FR2888400B1 - Procede de prelevement de couche - Google Patents
Procede de prelevement de coucheInfo
- Publication number
- FR2888400B1 FR2888400B1 FR0507300A FR0507300A FR2888400B1 FR 2888400 B1 FR2888400 B1 FR 2888400B1 FR 0507300 A FR0507300 A FR 0507300A FR 0507300 A FR0507300 A FR 0507300A FR 2888400 B1 FR2888400 B1 FR 2888400B1
- Authority
- FR
- France
- Prior art keywords
- wafer
- face
- implanted
- layer
- taking method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Element Separation (AREA)
- Recrystallisation Techniques (AREA)
- Physical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Micromachines (AREA)
- Electroluminescent Light Sources (AREA)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0507300A FR2888400B1 (fr) | 2005-07-08 | 2005-07-08 | Procede de prelevement de couche |
US11/221,045 US7572714B2 (en) | 2005-07-08 | 2005-09-06 | Film taking-off method |
JP2008520025A JP4943426B2 (ja) | 2005-07-08 | 2006-07-06 | 被膜の生成方法 |
AT06809161T ATE528793T1 (de) | 2005-07-08 | 2006-07-06 | Verfahren zur herstellung eines films |
KR1020087001682A KR101015158B1 (ko) | 2005-07-08 | 2006-07-06 | 필름의 제조 방법 |
EP06809161A EP1911085B1 (fr) | 2005-07-08 | 2006-07-06 | Procede servant a produire une couche |
PCT/IB2006/003071 WO2007017763A2 (fr) | 2005-07-08 | 2006-07-06 | Procede servant a produire une couche |
CNA2006800244508A CN101213651A (zh) | 2005-07-08 | 2006-07-06 | 薄膜制造方法 |
TW095124731A TWI311776B (en) | 2005-07-08 | 2006-07-07 | Method of production of a film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0507300A FR2888400B1 (fr) | 2005-07-08 | 2005-07-08 | Procede de prelevement de couche |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2888400A1 FR2888400A1 (fr) | 2007-01-12 |
FR2888400B1 true FR2888400B1 (fr) | 2007-10-19 |
Family
ID=36127344
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0507300A Active FR2888400B1 (fr) | 2005-07-08 | 2005-07-08 | Procede de prelevement de couche |
Country Status (6)
Country | Link |
---|---|
US (1) | US7572714B2 (fr) |
JP (1) | JP4943426B2 (fr) |
CN (1) | CN101213651A (fr) |
AT (1) | ATE528793T1 (fr) |
FR (1) | FR2888400B1 (fr) |
TW (1) | TWI311776B (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8252663B2 (en) | 2009-06-18 | 2012-08-28 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Method of transferring a thin layer onto a target substrate having a coefficient of thermal expansion different from that of the thin layer |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2773261B1 (fr) | 1997-12-30 | 2000-01-28 | Commissariat Energie Atomique | Procede pour le transfert d'un film mince comportant une etape de creation d'inclusions |
FR2880184B1 (fr) * | 2004-12-28 | 2007-03-30 | Commissariat Energie Atomique | Procede de detourage d'une structure obtenue par assemblage de deux plaques |
KR100731055B1 (ko) * | 2005-11-08 | 2007-06-22 | 동부일렉트로닉스 주식회사 | 반도체소자의 제조방법 |
FR2893446B1 (fr) * | 2005-11-16 | 2008-02-15 | Soitec Silicon Insulator Techn | TRAITEMENT DE COUCHE DE SiGe POUR GRAVURE SELECTIVE |
FR2917232B1 (fr) | 2007-06-06 | 2009-10-09 | Soitec Silicon On Insulator | Procede de fabrication d'une structure pour epitaxie sans zone d'exclusion. |
EP2015354A1 (fr) * | 2007-07-11 | 2009-01-14 | S.O.I.Tec Silicon on Insulator Technologies | Procédé pour le recyclage d'un substrat, procédé de fabrication de tranches stratifiées et substrat donneur recyclé approprié |
WO2009007003A1 (fr) * | 2007-07-11 | 2009-01-15 | S.O.I. Tec Silicon On Insulator Technologies | Procédé pour recycler un substrat, procédé de fabrication de tranches stratifiées et substrat donneur recyclé approprié |
WO2011003366A1 (fr) * | 2009-07-10 | 2011-01-13 | 上海新傲科技股份有限公司 | Procédé permettant de former un substrat doté dune couche enterrée isolante |
FR2953988B1 (fr) * | 2009-12-11 | 2012-02-10 | S O I Tec Silicon On Insulator Tech | Procede de detourage d'un substrat chanfreine. |
PL2928700T3 (pl) | 2012-12-07 | 2019-02-28 | Aixtron Se | Sposób i aparatura do przenoszenia powłok z jednego substratu na inny |
US20180033609A1 (en) * | 2016-07-28 | 2018-02-01 | QMAT, Inc. | Removal of non-cleaved/non-transferred material from donor substrate |
FR3063176A1 (fr) * | 2017-02-17 | 2018-08-24 | Soitec | Masquage d'une zone au bord d'un substrat donneur lors d'une etape d'implantation ionique |
TWI665718B (zh) * | 2018-04-03 | 2019-07-11 | 環球晶圓股份有限公司 | 磊晶基板 |
JP7164777B2 (ja) * | 2018-11-13 | 2022-11-02 | 東京エレクトロン株式会社 | ウェハ上の欠陥、金属粒子汚染及び膜成長を抑制するシステム及び方法 |
FR3091620B1 (fr) * | 2019-01-07 | 2021-01-29 | Commissariat Energie Atomique | Procédé de transfert de couche avec réduction localisée d’une capacité à initier une fracture |
CN111834200A (zh) * | 2020-09-16 | 2020-10-27 | 南京晶驱集成电路有限公司 | 一种半导体结构及其制造方法 |
FR3135819B1 (fr) * | 2022-05-18 | 2024-04-26 | Commissariat Energie Atomique | Procédé de transfert d'une couche depuis un substrat source vers un substrat destination |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3410524A1 (de) | 1984-03-22 | 1985-10-03 | Vdo Schindling | Druckschalter |
CA2246087A1 (fr) * | 1998-08-28 | 2000-02-28 | Northern Telecom Limited | Methode de decoupe d'une galette de semiconducteurs |
JP3943782B2 (ja) | 1999-11-29 | 2007-07-11 | 信越半導体株式会社 | 剥離ウエーハの再生処理方法及び再生処理された剥離ウエーハ |
JP4846915B2 (ja) * | 2000-03-29 | 2011-12-28 | 信越半導体株式会社 | 貼り合わせウェーハの製造方法 |
JP2002075917A (ja) | 2000-08-25 | 2002-03-15 | Canon Inc | 試料の分離装置及び分離方法 |
FR2823596B1 (fr) * | 2001-04-13 | 2004-08-20 | Commissariat Energie Atomique | Substrat ou structure demontable et procede de realisation |
JP2002313757A (ja) | 2001-04-17 | 2002-10-25 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
US6855436B2 (en) * | 2003-05-30 | 2005-02-15 | International Business Machines Corporation | Formation of silicon-germanium-on-insulator (SGOI) by an integral high temperature SIMOX-Ge interdiffusion anneal |
JP2002353081A (ja) | 2001-05-25 | 2002-12-06 | Canon Inc | 板部材の分離装置及び分離方法 |
US6995430B2 (en) * | 2002-06-07 | 2006-02-07 | Amberwave Systems Corporation | Strained-semiconductor-on-insulator device structures |
US7018910B2 (en) | 2002-07-09 | 2006-03-28 | S.O.I.Tec Silicon On Insulator Technologies S.A. | Transfer of a thin layer from a wafer comprising a buffer layer |
FR2842349B1 (fr) | 2002-07-09 | 2005-02-18 | Transfert d'une couche mince a partir d'une plaquette comprenant une couche tampon | |
US6841457B2 (en) * | 2002-07-16 | 2005-01-11 | International Business Machines Corporation | Use of hydrogen implantation to improve material properties of silicon-germanium-on-insulator material made by thermal diffusion |
FR2842651B1 (fr) * | 2002-07-17 | 2005-07-08 | Procede de lissage du contour d'une couche utile de materiau reportee sur un substrat support | |
JP4147578B2 (ja) * | 2002-07-30 | 2008-09-10 | 信越半導体株式会社 | Soiウエーハの製造方法 |
AU2003270040A1 (en) * | 2002-08-29 | 2004-03-19 | Massachusetts Institute Of Technology | Fabrication method for a monocrystalline semiconductor layer on a substrate |
FR2852445B1 (fr) | 2003-03-14 | 2005-05-20 | Soitec Silicon On Insulator | Procede de realisation de substrats ou composants sur substrats avec transfert de couche utile, pour la microelectronique, l'optoelectronique ou l'optique |
US7122095B2 (en) * | 2003-03-14 | 2006-10-17 | S.O.I.Tec Silicon On Insulator Technologies S.A. | Methods for forming an assembly for transfer of a useful layer |
JP4415588B2 (ja) * | 2003-08-28 | 2010-02-17 | 株式会社Sumco | 剥離ウェーハの再生処理方法 |
US6831350B1 (en) * | 2003-10-02 | 2004-12-14 | Freescale Semiconductor, Inc. | Semiconductor structure with different lattice constant materials and method for forming the same |
FR2860842B1 (fr) * | 2003-10-14 | 2007-11-02 | Tracit Technologies | Procede de preparation et d'assemblage de substrats |
DE10355728B4 (de) * | 2003-11-28 | 2006-04-13 | X-Fab Semiconductor Foundries Ag | Verbinden von Halbleiterscheiben gleichen Durchmessers zum Erhalt einer gebondeten Scheibenanordnung |
JP4714423B2 (ja) * | 2004-01-06 | 2011-06-29 | Okiセミコンダクタ株式会社 | 半導体ウエハとその製造方法 |
CN1922732B (zh) * | 2004-02-25 | 2010-06-09 | S.O.I.Tec绝缘体上硅技术公司 | 光电检测装置 |
-
2005
- 2005-07-08 FR FR0507300A patent/FR2888400B1/fr active Active
- 2005-09-06 US US11/221,045 patent/US7572714B2/en active Active
-
2006
- 2006-07-06 AT AT06809161T patent/ATE528793T1/de not_active IP Right Cessation
- 2006-07-06 CN CNA2006800244508A patent/CN101213651A/zh active Pending
- 2006-07-06 JP JP2008520025A patent/JP4943426B2/ja active Active
- 2006-07-07 TW TW095124731A patent/TWI311776B/zh active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8252663B2 (en) | 2009-06-18 | 2012-08-28 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Method of transferring a thin layer onto a target substrate having a coefficient of thermal expansion different from that of the thin layer |
Also Published As
Publication number | Publication date |
---|---|
TW200721263A (en) | 2007-06-01 |
FR2888400A1 (fr) | 2007-01-12 |
ATE528793T1 (de) | 2011-10-15 |
JP4943426B2 (ja) | 2012-05-30 |
US20070023867A1 (en) | 2007-02-01 |
CN101213651A (zh) | 2008-07-02 |
US7572714B2 (en) | 2009-08-11 |
JP2009500839A (ja) | 2009-01-08 |
TWI311776B (en) | 2009-07-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
CD | Change of name or company name |
Owner name: SOITEC, FR Effective date: 20120423 |
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PLFP | Fee payment |
Year of fee payment: 12 |
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PLFP | Fee payment |
Year of fee payment: 13 |
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PLFP | Fee payment |
Year of fee payment: 14 |
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PLFP | Fee payment |
Year of fee payment: 16 |
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PLFP | Fee payment |
Year of fee payment: 17 |
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PLFP | Fee payment |
Year of fee payment: 18 |
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PLFP | Fee payment |
Year of fee payment: 19 |