DE602004008941D1 - Verfahren zur herstellung einer epitaktischen schicht - Google Patents
Verfahren zur herstellung einer epitaktischen schichtInfo
- Publication number
- DE602004008941D1 DE602004008941D1 DE602004008941T DE602004008941T DE602004008941D1 DE 602004008941 D1 DE602004008941 D1 DE 602004008941D1 DE 602004008941 T DE602004008941 T DE 602004008941T DE 602004008941 T DE602004008941 T DE 602004008941T DE 602004008941 D1 DE602004008941 D1 DE 602004008941D1
- Authority
- DE
- Germany
- Prior art keywords
- layer
- substrate
- rest
- thin
- preparing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 5
- 230000006911 nucleation Effects 0.000 abstract 2
- 238000010899 nucleation Methods 0.000 abstract 2
- 238000000407 epitaxy Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/928—Front and rear surface processing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/977—Thinning or removal of substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Recrystallisation Techniques (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0309079 | 2003-07-24 | ||
FR0309079A FR2857983B1 (fr) | 2003-07-24 | 2003-07-24 | Procede de fabrication d'une couche epitaxiee |
PCT/EP2004/007578 WO2005014896A1 (en) | 2003-07-24 | 2004-07-07 | A method of fabricating an epitaxially grown layer |
Publications (2)
Publication Number | Publication Date |
---|---|
DE602004008941D1 true DE602004008941D1 (de) | 2007-10-25 |
DE602004008941T2 DE602004008941T2 (de) | 2008-05-08 |
Family
ID=33561071
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004008941T Expired - Lifetime DE602004008941T2 (de) | 2003-07-24 | 2004-07-07 | Verfahren zur herstellung einer epitaktischen schicht |
Country Status (10)
Country | Link |
---|---|
US (2) | US7601217B2 (de) |
EP (1) | EP1660702B1 (de) |
JP (1) | JP5031365B2 (de) |
KR (1) | KR100825532B1 (de) |
CN (1) | CN100393922C (de) |
AT (1) | ATE373121T1 (de) |
DE (1) | DE602004008941T2 (de) |
FR (1) | FR2857983B1 (de) |
TW (1) | TWI310795B (de) |
WO (1) | WO2005014896A1 (de) |
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FR2837981B1 (fr) * | 2002-03-28 | 2005-01-07 | Commissariat Energie Atomique | Procede de manipulation de couches semiconductrices pour leur amincissement |
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US7538010B2 (en) * | 2003-07-24 | 2009-05-26 | S.O.I.Tec Silicon On Insulator Technologies | Method of fabricating an epitaxially grown layer |
DE102004061865A1 (de) * | 2004-09-29 | 2006-03-30 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Dünnfilmhalbleiterchips |
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KR20080086899A (ko) * | 2005-12-27 | 2008-09-26 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Soi 웨이퍼의 제조 방법 및 soi 웨이퍼 |
TWI334164B (en) * | 2006-06-07 | 2010-12-01 | Ind Tech Res Inst | Method of manufacturing nitride semiconductor substrate and composite material substrate |
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-
2003
- 2003-07-24 FR FR0309079A patent/FR2857983B1/fr not_active Expired - Fee Related
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2004
- 2004-07-07 DE DE602004008941T patent/DE602004008941T2/de not_active Expired - Lifetime
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- 2004-07-07 CN CNB2004800211755A patent/CN100393922C/zh not_active Expired - Lifetime
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- 2004-07-07 JP JP2006520719A patent/JP5031365B2/ja not_active Expired - Lifetime
- 2004-07-07 WO PCT/EP2004/007578 patent/WO2005014896A1/en active IP Right Grant
- 2004-07-07 KR KR1020067001690A patent/KR100825532B1/ko active IP Right Grant
- 2004-07-23 TW TW093122174A patent/TWI310795B/zh not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
---|---|
FR2857983B1 (fr) | 2005-09-02 |
DE602004008941T2 (de) | 2008-05-08 |
US20060076559A1 (en) | 2006-04-13 |
TW200516180A (en) | 2005-05-16 |
TWI310795B (en) | 2009-06-11 |
KR100825532B1 (ko) | 2008-04-25 |
KR20060052881A (ko) | 2006-05-19 |
US20090321884A1 (en) | 2009-12-31 |
US8216368B2 (en) | 2012-07-10 |
ATE373121T1 (de) | 2007-09-15 |
JP5031365B2 (ja) | 2012-09-19 |
JP2006528593A (ja) | 2006-12-21 |
EP1660702B1 (de) | 2007-09-12 |
EP1660702A1 (de) | 2006-05-31 |
CN1826433A (zh) | 2006-08-30 |
FR2857983A1 (fr) | 2005-01-28 |
US7601217B2 (en) | 2009-10-13 |
WO2005014896A1 (en) | 2005-02-17 |
CN100393922C (zh) | 2008-06-11 |
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