DE68917398D1 - Integrierte Schaltungshalbleiteranordnung mit verbesserter Einrichtung für Speiseleitungen. - Google Patents

Integrierte Schaltungshalbleiteranordnung mit verbesserter Einrichtung für Speiseleitungen.

Info

Publication number
DE68917398D1
DE68917398D1 DE68917398T DE68917398T DE68917398D1 DE 68917398 D1 DE68917398 D1 DE 68917398D1 DE 68917398 T DE68917398 T DE 68917398T DE 68917398 T DE68917398 T DE 68917398T DE 68917398 D1 DE68917398 D1 DE 68917398D1
Authority
DE
Germany
Prior art keywords
integrated circuit
feed lines
improved device
semiconductor arrangement
circuit semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68917398T
Other languages
English (en)
Other versions
DE68917398T2 (de
Inventor
Takeshi Yamamura
Seiji Endo
Kazuyuki Kawauchi
Hiroki Korenaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE68917398D1 publication Critical patent/DE68917398D1/de
Publication of DE68917398T2 publication Critical patent/DE68917398T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118—Masterslice integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H01L23/5286—Arrangements of power or ground buses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
DE68917398T 1988-09-19 1989-09-15 Integrierte Schaltungshalbleiteranordnung mit verbesserter Einrichtung für Speiseleitungen. Expired - Fee Related DE68917398T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63234161A JP2668981B2 (ja) 1988-09-19 1988-09-19 半導体集積回路

Publications (2)

Publication Number Publication Date
DE68917398D1 true DE68917398D1 (de) 1994-09-15
DE68917398T2 DE68917398T2 (de) 1994-12-01

Family

ID=16966615

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68917398T Expired - Fee Related DE68917398T2 (de) 1988-09-19 1989-09-15 Integrierte Schaltungshalbleiteranordnung mit verbesserter Einrichtung für Speiseleitungen.

Country Status (5)

Country Link
US (1) US5008728A (de)
EP (1) EP0360507B1 (de)
JP (1) JP2668981B2 (de)
KR (1) KR920010982B1 (de)
DE (1) DE68917398T2 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5349219A (en) * 1989-06-15 1994-09-20 Fujitsu Limited Wafer-scale semiconductor integrated circuit device and method of forming interconnection lines arranged between chips of wafer-scale semiconductor integrated circuit device
JP2936542B2 (ja) * 1990-01-30 1999-08-23 株式会社日立製作所 電源幹線のレイアウト方法
US6759732B1 (en) 1990-04-24 2004-07-06 Seiko Epson Corporation Semiconductor device with circuit cell array and arrangement on a semiconductor chip
JP3293135B2 (ja) * 1990-04-24 2002-06-17 セイコーエプソン株式会社 回路セル・アレイを備えた半導体装置
US5300790A (en) * 1990-06-15 1994-04-05 Seiko Epson Corporation Semiconductor device
US5321280A (en) * 1990-09-13 1994-06-14 Nec Corporation Composite semiconductor integrated circuit device
US5283753A (en) * 1991-07-25 1994-02-01 Motorola, Inc. Firm function block for a programmable block architected heterogeneous integrated circuit
US5155390A (en) * 1991-07-25 1992-10-13 Motorola, Inc. Programmable block architected heterogeneous integrated circuit
JP2742735B2 (ja) * 1991-07-30 1998-04-22 三菱電機株式会社 半導体集積回路装置およびそのレイアウト設計方法
JP3052519B2 (ja) * 1992-01-14 2000-06-12 日本電気株式会社 集積回路の電源配線設計方法
US5313079A (en) * 1992-06-22 1994-05-17 Vlsi Technology, Inc. Gate array bases with flexible routing
US5508938A (en) * 1992-08-13 1996-04-16 Fujitsu Limited Special interconnect layer employing offset trace layout for advanced multi-chip module packages
JP2732762B2 (ja) * 1992-09-21 1998-03-30 株式会社東芝 半導体記憶装置
JPH0864768A (ja) * 1994-08-18 1996-03-08 Nec Corp 半導体集積回路装置
US5663677A (en) * 1995-03-30 1997-09-02 Lucent Technologies Inc. Integrated circuit multi-level interconnection technique
JP3432963B2 (ja) * 1995-06-15 2003-08-04 沖電気工業株式会社 半導体集積回路
JPH10189749A (ja) * 1996-12-27 1998-07-21 Toshiba Corp 半導体集積回路装置、半導体集積回路装置の多電源供給方法、半導体集積回路装置の多電源供給プログラムを記録した機械読み取り可能な記録媒体
US6683336B1 (en) 1996-12-27 2004-01-27 Kabushiki Kaisha Toshiba Semiconductor integrated circuit, supply method for supplying multiple supply voltages in semiconductor integrated circuit, and record medium for storing program of supply method for supplying multiple supply voltages in semiconductor integrated circuit
KR100390464B1 (ko) * 2000-09-27 2003-07-04 한국과학기술연구원 초미립 유전체 세라믹 조성물
KR100406646B1 (ko) * 2000-10-07 2003-11-21 한국과학기술연구원 고분자 매트릭스를 이용한 완화형 강유전체 세라믹스 후막 제조방법
JP4737870B2 (ja) * 2001-05-30 2011-08-03 東芝モバイルディスプレイ株式会社 液晶表示装置
JP3786608B2 (ja) * 2002-01-28 2006-06-14 株式会社ルネサステクノロジ 半導体集積回路装置
JP3964295B2 (ja) * 2002-09-18 2007-08-22 松下電器産業株式会社 集積回路設計における電源経路構造
JP3790202B2 (ja) 2002-09-24 2006-06-28 松下電器産業株式会社 半導体集積回路の電源配線方法および半導体集積回路
JP2004134599A (ja) * 2002-10-11 2004-04-30 Renesas Technology Corp 半導体装置、およびそのレイアウト方法
US6744081B2 (en) * 2002-10-30 2004-06-01 Lsi Logic Corporation Interleaved termination ring
KR100615579B1 (ko) * 2004-09-20 2006-08-25 삼성전자주식회사 반도체 메모리 장치 및 이 장치의 파워 라인 배치 방법
JP5237739B2 (ja) 2008-09-29 2013-07-17 株式会社日立製作所 情報処理装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5694644A (en) * 1979-12-27 1981-07-31 Hitachi Ltd Semiconductor ic device
JPS577140A (en) * 1980-06-16 1982-01-14 Pioneer Electronic Corp Circuit device having plurality of circuit blocks
JPS57121250A (en) * 1981-01-20 1982-07-28 Toshiba Corp Semiconductor integrated circuit
JPS58142559A (ja) * 1982-02-19 1983-08-24 Hitachi Ltd 半導体集積回路装置
US4568961A (en) * 1983-03-11 1986-02-04 Rca Corporation Variable geometry automated universal array
JPS59207641A (ja) * 1983-05-11 1984-11-24 Hitachi Ltd 集積回路
JPS60101951A (ja) * 1983-11-08 1985-06-06 Sanyo Electric Co Ltd ゲ−トアレイ
DE3585756D1 (de) * 1984-07-02 1992-05-07 Fujitsu Ltd Halbleiterschaltungsanordnung in hauptscheibentechnik.
JPS61194739A (ja) * 1985-02-22 1986-08-29 Toshiba Corp マスタ−スライス型半導体装置
JPH0785490B2 (ja) * 1986-01-22 1995-09-13 日本電気株式会社 集積回路装置
JPH07123139B2 (ja) * 1986-03-28 1995-12-25 株式会社東芝 半導体論理集積回路装置のレイアウト方法
JPS6395653A (ja) * 1986-10-13 1988-04-26 Nippon Telegr & Teleph Corp <Ntt> 半導体集積回路電源供給方式
JPS63152163A (ja) * 1986-12-17 1988-06-24 Hitachi Ltd 半導体集積回路装置
JP2606845B2 (ja) * 1987-06-19 1997-05-07 富士通株式会社 半導体集積回路
JPS644055A (en) * 1987-06-25 1989-01-09 Nec Corp Construction of semiconductor integrated circuit
JPH073840B2 (ja) * 1987-08-31 1995-01-18 株式会社東芝 半導体集積回路

Also Published As

Publication number Publication date
KR900005443A (ko) 1990-04-14
US5008728A (en) 1991-04-16
DE68917398T2 (de) 1994-12-01
JP2668981B2 (ja) 1997-10-27
EP0360507B1 (de) 1994-08-10
EP0360507A3 (de) 1991-05-08
KR920010982B1 (ko) 1992-12-26
EP0360507A2 (de) 1990-03-28
JPH0282552A (ja) 1990-03-23

Similar Documents

Publication Publication Date Title
DE68917398T2 (de) Integrierte Schaltungshalbleiteranordnung mit verbesserter Einrichtung für Speiseleitungen.
DE3879804D1 (de) Integrierte halbleiterschaltungsvorrichtung.
DE68912640D1 (de) Ausgangsschaltung für eine integrierte Halbleiterschaltung mit reduziertem Speiseleitungsrauschen.
DE68918775T2 (de) Chip-auf-Chip-Verbindungsschema für integrierte Halbleiterschaltungen.
DE3482014D1 (de) Integrierte halbleiterschaltungsanordnung mit verbindungsmaterial.
DE69023541D1 (de) Kontaktstruktur für integrierte Halbleiterschaltung.
DE3886273D1 (de) Integrierte Halbleiterschaltungsanordnung mit Mehrschicht-Stromversorgungsleitungen.
DE3786683T2 (de) Zeitverzögerungsschaltung für Halbleitervorrichtung.
DE3888880T2 (de) Träger für einen Halbleiterapparat.
DE68921088T2 (de) Integrierte Halbleiterschaltung.
DE3885268T2 (de) Verdrahtungsleiter für Halbleiteranordnung.
DE69016509T2 (de) Integrierte Halbleiterschaltungsanordnung mit Testschaltung.
DE3879813T2 (de) Integrierte Halbleiterschaltung mit Signallinien.
DE3485592D1 (de) Integrierte halbleiterschaltungsanordnung.
DE3884492D1 (de) Integrierte halbleiterschaltungsanordnung.
DE3787357T2 (de) Steuerschaltung für Halbleiterspeicher.
DE3486077D1 (de) Integrierte halbleiterschaltungsanordnung.
DE68907451T2 (de) Ausgangstreiberschaltung für Halbleiter-IC.
DE3481958D1 (de) Integrierte halbleiterschaltungsanordnung.
DE3581159D1 (de) Halbleiteranordnung mit integrierter schaltung.
DE3867587D1 (de) Halbleiterschaltungsvorrichtung.
DE3584102D1 (de) Integrierte halbleiterschaltungsvorrichtung.
DE68912794T2 (de) Integrierte Halbleiterschaltung.
DE68910445T2 (de) Integrierter Halbleiterschaltkreis.
DE3581632D1 (de) Integrierte halbleiter-schaltungsvorrichtung mit mehrschichtverdrahtung.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee