DE69121760D1 - Halbleiterspeicherzelle - Google Patents

Halbleiterspeicherzelle

Info

Publication number
DE69121760D1
DE69121760D1 DE69121760T DE69121760T DE69121760D1 DE 69121760 D1 DE69121760 D1 DE 69121760D1 DE 69121760 T DE69121760 T DE 69121760T DE 69121760 T DE69121760 T DE 69121760T DE 69121760 D1 DE69121760 D1 DE 69121760D1
Authority
DE
Germany
Prior art keywords
memory cell
semiconductor memory
semiconductor
cell
memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69121760T
Other languages
English (en)
Other versions
DE69121760T2 (de
Inventor
Tohru Furuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE69121760D1 publication Critical patent/DE69121760D1/de
Publication of DE69121760T2 publication Critical patent/DE69121760T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/403—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh
    • G11C11/404—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh with one charge-transfer gate, e.g. MOS transistor, per cell
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/05—Making the transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/33—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor extending under the transistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Dram (AREA)
  • Semiconductor Memories (AREA)
DE69121760T 1990-04-20 1991-04-18 Halbleiterspeicherzelle Expired - Lifetime DE69121760T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2104576A JPH0834257B2 (ja) 1990-04-20 1990-04-20 半導体メモリセル

Publications (2)

Publication Number Publication Date
DE69121760D1 true DE69121760D1 (de) 1996-10-10
DE69121760T2 DE69121760T2 (de) 1997-02-06

Family

ID=14384265

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69121760T Expired - Lifetime DE69121760T2 (de) 1990-04-20 1991-04-18 Halbleiterspeicherzelle

Country Status (5)

Country Link
US (1) US5525820A (de)
EP (1) EP0453959B1 (de)
JP (1) JPH0834257B2 (de)
KR (1) KR930008008B1 (de)
DE (1) DE69121760T2 (de)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
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DE69225044T2 (de) * 1991-11-18 1998-10-22 Toshiba Kawasaki Kk Dynamische Halbleiterspeicheranordnung
JP3464803B2 (ja) * 1991-11-27 2003-11-10 株式会社東芝 半導体メモリセル
JP3322936B2 (ja) * 1992-03-19 2002-09-09 株式会社東芝 半導体記憶装置
KR950012731A (ko) * 1993-10-25 1995-05-16 사토 후미오 반도체기억장치 및 그 제조방법
US5923829A (en) 1994-08-25 1999-07-13 Ricoh Company, Ltd. Memory system, memory control system and image processing system
JP2783271B2 (ja) * 1995-01-30 1998-08-06 日本電気株式会社 半導体記憶装置
US5936874A (en) 1997-06-19 1999-08-10 Micron Technology, Inc. High density semiconductor memory and method of making
US6229161B1 (en) 1998-06-05 2001-05-08 Stanford University Semiconductor capacitively-coupled NDR device and its applications in high-density high-speed memories and in power switches
US6330181B1 (en) * 1998-09-29 2001-12-11 Texas Instruments Incorporated Method of forming a gate device with raised channel
US6423596B1 (en) 1998-09-29 2002-07-23 Texas Instruments Incorporated Method for two-sided fabrication of a memory array
US6690038B1 (en) 1999-06-05 2004-02-10 T-Ram, Inc. Thyristor-based device over substrate surface
US6300179B1 (en) 1999-09-24 2001-10-09 Texas Instruments Incorporated Gate device with access channel formed in discrete post and method
WO2001073846A1 (en) 2000-03-29 2001-10-04 Hitachi, Ltd. Semiconductor device
US6380576B1 (en) 2000-08-31 2002-04-30 Micron Technology, Inc. Selective polysilicon stud growth
US7456439B1 (en) 2001-03-22 2008-11-25 T-Ram Semiconductor, Inc. Vertical thyristor-based memory with trench isolation and its method of fabrication
US6727528B1 (en) 2001-03-22 2004-04-27 T-Ram, Inc. Thyristor-based device including trench dielectric isolation for thyristor-body regions
US6804162B1 (en) 2001-04-05 2004-10-12 T-Ram, Inc. Read-modify-write memory using read-or-write banks
DE10134101B4 (de) * 2001-07-13 2006-03-23 Infineon Technologies Ag Integrierter Halbleiterspeicher und Herstellungsverfahren
JP3905337B2 (ja) * 2001-07-31 2007-04-18 富士通株式会社 半導体集積回路
US6583452B1 (en) 2001-12-17 2003-06-24 T-Ram, Inc. Thyristor-based device having extended capacitive coupling
US6832300B2 (en) 2002-03-20 2004-12-14 Hewlett-Packard Development Company, L.P. Methods and apparatus for control of asynchronous cache
US6677633B2 (en) 2002-09-24 2004-01-13 Hitachi, Ltd. Semiconductor device
US7332389B2 (en) * 2003-07-02 2008-02-19 Micron Technology, Inc. Selective polysilicon stud growth
US20060278912A1 (en) * 2004-09-02 2006-12-14 Luan Tran Selective polysilicon stud growth
FR2904464A1 (fr) * 2006-07-27 2008-02-01 St Microelectronics Sa Circuit eeprom de retention de charges pour mesure temporelle
JP5377306B2 (ja) * 2006-07-27 2013-12-25 エス テ マイクロエレクトロニクス エス アー 時間測定のための電荷保持回路
WO2008012462A2 (fr) * 2006-07-27 2008-01-31 Stmicroelectronics Sa Circuit de lecture d'un element de retention de charges pour mesure temporelle
FR2904463A1 (fr) * 2006-07-27 2008-02-01 St Microelectronics Sa Programmation d'un circuit de retention de charges pour mesure temporelle
US8467232B2 (en) * 2010-08-06 2013-06-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8520426B2 (en) * 2010-09-08 2013-08-27 Semiconductor Energy Laboratory Co., Ltd. Method for driving semiconductor device
US8854865B2 (en) * 2010-11-24 2014-10-07 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device
TWI415247B (zh) * 2010-12-15 2013-11-11 Powerchip Technology Corp 具有垂直通道電晶體的動態隨機存取記憶胞及陣列
US10600469B2 (en) * 2017-06-26 2020-03-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
US11374012B2 (en) 2017-07-06 2022-06-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method of semiconductor device
JP7266728B2 (ja) * 2020-04-16 2023-04-28 株式会社半導体エネルギー研究所 半導体装置
CN114188320A (zh) 2020-09-14 2022-03-15 长鑫存储技术有限公司 半导体结构和半导体结构的制造方法
US20220085027A1 (en) * 2020-09-14 2022-03-17 Changxin Memory Technologies, Inc. Semiconductor structure and semiconductor structure manufacturing method

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6807435A (de) * 1968-05-25 1969-11-27
US3763480A (en) * 1971-10-12 1973-10-02 Rca Corp Digital and analog data handling devices
DE2634089C3 (de) * 1975-08-11 1988-09-08 Nippon Telegraph And Telephone Corp., Tokio/Tokyo Schaltungsanordnung zum Erfassen schwacher Signale
US4225945A (en) * 1976-01-12 1980-09-30 Texas Instruments Incorporated Random access MOS memory cell using double level polysilicon
FR2420688A1 (fr) * 1978-03-22 1979-10-19 Glaenzer Spicer Sa Perfectionnements aux joints homocinetiques tripodes a retenue axiale
JPS5848294A (ja) * 1981-09-16 1983-03-22 Mitsubishi Electric Corp Ｍｏｓダイナミツクメモリ
US4669063A (en) * 1982-12-30 1987-05-26 Thomson Components-Mostek Corp. Sense amplifier for a dynamic RAM
JPS60209996A (ja) * 1984-03-31 1985-10-22 Toshiba Corp 半導体記憶装置
JPH0793009B2 (ja) * 1984-12-13 1995-10-09 株式会社東芝 半導体記憶装置
US4648073A (en) * 1984-12-31 1987-03-03 International Business Machines Corporation Sequential shared access lines memory cells
JPS62197989A (ja) * 1986-02-26 1987-09-01 Hitachi Ltd 半導体記憶装置
JPS63149900A (ja) * 1986-12-15 1988-06-22 Toshiba Corp 半導体メモリ
US4980863A (en) * 1987-03-31 1990-12-25 Kabushiki Kaisha Toshiba Semiconductor memory device having switching circuit for coupling together two pairs of bit lines
JPH01134796A (ja) * 1987-11-19 1989-05-26 Mitsubishi Electric Corp 不揮発性半導体記憶装置
US4943944A (en) * 1987-11-25 1990-07-24 Kabushiki Kaisha Toshiba Semiconductor memory using dynamic ram cells
JPH01204298A (ja) * 1988-02-08 1989-08-16 Fujitsu Ltd 半導体記憶回路
JP2682021B2 (ja) * 1988-06-29 1997-11-26 富士通株式会社 半導体メモリ装置
US5091761A (en) * 1988-08-22 1992-02-25 Hitachi, Ltd. Semiconductor device having an arrangement of IGFETs and capacitors stacked thereover
JP2633645B2 (ja) * 1988-09-13 1997-07-23 株式会社東芝 半導体メモリ装置
US5172198A (en) * 1989-02-22 1992-12-15 Kabushiki Kaisha Toshiba MOS type semiconductor device
ATE117457T1 (de) * 1989-03-16 1995-02-15 Siemens Ag Integrierter halbleiterspeicher vom typ dram und verfahren zu seinem testen.
JPH0762955B2 (ja) * 1989-05-15 1995-07-05 株式会社東芝 ダイナミック型ランダムアクセスメモリ
JPH02301097A (ja) * 1989-05-15 1990-12-13 Toshiba Corp ダイナミック型ランダムアクセスメモリ
JPH0358377A (ja) * 1989-07-24 1991-03-13 Mitsubishi Electric Corp ダイナミックｒａｍ用メモリセル回路
DE4015472C2 (de) * 1989-05-16 1993-12-02 Mitsubishi Electric Corp Speicherzelle und Verfahren zum Herstellen eines dynamischen RAM
JPH0369092A (ja) * 1989-05-16 1991-03-25 Mitsubishi Electric Corp ダイナミックｒａｍ用メモリセル回路

Also Published As

Publication number Publication date
EP0453959B1 (de) 1996-09-04
DE69121760T2 (de) 1997-02-06
KR930008008B1 (ko) 1993-08-25
JPH043463A (ja) 1992-01-08
EP0453959A2 (de) 1991-10-30
JPH0834257B2 (ja) 1996-03-29
US5525820A (en) 1996-06-11
KR910019198A (ko) 1991-11-30
EP0453959A3 (en) 1992-10-28

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Legal Events

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8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)