ATE495458T1 - Magnetsensor und verfahren zur kompensation temperaturabhängiger eigenschaften desselben - Google Patents
Magnetsensor und verfahren zur kompensation temperaturabhängiger eigenschaften desselbenInfo
- Publication number
- ATE495458T1 ATE495458T1 AT02783685T AT02783685T ATE495458T1 AT E495458 T1 ATE495458 T1 AT E495458T1 AT 02783685 T AT02783685 T AT 02783685T AT 02783685 T AT02783685 T AT 02783685T AT E495458 T1 ATE495458 T1 AT E495458T1
- Authority
- AT
- Austria
- Prior art keywords
- elements
- magnetic sensor
- heating coils
- same
- dependent properties
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C17/00—Compasses; Devices for ascertaining true or magnetic north for navigation or surveying purposes
- G01C17/38—Testing, calibrating, or compensating of compasses
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/0005—Geometrical arrangement of magnetic sensor elements; Apparatus combining different magnetic sensor types
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/0064—Arrangements or instruments for measuring magnetic variables comprising means for performing simulations, e.g. of the magnetic variable to be measured
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/0206—Three-component magnetometers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
- G01R33/091—Constructional adaptation of the sensor to specific applications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
- G01R33/093—Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/59—Bond pads specially adapted therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Crystallography & Structural Chemistry (AREA)
- Measuring Magnetic Variables (AREA)
- Hall/Mr Elements (AREA)
- Indication And Recording Devices For Special Purposes And Tariff Metering Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2002/012476 WO2004051298A1 (ja) | 2002-11-29 | 2002-11-29 | 磁気センサ、及び磁気センサの温度依存特性補償方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE495458T1 true ATE495458T1 (de) | 2011-01-15 |
Family
ID=32375632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT02783685T ATE495458T1 (de) | 2002-11-29 | 2002-11-29 | Magnetsensor und verfahren zur kompensation temperaturabhängiger eigenschaften desselben |
Country Status (14)
| Country | Link |
|---|---|
| US (5) | US7053607B2 (de) |
| EP (2) | EP1566649B1 (de) |
| JP (1) | JP4333582B2 (de) |
| CN (3) | CN1695066A (de) |
| AT (1) | ATE495458T1 (de) |
| AU (1) | AU2002349615B2 (de) |
| BR (1) | BR0215939A (de) |
| CA (1) | CA2507819C (de) |
| DE (1) | DE60238951D1 (de) |
| HK (1) | HK1080148A1 (de) |
| MX (1) | MXPA05005676A (de) |
| RU (3) | RU2303791C2 (de) |
| TW (1) | TWI251083B (de) |
| WO (1) | WO2004051298A1 (de) |
Families Citing this family (71)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5055704B2 (ja) * | 2004-03-29 | 2012-10-24 | ヤマハ株式会社 | 半導体装置の製造方法 |
| CN100370580C (zh) | 2004-03-29 | 2008-02-20 | 雅马哈株式会社 | 半导体晶片及其制造方法 |
| KR100601956B1 (ko) * | 2004-06-28 | 2006-07-14 | 삼성전자주식회사 | 자기장의 변화를 이용한 온도측정장치 |
| JP4023476B2 (ja) * | 2004-07-14 | 2007-12-19 | 日立金属株式会社 | スピンバルブ型巨大磁気抵抗効果素子を持った方位計 |
| DE102004043737A1 (de) * | 2004-09-09 | 2006-03-30 | Siemens Ag | Vorrichtung zum Erfassen des Gradienten eines Magnetfeldes und Verfahren zur Herstellung der Vorrichtung |
| US7437257B2 (en) * | 2004-10-07 | 2008-10-14 | Yamaha Corporation | Geomagnetic sensor and geomagnetic sensor correction method, temperature sensor and temperature sensor correction method, geomagnetism detection device |
| KR100933834B1 (ko) * | 2004-10-07 | 2009-12-24 | 야마하 가부시키가이샤 | 지자기 검출 장치 |
| JP4945995B2 (ja) * | 2004-10-12 | 2012-06-06 | ヤマハ株式会社 | 地磁気検出装置 |
| KR100768919B1 (ko) * | 2004-12-23 | 2007-10-19 | 삼성전자주식회사 | 전원 생성 장치 |
| TWI361503B (en) * | 2005-03-17 | 2012-04-01 | Yamaha Corp | Three-axis magnetic sensor and manufacturing method therefor |
| EP1860450B1 (de) * | 2005-03-17 | 2011-06-08 | Yamaha Corporation | Magnetsensor und herstellungsverfahren dafür |
| KR100771861B1 (ko) * | 2005-05-26 | 2007-11-01 | 삼성전자주식회사 | 하드디스크 드라이브에 구비된 mr센서의 도메인 특성개선 방법 및 이에 적합한 프로그램을 기록한 기록 매체 |
| JP4857628B2 (ja) * | 2005-07-12 | 2012-01-18 | ヤマハ株式会社 | 磁気センサモジュールの検査方法 |
| JP4624227B2 (ja) * | 2005-09-29 | 2011-02-02 | 京セラ株式会社 | 通信端末、移動体通信システム及び通信制御方法 |
| US7511990B2 (en) * | 2005-09-30 | 2009-03-31 | Everspin Technologies, Inc. | Magnetic tunnel junction temperature sensors |
| ATE434189T1 (de) * | 2006-03-09 | 2009-07-15 | Teradyne Inc | V/i-quelle und testsystem damit |
| US20080013298A1 (en) * | 2006-07-14 | 2008-01-17 | Nirmal Sharma | Methods and apparatus for passive attachment of components for integrated circuits |
| EP2060926B1 (de) * | 2006-07-26 | 2013-01-02 | Alps Electric Co., Ltd. | Magnetsensor |
| US7633039B2 (en) * | 2006-08-31 | 2009-12-15 | Infineon Technologies Ag | Sensor device and a method for manufacturing the same |
| US8192080B2 (en) * | 2007-01-23 | 2012-06-05 | Tsi Technologies Llc | Microwire-controlled autoclave and method |
| WO2008114615A1 (ja) * | 2007-03-20 | 2008-09-25 | Alps Electric Co., Ltd. | 磁気抵抗効果素子を用いた位置検知装置 |
| US8538318B2 (en) * | 2007-04-23 | 2013-09-17 | Pure Imagination, LLC | Apparatus and methods for an interactive electronic book system |
| US7825656B2 (en) | 2007-05-30 | 2010-11-02 | Infineon Technologies Ag | Temperature compensation for spaced apart sensors |
| US8989779B1 (en) * | 2007-10-26 | 2015-03-24 | Cellco Partnership | Venue-based device control and determination |
| WO2009060651A1 (ja) * | 2007-11-08 | 2009-05-14 | Sankyo Electric Co., Ltd. | 車両検知方法、車両検知ユニット及び車両検知装置 |
| JP4626728B2 (ja) * | 2009-03-26 | 2011-02-09 | 愛知製鋼株式会社 | 磁気検出装置 |
| US20110267048A1 (en) * | 2010-04-29 | 2011-11-03 | Alexandre Bratkovski | Magnetically sensitive devices |
| IT1402178B1 (it) * | 2010-09-09 | 2013-08-28 | St Microelectronics Srl | Circuito di lettura a compensazione automatica dell'offset per un sensore di campo magnetico e relativo metodo di lettura a compensazione automatica dell'offset |
| US9013175B2 (en) | 2010-11-26 | 2015-04-21 | Stmicroelectronics S.R.L. | Reading circuit for a magnetic field sensor with sensitivity calibration, and related reading method |
| CN202230192U (zh) * | 2011-03-03 | 2012-05-23 | 江苏多维科技有限公司 | 推挽桥式磁电阻传感器 |
| CN102297652B (zh) * | 2011-03-03 | 2012-12-05 | 江苏多维科技有限公司 | 一种独立封装的磁电阻角度传感器 |
| JP5397496B2 (ja) * | 2011-05-30 | 2014-01-22 | 株式会社デンソー | 磁気センサ装置およびその製造方法 |
| US9024632B2 (en) | 2011-05-30 | 2015-05-05 | Denso Corporation | Magnetic sensor with a plurality of heater portions to fix the direction of magnetization of a pinned magnetic layer |
| RU2478219C1 (ru) * | 2011-10-11 | 2013-03-27 | федеральное государственное бюджетное учреждение "Научно-производственный комплекс "Технологический центр "МИЭТ" | Профилированный магниторезистивный микрочип биосенсорного устройства |
| US9395391B2 (en) * | 2013-03-15 | 2016-07-19 | Allegro Microsystems, Llc | Magnetic field sensor and associated method that can store a measured threshold value in a memory device during a time when the magnetic field sensor is powered off |
| US9046556B2 (en) | 2012-06-14 | 2015-06-02 | Freescale Semiconductor Inc. | Sensing device and related operating methods |
| US9651981B2 (en) * | 2012-08-09 | 2017-05-16 | Infineon Technologies Austria Ag | Integrated chip with heating element and reference circuit |
| JP6089572B2 (ja) * | 2012-10-18 | 2017-03-08 | ヤマハ株式会社 | 磁気抵抗効果素子のリセット回路 |
| CN103997341B (zh) * | 2013-02-16 | 2017-12-19 | 苏州市灵矽微系统有限公司 | 一种应用于地磁测量的高精度adc及其模拟前端电路 |
| CN103267520B (zh) * | 2013-05-21 | 2016-09-14 | 江苏多维科技有限公司 | 一种三轴数字指南针 |
| US9671486B2 (en) * | 2013-06-18 | 2017-06-06 | Infineon Technologies Ag | Sensors, systems and methods for compensating for thermal EMF |
| JP6344908B2 (ja) * | 2013-12-03 | 2018-06-20 | 日本電産サンキョー株式会社 | センサ装置およびセンサ装置での温度制御方法 |
| RU2563600C1 (ru) * | 2014-07-29 | 2015-09-20 | Федеральное государственное автономное образовательное учреждение высшего профессионального образования "Национальный исследовательский технологический университет "МИСиС" | Сверхчувствительный интеллектуальный магнитоимпедансный датчик с расширенным диапазоном рабочих температур |
| EP3023803B1 (de) * | 2014-11-19 | 2020-03-18 | Crocus Technology S.A. | MLU-Messzelle zur Abtastung eines externen Magnetfeldes und magnetische Sensorvorrichtung mit der MLU-Zelle |
| DE102015206840B4 (de) * | 2015-04-16 | 2024-08-08 | Bayerische Motoren Werke Aktiengesellschaft | Thermisch überwachte Ladevorrichtung |
| JP6619974B2 (ja) * | 2015-08-28 | 2019-12-11 | 日本電産サンキョー株式会社 | エンコーダ |
| JP6634277B2 (ja) * | 2015-12-04 | 2020-01-22 | 日本電産サンキョー株式会社 | 位置検出装置 |
| RU2610932C1 (ru) * | 2015-12-10 | 2017-02-17 | Акционерное общество "Раменское приборостроительное конструкторское бюро" | Способ определения температурных характеристик трёхкомпонентного магнитометра и устройство для его осуществления |
| CN110345971B (zh) * | 2015-12-14 | 2021-12-14 | 英飞凌科技股份有限公司 | 具有热电动势补偿的传感器布置 |
| CN205581283U (zh) * | 2016-04-11 | 2016-09-14 | 江苏多维科技有限公司 | 一种具有初始化线圈封装的磁电阻传感器 |
| JP6808565B2 (ja) * | 2017-04-07 | 2021-01-06 | ルネサスエレクトロニクス株式会社 | 半導体装置、それを備えた電子回路、及び、半導体装置の形成方法 |
| CN110582705A (zh) * | 2017-05-01 | 2019-12-17 | 小利兰·斯坦福大学托管委员会 | 用于在gmr生物传感器阵列上进行准确的温度测量的方法 |
| JP6620796B2 (ja) * | 2017-07-28 | 2019-12-18 | Tdk株式会社 | オフセット推定装置および方法、磁気センサの補正装置ならびに電流センサ |
| DE102017220684A1 (de) * | 2017-11-20 | 2019-05-23 | Robert Bosch Gmbh | Detektion der Funktionsfähigkeit eines Aktuators mittels einem Mobilgerät |
| WO2019111766A1 (ja) * | 2017-12-04 | 2019-06-13 | 株式会社村田製作所 | 磁気センサ |
| CN109368587A (zh) * | 2018-10-30 | 2019-02-22 | 杭州士兰集成电路有限公司 | 地磁传感器件及其制造方法 |
| DE102019101931B4 (de) * | 2019-01-25 | 2024-08-01 | Tdk-Micronas Gmbh | Sensorvorrichtung |
| CN109941956B (zh) * | 2019-02-25 | 2021-11-12 | 潍坊歌尔微电子有限公司 | Mems传感器及电子设备 |
| CN110345938B (zh) * | 2019-06-25 | 2021-08-31 | 潍坊歌尔微电子有限公司 | 一种晶圆级的磁传感器及电子设备 |
| RU193375U1 (ru) * | 2019-07-16 | 2019-10-28 | федеральное государственное бюджетное образовательное учреждение высшего образования "Ивановский государственный энергетический университет имени В.И. Ленина" (ИГЭУ) | Датчик внешнего магнитного поля |
| WO2021141636A1 (en) * | 2020-01-08 | 2021-07-15 | Invensense, Inc. | Method and system for sensor configuration |
| US11367830B2 (en) * | 2020-09-08 | 2022-06-21 | Allegro Microsystems, Llc | Multi-layer integrated circuit with enhanced thermal dissipation using back-end metal layers |
| US11965939B2 (en) | 2021-04-12 | 2024-04-23 | Samsung Electronics Co., Ltd. | Electronic device compensating for geomagnetic sensing data and method for controlling the same |
| DE102022124051A1 (de) | 2021-09-21 | 2023-03-23 | Tdk Corporation | Magnetsensor |
| US11598830B1 (en) | 2022-03-04 | 2023-03-07 | Allegro Microsystems, Llc | TMR assembly having a heat sink |
| JP2023130839A (ja) * | 2022-03-08 | 2023-09-21 | ソニーセミコンダクタソリューションズ株式会社 | 記憶装置、電子機器及び記憶装置の制御方法 |
| CN117615635A (zh) * | 2022-08-22 | 2024-02-27 | 迈来芯电子科技有限公司 | 磁传感器器件以及生产磁传感器器件的方法 |
| WO2024048743A1 (ja) * | 2022-09-02 | 2024-03-07 | 愛知製鋼株式会社 | 磁気センサ装置 |
| CN115628322B (zh) * | 2022-10-26 | 2023-05-16 | 南京市锅炉压力容器检验研究院 | 一种易熔合金塞的智能控制方法 |
| CN118884022B (zh) * | 2024-07-11 | 2025-03-21 | 珠海多创科技有限公司 | 一种电流测量方法、电流测量装置及计算机设备 |
| DE102024209814A1 (de) * | 2024-10-09 | 2026-04-09 | Robert Bosch Gesellschaft mit beschränkter Haftung | Magnetsensorvorrichtung und Herstellungsverfahren für eine Magnetsensorvorrichtung |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59159565A (ja) * | 1983-03-02 | 1984-09-10 | Sankyo Seiki Mfg Co Ltd | 磁気検出装置 |
| JPS63193866A (ja) | 1987-02-05 | 1988-08-11 | Matsushita Electric Ind Co Ltd | 印字装置 |
| JPS63193866U (de) * | 1987-05-29 | 1988-12-14 | ||
| SU1663588A1 (ru) * | 1989-01-02 | 1991-07-15 | Ю.М.П тин | Устройство дл регистрации термомагнитных характеристик |
| JPH03221810A (ja) | 1990-01-26 | 1991-09-30 | Sumitomo Electric Ind Ltd | オフセット補正機能を有する方位検出装置 |
| JP2869910B2 (ja) | 1992-08-28 | 1999-03-10 | 株式会社村田製作所 | 磁気センサ装置 |
| JPH06232478A (ja) * | 1993-02-05 | 1994-08-19 | Toyota Autom Loom Works Ltd | 半導体装置 |
| JPH06275887A (ja) * | 1993-03-19 | 1994-09-30 | Fujitsu Ltd | 磁気抵抗素子 |
| US5351003A (en) * | 1993-04-02 | 1994-09-27 | General Motors Corporation | Temperature compensated magnetoresistive position sensor |
| DE4436876A1 (de) * | 1994-10-15 | 1996-04-18 | Lust Antriebstechnik Gmbh | Sensorchip |
| US5561368A (en) * | 1994-11-04 | 1996-10-01 | International Business Machines Corporation | Bridge circuit magnetic field sensor having spin valve magnetoresistive elements formed on common substrate |
| JPH08139230A (ja) * | 1994-11-11 | 1996-05-31 | Sumitomo Kinzoku Ceramics:Kk | セラミック回路基板とその製造方法 |
| DE19649265C2 (de) * | 1996-11-28 | 2001-03-15 | Inst Physikalische Hochtech Ev | GMR-Sensor mit einer Wheatstonebrücke |
| DE19742366C1 (de) | 1997-09-25 | 1999-05-27 | Siemens Ag | Einrichtung mit magnetoresistivem Sensorelement und zugeordneter Magnetisierungsvorrichtung |
| JPH11287668A (ja) | 1998-02-04 | 1999-10-19 | Denso Corp | 増幅回路及びそれを用いた位置検出装置 |
| JP2001183433A (ja) * | 1999-12-24 | 2001-07-06 | Teikoku Tsushin Kogyo Co Ltd | 磁気抵抗効果素子 |
| DE10118650A1 (de) * | 2001-04-14 | 2002-10-17 | Philips Corp Intellectual Pty | Winkelsensor sowie Verfahren zum Erhöhen der Anisotropiefeldstärke einer Sensoreinheit eines Winkelsensors |
| JP3835354B2 (ja) | 2001-10-29 | 2006-10-18 | ヤマハ株式会社 | 磁気センサ |
| JP2004070543A (ja) | 2002-08-05 | 2004-03-04 | Rohm Co Ltd | ポインティング制御回路付き磁気センサ |
-
2002
- 2002-11-29 AT AT02783685T patent/ATE495458T1/de not_active IP Right Cessation
- 2002-11-29 WO PCT/JP2002/012476 patent/WO2004051298A1/ja not_active Ceased
- 2002-11-29 CN CNA02829971XA patent/CN1695066A/zh active Pending
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