FR2845523B1 - Procede pour realiser un substrat par transfert d'une plaquette donneuse comportant des especes etrangeres, et plaquette donneuse associee - Google Patents

Procede pour realiser un substrat par transfert d'une plaquette donneuse comportant des especes etrangeres, et plaquette donneuse associee

Info

Publication number
FR2845523B1
FR2845523B1 FR0212405A FR0212405A FR2845523B1 FR 2845523 B1 FR2845523 B1 FR 2845523B1 FR 0212405 A FR0212405 A FR 0212405A FR 0212405 A FR0212405 A FR 0212405A FR 2845523 B1 FR2845523 B1 FR 2845523B1
Authority
FR
France
Prior art keywords
donor wafer
thin layer
substrate
foreign species
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0212405A
Other languages
English (en)
Other versions
FR2845523A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soitec SA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to FR0212405A priority Critical patent/FR2845523B1/fr
Priority to US10/678,127 priority patent/US7008859B2/en
Priority to DE60333712T priority patent/DE60333712D1/de
Priority to AT03292465T priority patent/ATE477589T1/de
Priority to EP03292465A priority patent/EP1408545B1/fr
Priority to JP2003348741A priority patent/JP4854921B2/ja
Publication of FR2845523A1 publication Critical patent/FR2845523A1/fr
Application granted granted Critical
Publication of FR2845523B1 publication Critical patent/FR2845523B1/fr
Priority to US11/274,264 priority patent/US7535115B2/en
Priority to US12/139,609 priority patent/US7645684B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
    • H01L21/2258—Diffusion into or out of AIIIBV compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Recrystallisation Techniques (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Element Separation (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
FR0212405A 2002-10-07 2002-10-07 Procede pour realiser un substrat par transfert d'une plaquette donneuse comportant des especes etrangeres, et plaquette donneuse associee Expired - Fee Related FR2845523B1 (fr)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FR0212405A FR2845523B1 (fr) 2002-10-07 2002-10-07 Procede pour realiser un substrat par transfert d'une plaquette donneuse comportant des especes etrangeres, et plaquette donneuse associee
US10/678,127 US7008859B2 (en) 2002-10-07 2003-10-06 Wafer and method of producing a substrate by transfer of a layer that includes foreign species
AT03292465T ATE477589T1 (de) 2002-10-07 2003-10-07 Verfahren zur herstellung eines substrats durch den transfer eines geber-wafers mit fremdatomen, und ein entsprechender geber-wafer
EP03292465A EP1408545B1 (fr) 2002-10-07 2003-10-07 Procédé pour réaliser un substrat par transfert d'une plaquette donneuse comportant des espèces étrangères, et plaquette donneuse associée
DE60333712T DE60333712D1 (de) 2002-10-07 2003-10-07 Verfahren zur Herstellung eines Substrats durch den Transfer eines Geber-Wafers mit Fremdatomen, und ein entsprechender Geber-Wafer
JP2003348741A JP4854921B2 (ja) 2002-10-07 2003-10-07 異物種を含有するドナーウエハを転写することによる基板の製造方法および関連するドナーウエハ
US11/274,264 US7535115B2 (en) 2002-10-07 2005-11-16 Wafer and method of producing a substrate by transfer of a layer that includes foreign species
US12/139,609 US7645684B2 (en) 2002-10-07 2008-06-16 Wafer and method of producing a substrate by transfer of a layer that includes foreign species

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0212405A FR2845523B1 (fr) 2002-10-07 2002-10-07 Procede pour realiser un substrat par transfert d'une plaquette donneuse comportant des especes etrangeres, et plaquette donneuse associee

Publications (2)

Publication Number Publication Date
FR2845523A1 FR2845523A1 (fr) 2004-04-09
FR2845523B1 true FR2845523B1 (fr) 2005-10-28

Family

ID=32011448

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0212405A Expired - Fee Related FR2845523B1 (fr) 2002-10-07 2002-10-07 Procede pour realiser un substrat par transfert d'une plaquette donneuse comportant des especes etrangeres, et plaquette donneuse associee

Country Status (6)

Country Link
US (3) US7008859B2 (fr)
EP (1) EP1408545B1 (fr)
JP (1) JP4854921B2 (fr)
AT (1) ATE477589T1 (fr)
DE (1) DE60333712D1 (fr)
FR (1) FR2845523B1 (fr)

Families Citing this family (31)

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Publication number Priority date Publication date Assignee Title
US6912330B2 (en) * 2001-05-17 2005-06-28 Sioptical Inc. Integrated optical/electronic circuits and associated methods of simultaneous generation thereof
FR2845523B1 (fr) * 2002-10-07 2005-10-28 Procede pour realiser un substrat par transfert d'une plaquette donneuse comportant des especes etrangeres, et plaquette donneuse associee
FR2856192B1 (fr) * 2003-06-11 2005-07-29 Soitec Silicon On Insulator Procede de realisation de structure heterogene et structure obtenue par un tel procede
US7538010B2 (en) * 2003-07-24 2009-05-26 S.O.I.Tec Silicon On Insulator Technologies Method of fabricating an epitaxially grown layer
FR2857983B1 (fr) * 2003-07-24 2005-09-02 Soitec Silicon On Insulator Procede de fabrication d'une couche epitaxiee
EP1571705A3 (fr) * 2004-03-01 2006-01-04 S.O.I.Tec Silicon on Insulator Technologies Réalisation d'une entité en matériau semiconducteur sur substrat
WO2006082467A1 (fr) * 2005-02-01 2006-08-10 S.O.I.Tec Silicon On Insulator Technologies Substrat destine a la cristallogenese d'un semi-conducteur de nitrure
US7244630B2 (en) * 2005-04-05 2007-07-17 Philips Lumileds Lighting Company, Llc A1InGaP LED having reduced temperature dependence
FR2890489B1 (fr) * 2005-09-08 2008-03-07 Soitec Silicon On Insulator Procede de fabrication d'une heterostructure de type semi-conducteur sur isolant
CN1992173B (zh) * 2005-11-30 2010-04-21 硅起源股份有限公司 用于注入键合衬底以便导电的方法和结构
JP5271279B2 (ja) * 2007-02-08 2013-08-21 ソイテック 高熱消散基板を製造する方法
US20090092159A1 (en) * 2007-05-28 2009-04-09 Sumitomo Electric Industries, Ltd. Semiconductor light-emitting device with tunable emission wavelength
US20090174018A1 (en) * 2008-01-09 2009-07-09 Micron Technology, Inc. Construction methods for backside illuminated image sensors
FR2926674B1 (fr) * 2008-01-21 2010-03-26 Soitec Silicon On Insulator Procede de fabrication d'une structure composite avec couche d'oxyde de collage stable
KR101595307B1 (ko) * 2008-02-26 2016-02-26 소이텍 반도체 기판 제조방법 및 이미지센서
US20100044827A1 (en) * 2008-08-22 2010-02-25 Kinik Company Method for making a substrate structure comprising a film and substrate structure made by same method
EP2202795A1 (fr) * 2008-12-24 2010-06-30 S.O.I. TEC Silicon Procédé de fabrication de substrat semi-conducteur et substrat semi-conducteur
FR2953328B1 (fr) * 2009-12-01 2012-03-30 S O I Tec Silicon On Insulator Tech Heterostructure pour composants electroniques de puissance, composants optoelectroniques ou photovoltaiques
US8748288B2 (en) * 2010-02-05 2014-06-10 International Business Machines Corporation Bonded structure with enhanced adhesion strength
EP2597670B1 (fr) * 2010-03-31 2016-03-30 EV Group E. Thallner GmbH Procédé de liaison permanente de deux surfaces métalliques
FR2961948B1 (fr) * 2010-06-23 2012-08-03 Soitec Silicon On Insulator Procede de traitement d'une piece en materiau compose
FR2977069B1 (fr) 2011-06-23 2014-02-07 Soitec Silicon On Insulator Procede de fabrication d'une structure semi-conductrice mettant en oeuvre un collage temporaire
RU2469433C1 (ru) * 2011-07-13 2012-12-10 Юрий Георгиевич Шретер Способ лазерного отделения эпитаксиальной пленки или слоя эпитаксиальной пленки от ростовой подложки эпитаксиальной полупроводниковой структуры (варианты)
DE112012003260T5 (de) * 2011-08-05 2014-05-15 Sumitomo Electric Industries, Ltd. Substrat, Halbleitervorrichtung und Verfahren zur Herstellung derselben
FR2982071B1 (fr) * 2011-10-27 2014-05-16 Commissariat Energie Atomique Procede de lissage d'une surface par traitement thermique
FR2994766B1 (fr) 2012-08-23 2014-09-05 Commissariat Energie Atomique Procede de transfert d'un film d'inp
FR3007892B1 (fr) * 2013-06-27 2015-07-31 Commissariat Energie Atomique Procede de transfert d'une couche mince avec apport d'energie thermique a une zone fragilisee via une couche inductive
CN105374664A (zh) * 2015-10-23 2016-03-02 中国科学院上海微系统与信息技术研究所 一种InP薄膜复合衬底的制备方法
FR3045678B1 (fr) * 2015-12-22 2017-12-22 Soitec Silicon On Insulator Procede de fabrication d'une couche piezoelectrique monocristalline et dispositif microelectronique, photonique ou optique comprenant une telle couche
CN108701589A (zh) * 2016-02-16 2018-10-23 G射线瑞士公司 用于跨越键合界面传输电荷的结构、系统和方法
CN113223928B (zh) * 2021-04-16 2024-01-12 西安电子科技大学 一种基于转移键合的氧化镓外延生长方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2596777B1 (fr) * 1986-04-08 1994-01-21 Etat Francais Cnet Procede de preparation de semi-isolants 3-5 mono-cristallins par dopage et application des semi-isolants ainsi obtenus
US4738934A (en) * 1986-05-16 1988-04-19 American Telephone And Telegraph Company, At&T Bell Laboratories Method of making indium phosphide devices
IL100979A0 (en) 1991-03-18 1992-11-15 Hughes Aircraft Co Method for establishing an electrical field at a surface of a semiconductor device
JP2932787B2 (ja) * 1991-10-03 1999-08-09 日立電線株式会社 化合物半導体ウェハの製造方法
US5227313A (en) * 1992-07-24 1993-07-13 Eastman Kodak Company Process for making backside illuminated image sensors
US5244817A (en) * 1992-08-03 1993-09-14 Eastman Kodak Company Method of making backside illuminated image sensors
US5270221A (en) * 1992-11-05 1993-12-14 Hughes Aircraft Company Method of fabricating high quantum efficiency solid state sensors
JPH08139297A (ja) * 1994-09-14 1996-05-31 Nippon Telegr & Teleph Corp <Ntt> Ｓｏｉ基板の製造方法
US5882987A (en) * 1997-08-26 1999-03-16 International Business Machines Corporation Smart-cut process for the production of thin semiconductor material films
JPH11163363A (ja) * 1997-11-22 1999-06-18 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
FR2809867B1 (fr) * 2000-05-30 2003-10-24 Commissariat Energie Atomique Substrat fragilise et procede de fabrication d'un tel substrat
FR2816445B1 (fr) * 2000-11-06 2003-07-25 Commissariat Energie Atomique Procede de fabrication d'une structure empilee comprenant une couche mince adherant a un substrat cible
FR2817395B1 (fr) * 2000-11-27 2003-10-31 Soitec Silicon On Insulator Procede de fabrication d'un substrat notamment pour l'optique, l'electronique ou l'optoelectronique et substrat obtenu par ce procede
JP4304884B2 (ja) * 2001-06-06 2009-07-29 日本電気株式会社 半導体装置及びその製造方法
FR2845523B1 (fr) * 2002-10-07 2005-10-28 Procede pour realiser un substrat par transfert d'une plaquette donneuse comportant des especes etrangeres, et plaquette donneuse associee
US7169226B2 (en) * 2003-07-01 2007-01-30 International Business Machines Corporation Defect reduction by oxidation of silicon

Also Published As

Publication number Publication date
DE60333712D1 (de) 2010-09-23
ATE477589T1 (de) 2010-08-15
JP2004179630A (ja) 2004-06-24
US7535115B2 (en) 2009-05-19
US20040121558A1 (en) 2004-06-24
EP1408545B1 (fr) 2010-08-11
JP4854921B2 (ja) 2012-01-18
US7645684B2 (en) 2010-01-12
US20080248631A1 (en) 2008-10-09
EP1408545A2 (fr) 2004-04-14
US20060060922A1 (en) 2006-03-23
FR2845523A1 (fr) 2004-04-09
US7008859B2 (en) 2006-03-07
EP1408545A3 (fr) 2004-08-04

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Legal Events

Date Code Title Description
CD Change of name or company name

Owner name: SOITEC, FR

Effective date: 20120423

Owner name: COMMISSARIAT A L ENERGIE ATOMIQUE, FR

Effective date: 20120423

ST Notification of lapse

Effective date: 20160630