dielectric gasses, e.g. SF6, for arc prevention or arc extinction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00Electrostatic relays; Electro-adhesion relays
    • H01H59/0009Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • H01H2059/0054Rocking contacts or actuating members
TW083111922A 1993-12-20 1994-12-20 TW280922B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32052593A JP3465940B2 (ja) 1993-12-20 1993-12-20 プレーナー型電磁リレー及びその製造方法

Publications (1)

Publication Number Publication Date
TW280922B true TW280922B (zh) 1996-07-11

Family

ID=18122411

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083111922A TW280922B (zh) 1993-12-20 1994-12-20

Country Status (7)

Country Link
US (1) US5872496A (zh)
EP (1) EP0685864B1 (zh)
JP (1) JP3465940B2 (zh)
KR (1) KR100351271B1 (zh)
DE (1) DE69426694T2 (zh)
TW (1) TW280922B (zh)
WO (1) WO1995017760A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479529B (zh) * 2011-06-07 2015-04-01 Fujitsu Component Ltd 電磁繼電器及其製造方法

Families Citing this family (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3425814B2 (ja) * 1994-12-28 2003-07-14 日本信号株式会社 電磁アクチュエータ及びその製造方法
FR2742917B1 (fr) * 1995-12-22 1998-02-13 Suisse Electronique Microtech Dispositif miniature pour executer une fonction predeterminee, notamment microrelais
US5778513A (en) * 1996-02-09 1998-07-14 Denny K. Miu Bulk fabricated electromagnetic micro-relays/micro-switches and method of making same
CH692829A5 (de) * 1997-11-20 2002-11-15 Axicom Ltd Mikrorelais als miniaturisiertes Flachspul-Relais.
DE19820821C1 (de) * 1998-05-09 1999-12-16 Inst Mikrotechnik Mainz Gmbh Elektromagnetisches Relais
US6040749A (en) * 1998-12-30 2000-03-21 Honeywell Inc. Apparatus and method for operating a micromechanical switch
US6246305B1 (en) * 1998-12-30 2001-06-12 Honeywell International Inc Apparatus and method for operating a micromechanical switch
US6410360B1 (en) 1999-01-26 2002-06-25 Teledyne Industries, Inc. Laminate-based apparatus and method of fabrication
DE19918368A1 (de) * 1999-04-22 2000-11-02 Tyco Electronics Logistics Ag Elektromagnetisches Relais und Verfahren zu dessen Herstellung
US6262463B1 (en) 1999-07-08 2001-07-17 Integrated Micromachines, Inc. Micromachined acceleration activated mechanical switch and electromagnetic sensor
US6366186B1 (en) * 2000-01-20 2002-04-02 Jds Uniphase Inc. Mems magnetically actuated switches and associated switching arrays
US6384353B1 (en) * 2000-02-01 2002-05-07 Motorola, Inc. Micro-electromechanical system device
DE10004393C1 (de) * 2000-02-02 2002-02-14 Infineon Technologies Ag Mikrorelais
US7064879B1 (en) * 2000-04-07 2006-06-20 Microsoft Corporation Magnetically actuated microelectrochemical systems actuator
US6639713B2 (en) 2000-04-25 2003-10-28 Umachines, Inc. Silicon micromachined optical device
US6709886B2 (en) 2000-04-25 2004-03-23 Umachines, Inc. Method of fabricating micromachined devices
US6587021B1 (en) 2000-11-09 2003-07-01 Raytheon Company Micro-relay contact structure for RF applications
WO2002058092A1 (en) * 2001-01-18 2002-07-25 Arizona State University Micro-magnetic latching switch with relaxed permanent magnet alignment requirements
US20020097118A1 (en) * 2001-01-25 2002-07-25 Siekkinen James W. Current actuated switch
US20030025580A1 (en) 2001-05-18 2003-02-06 Microlab, Inc. Apparatus utilizing latching micromagnetic switches
JP3750574B2 (ja) 2001-08-16 2006-03-01 株式会社デンソー 薄膜電磁石およびこれを用いたスイッチング素子
DE10222959B4 (de) * 2002-05-23 2007-12-13 Schott Ag Mikro-elektromechanisches Bauelement und Verfahren zur Herstellung von mikro-elektromechanischen Bauelementen
JP2005503659A (ja) * 2001-09-17 2005-02-03 スタフォード,ジョン マイクロ磁気ラッチ・リレーのパッケージおよびパッケージの方法
US6836194B2 (en) 2001-12-21 2004-12-28 Magfusion, Inc. Components implemented using latching micro-magnetic switches
US20030169135A1 (en) 2001-12-21 2003-09-11 Jun Shen Latching micro-magnetic switch array
US20030179057A1 (en) 2002-01-08 2003-09-25 Jun Shen Packaging of a micro-magnetic switch with a patterned permanent magnet
US20030137374A1 (en) 2002-01-18 2003-07-24 Meichun Ruan Micro-Magnetic Latching switches with a three-dimensional solenoid coil
JP2003242873A (ja) * 2002-02-19 2003-08-29 Fujitsu Component Ltd マイクロリレー
US20030222740A1 (en) 2002-03-18 2003-12-04 Microlab, Inc. Latching micro-magnetic switch with improved thermal reliability
JP4020120B2 (ja) * 2002-07-31 2007-12-12 松下電工株式会社 マイクロリレー
US7123119B2 (en) * 2002-08-03 2006-10-17 Siverta, Inc. Sealed integral MEMS switch
US7551048B2 (en) 2002-08-08 2009-06-23 Fujitsu Component Limited Micro-relay and method of fabricating the same
JP4730750B2 (ja) * 2002-08-08 2011-07-20 富士通コンポーネント株式会社 マイクロリレー
WO2004027799A2 (en) 2002-09-18 2004-04-01 Magfusion, Inc. Method of assembling a laminated electro-mechanical structure
US20040121505A1 (en) 2002-09-30 2004-06-24 Magfusion, Inc. Method for fabricating a gold contact on a microswitch
KR100893893B1 (ko) * 2002-12-02 2009-04-20 삼성전자주식회사 점착현상을 방지할 수 있는 rf mems 스위치
US7202765B2 (en) 2003-05-14 2007-04-10 Schneider Electric Industries Sas Latchable, magnetically actuated, ground plane-isolated radio frequency microswitch
US7432788B2 (en) * 2003-06-27 2008-10-07 Memscap, Inc. Microelectromechanical magnetic switches having rotors that rotate into a recess in a substrate
US7275424B2 (en) * 2003-09-08 2007-10-02 Analog Devices, Inc. Wafer level capped sensor
US20050054133A1 (en) * 2003-09-08 2005-03-10 Felton Lawrence E. Wafer level capped sensor
US7215229B2 (en) 2003-09-17 2007-05-08 Schneider Electric Industries Sas Laminated relays with multiple flexible contacts
US7183884B2 (en) 2003-10-15 2007-02-27 Schneider Electric Industries Sas Micro magnetic non-latching switches and methods of making same
US20050083157A1 (en) 2003-10-15 2005-04-21 Magfusion, Inc. Micro magnetic latching switches and methods of making same
KR100530010B1 (ko) * 2003-11-13 2005-11-22 한국과학기술원 전자기력과 정전기력을 이용하여 구동하는 토글방식의저전압, 저전력 초고주파 spdt 마이크로 스위치
US20050170609A1 (en) * 2003-12-15 2005-08-04 Alie Susan A. Conductive bond for through-wafer interconnect
US6936918B2 (en) * 2003-12-15 2005-08-30 Analog Devices, Inc. MEMS device with conductive path through substrate
CN1319096C (zh) * 2004-01-16 2007-05-30 北京工业大学 一种微机械电磁继电器及其制备方法
JP4059201B2 (ja) * 2004-01-27 2008-03-12 松下電工株式会社 マイクロリレー
KR100662724B1 (ko) 2004-01-27 2006-12-28 마츠시다 덴코 가부시키가이샤 마이크로 릴레이
US7342473B2 (en) 2004-04-07 2008-03-11 Schneider Electric Industries Sas Method and apparatus for reducing cantilever stress in magnetically actuated relays
EP1756848A4 (en) * 2004-04-12 2009-12-23 Siverta Inc ONE-POLE SWITCH MEMS SWITCH
US7608534B2 (en) * 2004-06-02 2009-10-27 Analog Devices, Inc. Interconnection of through-wafer vias using bridge structures
CN100373516C (zh) * 2004-09-15 2008-03-05 中国科学院上海微系统与信息技术研究所 翘曲膜结构的单刀双掷射频和微波微机械开关及制作方法
CN1305091C (zh) * 2004-11-03 2007-03-14 重庆大学 双稳态电磁微机械继电器
JP2006179252A (ja) * 2004-12-21 2006-07-06 Fujitsu Component Ltd スイッチデバイス
JP5074693B2 (ja) * 2005-01-26 2012-11-14 パナソニック株式会社 微小電気機械デバイス
WO2007021039A1 (ja) * 2005-08-17 2007-02-22 G-Device Corporation 小型傾斜・振動センサとその製造方法
JP2007207498A (ja) * 2006-01-31 2007-08-16 Oki Sensor Device Corp 機構デバイス
US8581678B2 (en) * 2006-07-19 2013-11-12 University Of Florida Research Foundation, Inc. Method and apparatus for electromagnetic actuation
US20080087979A1 (en) * 2006-10-13 2008-04-17 Analog Devices, Inc. Integrated Circuit with Back Side Conductive Paths
FR2909831B1 (fr) * 2006-12-08 2009-01-16 Schneider Electric Ind Sas Dispositif a eclairage variable a diodes electroluminescentes
US20100141366A1 (en) * 2008-12-04 2010-06-10 Microvision, Inc. Magnetically Actuated System
US8836454B2 (en) * 2009-08-11 2014-09-16 Telepath Networks, Inc. Miniature magnetic switch structures
US8159320B2 (en) * 2009-09-14 2012-04-17 Meichun Ruan Latching micro-magnetic relay and method of operating same
US8432240B2 (en) * 2010-07-16 2013-04-30 Telepath Networks, Inc. Miniature magnetic switch structures
US8957747B2 (en) 2010-10-27 2015-02-17 Telepath Networks, Inc. Multi integrated switching device structures
US8941461B2 (en) 2011-02-02 2015-01-27 Tyco Electronics Corporation Three-function reflowable circuit protection device
US9455106B2 (en) * 2011-02-02 2016-09-27 Littelfuse, Inc. Three-function reflowable circuit protection device
WO2013049196A2 (en) 2011-09-30 2013-04-04 Telepath Networks, Inc. Multi integrated switching device structures
JP2017060205A (ja) * 2013-08-01 2017-03-23 インテル・コーポレーション ミラー装置
US10283582B2 (en) * 2013-02-25 2019-05-07 Analog Devices Global Microelectronic circuits and integrated circuits including a non-silicon substrate
CN106291405B (zh) * 2016-08-31 2020-11-24 宁波中车时代传感技术有限公司 一次成型螺线管线圈微型磁通门的制备方法
US10210978B2 (en) * 2017-01-26 2019-02-19 Immersion Corporation Haptic actuator incorporating conductive coil and moving element with magnets
US11170906B2 (en) * 2018-10-31 2021-11-09 Ge-Hitachi Nuclear Energy Americas Llc Passive electrical component for safety system shutdown using Gauss' law of magnetism

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB874965A (en) * 1958-07-09 1961-08-16 G V Planer Ltd Improvements in or relating to electrical circuits or circuit elements
JPS60107229A (ja) * 1983-11-15 1985-06-12 オムロン株式会社 フラツトリレ−
US4668928A (en) * 1986-06-23 1987-05-26 Tektronix, Inc. Bi-stable switch with pivoted armature
US4993787A (en) * 1987-03-13 1991-02-19 Omron Tateisi Electronics Co. Electromagnetic relay
JP2625884B2 (ja) * 1988-05-18 1997-07-02 オムロン株式会社 リレー
DE3914031C2 (de) * 1989-04-28 1993-10-28 Deutsche Aerospace Mikromechanischer Aktuator
JP2713801B2 (ja) * 1990-06-26 1998-02-16 松下電工株式会社 静電リレーおよびその製造方法
JPH056832A (ja) * 1991-06-28 1993-01-14 Toshiba Corp 平面コイルの製造方法
DE4205029C1 (en) * 1992-02-19 1993-02-11 Siemens Ag, 8000 Muenchen, De Micro-mechanical electrostatic relay - has tongue-shaped armature etched from surface of silicon@ substrate
JP2714736B2 (ja) * 1992-06-01 1998-02-16 シャープ株式会社 マイクロリレー
JP2560629B2 (ja) * 1993-12-08 1996-12-04 日本電気株式会社 シリコン超小形リレー

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479529B (zh) * 2011-06-07 2015-04-01 Fujitsu Component Ltd 電磁繼電器及其製造方法

Also Published As

Publication number Publication date
DE69426694D1 (de) 2001-03-22
KR960701459A (ko) 1996-02-24
US5872496A (en) 1999-02-16
EP0685864A1 (en) 1995-12-06
DE69426694T2 (de) 2001-07-05
WO1995017760A1 (fr) 1995-06-29
JP3465940B2 (ja) 2003-11-10
JPH07176255A (ja) 1995-07-14
EP0685864B1 (en) 2001-02-14
EP0685864A4 (en) 1997-10-29
KR100351271B1 (ko) 2002-12-28

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