DE60238951D1 - Magnetsensor und verfahren zur kompensation temperaturabhängiger eigenschaften desselben - Google Patents

Magnetsensor und verfahren zur kompensation temperaturabhängiger eigenschaften desselben

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Publication number
DE60238951D1
DE60238951D1 DE60238951T DE60238951T DE60238951D1 DE 60238951 D1 DE60238951 D1 DE 60238951D1 DE 60238951 T DE60238951 T DE 60238951T DE 60238951 T DE60238951 T DE 60238951T DE 60238951 D1 DE60238951 D1 DE 60238951D1
Authority
DE
Germany
Prior art keywords
elements
magnetic sensor
heating coils
dependent properties
compensating temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60238951T
Other languages
English (en)
Inventor
Hideki Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Corp
Original Assignee
Yamaha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Corp filed Critical Yamaha Corp
Application granted granted Critical
Publication of DE60238951D1 publication Critical patent/DE60238951D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C17/00—Compasses; Devices for ascertaining true or magnetic north for navigation or surveying purposes
    • G01C17/38—Testing, calibrating, or compensating of compasses
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/0005—Geometrical arrangement of magnetic sensor elements; Apparatus combining different magnetic sensor types
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/0064—Arrangements or instruments for measuring magnetic variables comprising means for performing simulations, e.g. of the magnetic variable to be measured
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/0206—Three-component magnetometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09—Magnetoresistive devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09—Magnetoresistive devices
    • G01R33/091—Constructional adaptation of the sensor to specific applications
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09—Magnetoresistive devices
    • G01R33/093—Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
DE60238951T 2002-11-29 2002-11-29 Magnetsensor und verfahren zur kompensation temperaturabhängiger eigenschaften desselben Expired - Lifetime DE60238951D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2002/012476 WO2004051298A1 (ja) 2002-11-29 2002-11-29 磁気センサ、及び磁気センサの温度依存特性補償方法

Publications (1)

Publication Number Publication Date
DE60238951D1 true DE60238951D1 (de) 2011-02-24

Family

ID=32375632

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60238951T Expired - Lifetime DE60238951D1 (de) 2002-11-29 2002-11-29 Magnetsensor und verfahren zur kompensation temperaturabhängiger eigenschaften desselben

Country Status (14)

Country Link
US (5) US7053607B2 (de)
EP (2) EP1566649B1 (de)
JP (1) JP4333582B2 (de)
CN (3) CN1695066A (de)
AT (1) ATE495458T1 (de)
AU (1) AU2002349615B2 (de)
BR (1) BR0215939A (de)
CA (1) CA2507819C (de)
DE (1) DE60238951D1 (de)
HK (1) HK1080148A1 (de)
MX (1) MXPA05005676A (de)
RU (3) RU2303791C2 (de)
TW (1) TWI251083B (de)
WO (1) WO2004051298A1 (de)

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Also Published As

Publication number Publication date
US7573262B2 (en) 2009-08-11
US20060103379A1 (en) 2006-05-18
EP1566649B1 (de) 2011-01-12
US7053607B2 (en) 2006-05-30
HK1080148A1 (zh) 2006-04-21
EP2226644A1 (de) 2010-09-08
TWI251083B (en) 2006-03-11
US7268545B2 (en) 2007-09-11
US7262598B2 (en) 2007-08-28
JPWO2004051298A1 (ja) 2006-04-06
RU2331900C1 (ru) 2008-08-20
RU2303791C2 (ru) 2007-07-27
CA2507819A1 (en) 2004-06-17
CN1695066A (zh) 2005-11-09
CN101308198A (zh) 2008-11-19
US20060164079A1 (en) 2006-07-27
EP1566649A4 (de) 2009-08-05
US20060097721A1 (en) 2006-05-11
EP1566649A1 (de) 2005-08-24
ATE495458T1 (de) 2011-01-15
US7372260B2 (en) 2008-05-13
TW200424546A (en) 2004-11-16
MXPA05005676A (es) 2005-10-18
AU2002349615A1 (en) 2004-06-23
BR0215939A (pt) 2005-09-06
CN2800289Y (zh) 2006-07-26
US20040104724A1 (en) 2004-06-03
WO2004051298A1 (ja) 2004-06-17
RU2005120389A (ru) 2006-01-20
CA2507819C (en) 2010-09-14
US20060290348A1 (en) 2006-12-28
AU2002349615B2 (en) 2008-04-03
JP4333582B2 (ja) 2009-09-16
RU2334241C1 (ru) 2008-09-20

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