GB874965A - Improvements in or relating to electrical circuits or circuit elements - Google Patents

Improvements in or relating to electrical circuits or circuit elements

Info

Publication number
GB874965A
GB874965A GB2209658A GB2209658A GB874965A GB 874965 A GB874965 A GB 874965A GB 2209658 A GB2209658 A GB 2209658A GB 2209658 A GB2209658 A GB 2209658A GB 874965 A GB874965 A GB 874965A
Authority
GB
United Kingdom
Prior art keywords
copper
glaze
layer
plate
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2209658A
Inventor
Donald Fulton Alexan Mclachlan
Leopold Samuel Phillips
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GV Planer Ltd
Original Assignee
GV Planer Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GV Planer Ltd filed Critical GV Planer Ltd
Priority to GB2209658A priority Critical patent/GB874965A/en
Publication of GB874965A publication Critical patent/GB874965A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A printed circuit element comprises an insulating base on which first and second conductive layers are formed by evaporation or sputtering at reduced pressure, and a third layer is formed by electroplating. A glass plate is coated with a lead boro-silicate glaze, and the coating bonded to it by heating. The glaze may contain molybdate or the surface may be treated with an aqueous solution of borax and ammonium molybdate. The plate is heated in a vacuum chamber and a film of molybdenum evaporated on to it, followed by a film of copper, after which the plate is heated to near its softening point to consolidate the layers. A further layer of copper is then added by electroplating. The substrate may alternatively consist of silica or ceramic and the glaze coating may be omitted. Other conductors may be used,, e.g. nickel-chromium instead of molybdenum, and gold or silver instead of copper. When copper is used as a third layer, a protective coating of gold formed by an electroless process may be formed on top of it.
GB2209658A 1958-07-09 1958-07-09 Improvements in or relating to electrical circuits or circuit elements Expired GB874965A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB2209658A GB874965A (en) 1958-07-09 1958-07-09 Improvements in or relating to electrical circuits or circuit elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2209658A GB874965A (en) 1958-07-09 1958-07-09 Improvements in or relating to electrical circuits or circuit elements

Publications (1)

Publication Number Publication Date
GB874965A true GB874965A (en) 1961-08-16

Family

ID=10173846

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2209658A Expired GB874965A (en) 1958-07-09 1958-07-09 Improvements in or relating to electrical circuits or circuit elements

Country Status (1)

Country Link
GB (1) GB874965A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3224072A (en) * 1962-01-05 1965-12-21 Bristol Aircraft Ltd Method of forming an electrical connection to an insulating base
DE1257918B (en) * 1962-12-18 1968-01-04 Siemens Ag Integrated circuit
DE1258941B (en) * 1963-01-21 1968-01-18 Ibm Process for making multilayer thin film circuit boards
DE1269695B (en) * 1963-06-13 1968-06-06 Western Electric Co Process for the non-electrolytic deposition of a cobalt layer on an insulating substrate
DE1288174B (en) * 1962-05-25 1969-01-30 Itt Ind Gmbh Deutsche Metallic coating on an insulating base
DE3612261A1 (en) * 1985-04-12 1986-10-16 Hitachi, Ltd., Tokio/Tokyo MULTI-LAYER CERAMIC PCB
EP0386458A1 (en) * 1989-03-04 1990-09-12 Oerlikon-Contraves AG Method for producing thin-film circuits with tin structures
EP0685864A1 (en) * 1993-12-20 1995-12-06 The Nippon Signal Co. Ltd. Planar solenoid relay and production method thereof

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3224072A (en) * 1962-01-05 1965-12-21 Bristol Aircraft Ltd Method of forming an electrical connection to an insulating base
DE1254727B (en) * 1962-01-05 1967-11-23 British Aircraft Corp Ltd Process for making printed wiring
DE1288174B (en) * 1962-05-25 1969-01-30 Itt Ind Gmbh Deutsche Metallic coating on an insulating base
DE1257918B (en) * 1962-12-18 1968-01-04 Siemens Ag Integrated circuit
DE1258941B (en) * 1963-01-21 1968-01-18 Ibm Process for making multilayer thin film circuit boards
DE1269695B (en) * 1963-06-13 1968-06-06 Western Electric Co Process for the non-electrolytic deposition of a cobalt layer on an insulating substrate
DE3612261A1 (en) * 1985-04-12 1986-10-16 Hitachi, Ltd., Tokio/Tokyo MULTI-LAYER CERAMIC PCB
EP0386458A1 (en) * 1989-03-04 1990-09-12 Oerlikon-Contraves AG Method for producing thin-film circuits with tin structures
EP0685864A1 (en) * 1993-12-20 1995-12-06 The Nippon Signal Co. Ltd. Planar solenoid relay and production method thereof
EP0685864A4 (en) * 1993-12-20 1997-10-29 Nippon Signal Co Ltd Planar solenoid relay and production method thereof.

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