ATE443344T1 - Übertragung einer dünnen schicht von einer scheibe mit einer pufferschicht - Google Patents
Übertragung einer dünnen schicht von einer scheibe mit einer pufferschichtInfo
- Publication number
- ATE443344T1 ATE443344T1 AT03762850T AT03762850T ATE443344T1 AT E443344 T1 ATE443344 T1 AT E443344T1 AT 03762850 T AT03762850 T AT 03762850T AT 03762850 T AT03762850 T AT 03762850T AT E443344 T1 ATE443344 T1 AT E443344T1
- Authority
- AT
- Austria
- Prior art keywords
- layer
- lattice parameter
- buffer layer
- semiconductor material
- relaxed
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76259—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along a porous layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0208600A FR2842349B1 (fr) | 2002-07-09 | 2002-07-09 | Transfert d'une couche mince a partir d'une plaquette comprenant une couche tampon |
PCT/IB2003/003497 WO2004006311A2 (en) | 2002-07-09 | 2003-07-09 | Transfer of a thin layer from a wafer comprising a buffer layer |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE443344T1 true ATE443344T1 (de) | 2009-10-15 |
Family
ID=29763664
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03762848T ATE442667T1 (de) | 2002-07-09 | 2003-07-09 | Transfer einer dünnschicht von einem wafer mit einer pufferschicht |
AT03762850T ATE443344T1 (de) | 2002-07-09 | 2003-07-09 | Übertragung einer dünnen schicht von einer scheibe mit einer pufferschicht |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03762848T ATE442667T1 (de) | 2002-07-09 | 2003-07-09 | Transfer einer dünnschicht von einem wafer mit einer pufferschicht |
Country Status (11)
Country | Link |
---|---|
US (1) | US6991956B2 (de) |
EP (2) | EP1535326B1 (de) |
JP (2) | JP4904478B2 (de) |
KR (1) | KR100796832B1 (de) |
CN (1) | CN100477150C (de) |
AT (2) | ATE442667T1 (de) |
AU (2) | AU2003250462A1 (de) |
DE (2) | DE60329293D1 (de) |
FR (1) | FR2842349B1 (de) |
TW (1) | TWI289900B (de) |
WO (2) | WO2004006327A2 (de) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2773261B1 (fr) | 1997-12-30 | 2000-01-28 | Commissariat Energie Atomique | Procede pour le transfert d'un film mince comportant une etape de creation d'inclusions |
US6717213B2 (en) * | 2001-06-29 | 2004-04-06 | Intel Corporation | Creation of high mobility channels in thin-body SOI devices |
US20030227057A1 (en) | 2002-06-07 | 2003-12-11 | Lochtefeld Anthony J. | Strained-semiconductor-on-insulator device structures |
US6982474B2 (en) | 2002-06-25 | 2006-01-03 | Amberwave Systems Corporation | Reacted conductive gate electrodes |
US7510949B2 (en) | 2002-07-09 | 2009-03-31 | S.O.I.Tec Silicon On Insulator Technologies | Methods for producing a multilayer semiconductor structure |
US7018910B2 (en) * | 2002-07-09 | 2006-03-28 | S.O.I.Tec Silicon On Insulator Technologies S.A. | Transfer of a thin layer from a wafer comprising a buffer layer |
US6953736B2 (en) | 2002-07-09 | 2005-10-11 | S.O.I.Tec Silicon On Insulator Technologies S.A. | Process for transferring a layer of strained semiconductor material |
WO2004019404A2 (en) * | 2002-08-26 | 2004-03-04 | S.O.I.Tec Silicon On Insulator Technologies | Recycling a wafer comprising a buffer layer, after having taken off a thin layer therefrom |
KR100854856B1 (ko) * | 2002-08-26 | 2008-08-28 | 에스. 오. 이. 떼끄 씰리꽁 오 냉쉴라또흐 떼끄놀로지 | 버퍼층을 포함하는 웨이퍼를 그것으로부터 층을 취한 후에기계적으로 재활용하는 방법 |
US6730576B1 (en) * | 2002-12-31 | 2004-05-04 | Advanced Micro Devices, Inc. | Method of forming a thick strained silicon layer and semiconductor structures incorporating a thick strained silicon layer |
FR2861497B1 (fr) * | 2003-10-28 | 2006-02-10 | Soitec Silicon On Insulator | Procede de transfert catastrophique d'une couche fine apres co-implantation |
FR2867307B1 (fr) | 2004-03-05 | 2006-05-26 | Soitec Silicon On Insulator | Traitement thermique apres detachement smart-cut |
US7282449B2 (en) | 2004-03-05 | 2007-10-16 | S.O.I.Tec Silicon On Insulator Technologies | Thermal treatment of a semiconductor layer |
FR2867310B1 (fr) | 2004-03-05 | 2006-05-26 | Soitec Silicon On Insulator | Technique d'amelioration de la qualite d'une couche mince prelevee |
US8227319B2 (en) * | 2004-03-10 | 2012-07-24 | Agere Systems Inc. | Bipolar junction transistor having a high germanium concentration in a silicon-germanium layer and a method for forming the bipolar junction transistor |
FR2868202B1 (fr) * | 2004-03-25 | 2006-05-26 | Commissariat Energie Atomique | Procede de preparation d'une couche de dioxyde de silicium par oxydation a haute temperature sur un substrat presentant au moins en surface du germanium ou un alliage sicicium- germanium. |
US7495266B2 (en) * | 2004-06-16 | 2009-02-24 | Massachusetts Institute Of Technology | Strained silicon-on-silicon by wafer bonding and layer transfer |
US6893936B1 (en) * | 2004-06-29 | 2005-05-17 | International Business Machines Corporation | Method of Forming strained SI/SIGE on insulator with silicon germanium buffer |
JP4826475B2 (ja) * | 2004-09-24 | 2011-11-30 | 信越半導体株式会社 | 半導体ウェーハの製造方法 |
JP4617820B2 (ja) * | 2004-10-20 | 2011-01-26 | 信越半導体株式会社 | 半導体ウェーハの製造方法 |
JP2006140187A (ja) * | 2004-11-10 | 2006-06-01 | Shin Etsu Handotai Co Ltd | 半導体ウェーハの製造方法 |
US7247545B2 (en) * | 2004-11-10 | 2007-07-24 | Sharp Laboratories Of America, Inc. | Fabrication of a low defect germanium film by direct wafer bonding |
FR2880988B1 (fr) * | 2005-01-19 | 2007-03-30 | Soitec Silicon On Insulator | TRAITEMENT D'UNE COUCHE EN SI1-yGEy PRELEVEE |
FR2886053B1 (fr) | 2005-05-19 | 2007-08-10 | Soitec Silicon On Insulator | Procede de gravure chimique uniforme |
FR2886052B1 (fr) | 2005-05-19 | 2007-11-23 | Soitec Silicon On Insulator | Traitement de surface apres gravure selective |
FR2888400B1 (fr) | 2005-07-08 | 2007-10-19 | Soitec Silicon On Insulator | Procede de prelevement de couche |
KR100707654B1 (ko) | 2005-07-26 | 2007-04-13 | 동부일렉트로닉스 주식회사 | 반도체 장치의 소자 분리 구조 및 그 형성방법 |
FR2891281B1 (fr) * | 2005-09-28 | 2007-12-28 | Commissariat Energie Atomique | Procede de fabrication d'un element en couches minces. |
FR2892733B1 (fr) * | 2005-10-28 | 2008-02-01 | Soitec Silicon On Insulator | Relaxation de couches |
US8120060B2 (en) | 2005-11-01 | 2012-02-21 | Massachusetts Institute Of Technology | Monolithically integrated silicon and III-V electronics |
US8063397B2 (en) | 2006-06-28 | 2011-11-22 | Massachusetts Institute Of Technology | Semiconductor light-emitting structure and graded-composition substrate providing yellow-green light emission |
FR2910179B1 (fr) * | 2006-12-19 | 2009-03-13 | Commissariat Energie Atomique | PROCEDE DE FABRICATION DE COUCHES MINCES DE GaN PAR IMPLANTATION ET RECYCLAGE D'UN SUBSTRAT DE DEPART |
FR2912550A1 (fr) * | 2007-02-14 | 2008-08-15 | Soitec Silicon On Insulator | Procede de fabrication d'une structure ssoi. |
WO2008135804A1 (en) | 2007-05-03 | 2008-11-13 | S.O.I. Tec Silicon On Insulator Technologies | Improved process for preparing cleaned surfaces of strained silicon. |
FR2922359B1 (fr) * | 2007-10-12 | 2009-12-18 | Commissariat Energie Atomique | Procede de fabrication d'une structure micro-electronique impliquant un collage moleculaire |
FR2947098A1 (fr) * | 2009-06-18 | 2010-12-24 | Commissariat Energie Atomique | Procede de transfert d'une couche mince sur un substrat cible ayant un coefficient de dilatation thermique different de celui de la couche mince |
US8492234B2 (en) | 2010-06-29 | 2013-07-23 | International Business Machines Corporation | Field effect transistor device |
US8415253B2 (en) * | 2011-03-30 | 2013-04-09 | International Business Machinees Corporation | Low-temperature in-situ removal of oxide from a silicon surface during CMOS epitaxial processing |
FR2978605B1 (fr) | 2011-07-28 | 2015-10-16 | Soitec Silicon On Insulator | Procede de fabrication d'une structure semi-conductrice comprenant une couche fonctionnalisee sur un substrat support |
CN104517883B (zh) * | 2013-09-26 | 2017-08-15 | 中国科学院上海微系统与信息技术研究所 | 一种利用离子注入技术制备绝缘体上半导体材料的方法 |
FR3064398B1 (fr) * | 2017-03-21 | 2019-06-07 | Soitec | Structure de type semi-conducteur sur isolant, notamment pour un capteur d'image de type face avant, et procede de fabrication d'une telle structure |
US20190181218A1 (en) * | 2017-12-08 | 2019-06-13 | Qualcomm Incorporated | Semiconductor device with high charge carrier mobility materials on porous silicon |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5461243A (en) * | 1993-10-29 | 1995-10-24 | International Business Machines Corporation | Substrate for tensilely strained semiconductor |
WO1996015550A1 (en) * | 1994-11-10 | 1996-05-23 | Lawrence Semiconductor Research Laboratory, Inc. | Silicon-germanium-carbon compositions and processes thereof |
KR100304161B1 (ko) | 1996-12-18 | 2001-11-30 | 미다라이 후지오 | 반도체부재의제조방법 |
US5906951A (en) | 1997-04-30 | 1999-05-25 | International Business Machines Corporation | Strained Si/SiGe layers on insulator |
US5882987A (en) | 1997-08-26 | 1999-03-16 | International Business Machines Corporation | Smart-cut process for the production of thin semiconductor material films |
FR2777115B1 (fr) * | 1998-04-07 | 2001-07-13 | Commissariat Energie Atomique | Procede de traitement de substrats semi-conducteurs et structures obtenues par ce procede |
WO1999053539A1 (en) | 1998-04-10 | 1999-10-21 | Massachusetts Institute Of Technology | Silicon-germanium etch stop layer system |
JP3358550B2 (ja) * | 1998-07-07 | 2002-12-24 | 信越半導体株式会社 | Soiウエーハの製造方法ならびにこの方法で製造されるsoiウエーハ |
JP3884203B2 (ja) * | 1998-12-24 | 2007-02-21 | 株式会社東芝 | 半導体装置の製造方法 |
US6323108B1 (en) * | 1999-07-27 | 2001-11-27 | The United States Of America As Represented By The Secretary Of The Navy | Fabrication ultra-thin bonded semiconductor layers |
AU6905000A (en) * | 1999-08-10 | 2001-03-05 | Silicon Genesis Corporation | A cleaving process to fabricate multilayered substrates using low implantation doses |
JP3607194B2 (ja) * | 1999-11-26 | 2005-01-05 | 株式会社東芝 | 半導体装置、半導体装置の製造方法、及び半導体基板 |
KR100429869B1 (ko) * | 2000-01-07 | 2004-05-03 | 삼성전자주식회사 | 매몰 실리콘 저머늄층을 갖는 cmos 집적회로 소자 및기판과 그의 제조방법 |
JP2001284558A (ja) * | 2000-03-31 | 2001-10-12 | Fujitsu Ltd | 積層半導体基板及びその製造方法並びに半導体装置 |
AU2001268577A1 (en) | 2000-06-22 | 2002-01-02 | Massachusetts Institute Of Technology | Etch stop layer system |
EP1309989B1 (de) * | 2000-08-16 | 2007-01-10 | Massachusetts Institute Of Technology | Verfahren für die herstellung eines halbleiterartikels mittels graduellem epitaktischen wachsen |
JP3998408B2 (ja) * | 2000-09-29 | 2007-10-24 | 株式会社東芝 | 半導体装置及びその製造方法 |
US6410371B1 (en) * | 2001-02-26 | 2002-06-25 | Advanced Micro Devices, Inc. | Method of fabrication of semiconductor-on-insulator (SOI) wafer having a Si/SiGe/Si active layer |
US6717213B2 (en) * | 2001-06-29 | 2004-04-06 | Intel Corporation | Creation of high mobility channels in thin-body SOI devices |
-
2002
- 2002-07-09 FR FR0208600A patent/FR2842349B1/fr not_active Expired - Fee Related
-
2003
- 2003-07-09 AU AU2003250462A patent/AU2003250462A1/en not_active Abandoned
- 2003-07-09 JP JP2004519126A patent/JP4904478B2/ja not_active Expired - Lifetime
- 2003-07-09 JP JP2004519128A patent/JP2005532688A/ja active Pending
- 2003-07-09 WO PCT/IB2003/003466 patent/WO2004006327A2/en active Application Filing
- 2003-07-09 TW TW092118765A patent/TWI289900B/zh not_active IP Right Cessation
- 2003-07-09 EP EP03762848A patent/EP1535326B1/de not_active Expired - Lifetime
- 2003-07-09 CN CNB038162032A patent/CN100477150C/zh not_active Expired - Lifetime
- 2003-07-09 AU AU2003249475A patent/AU2003249475A1/en not_active Abandoned
- 2003-07-09 WO PCT/IB2003/003497 patent/WO2004006311A2/en active Application Filing
- 2003-07-09 DE DE60329293T patent/DE60329293D1/de not_active Expired - Lifetime
- 2003-07-09 AT AT03762848T patent/ATE442667T1/de not_active IP Right Cessation
- 2003-07-09 AT AT03762850T patent/ATE443344T1/de not_active IP Right Cessation
- 2003-07-09 DE DE60329192T patent/DE60329192D1/de not_active Expired - Lifetime
- 2003-07-09 EP EP03762850A patent/EP1522097B9/de not_active Expired - Lifetime
- 2003-07-09 KR KR1020057000477A patent/KR100796832B1/ko active IP Right Grant
-
2005
- 2005-01-10 US US11/032,844 patent/US6991956B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
TW200411820A (en) | 2004-07-01 |
EP1522097B1 (de) | 2009-09-16 |
WO2004006327A2 (en) | 2004-01-15 |
CN100477150C (zh) | 2009-04-08 |
DE60329192D1 (de) | 2009-10-22 |
WO2004006311A2 (en) | 2004-01-15 |
US6991956B2 (en) | 2006-01-31 |
EP1522097A2 (de) | 2005-04-13 |
TWI289900B (en) | 2007-11-11 |
KR100796832B1 (ko) | 2008-01-22 |
EP1535326B1 (de) | 2009-09-09 |
EP1535326A2 (de) | 2005-06-01 |
ATE442667T1 (de) | 2009-09-15 |
DE60329293D1 (de) | 2009-10-29 |
WO2004006327A3 (en) | 2004-03-04 |
US20050191825A1 (en) | 2005-09-01 |
AU2003250462A1 (en) | 2004-01-23 |
AU2003249475A1 (en) | 2004-01-23 |
JP2005532687A (ja) | 2005-10-27 |
JP2005532688A (ja) | 2005-10-27 |
FR2842349A1 (fr) | 2004-01-16 |
FR2842349B1 (fr) | 2005-02-18 |
JP4904478B2 (ja) | 2012-03-28 |
WO2004006311A3 (en) | 2004-03-04 |
KR20050018984A (ko) | 2005-02-28 |
CN1666330A (zh) | 2005-09-07 |
EP1522097B9 (de) | 2010-03-03 |
AU2003250462A8 (en) | 2004-01-23 |
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Legal Events
Date | Code | Title | Description |
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RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |