DE602004008033D1 - Poly(phenylenether)harzzusammensetzung, prepreg und laminatfolie - Google Patents

Poly(phenylenether)harzzusammensetzung, prepreg und laminatfolie

Info

Publication number
DE602004008033D1
DE602004008033D1 DE200460008033 DE602004008033T DE602004008033D1 DE 602004008033 D1 DE602004008033 D1 DE 602004008033D1 DE 200460008033 DE200460008033 DE 200460008033 DE 602004008033 T DE602004008033 T DE 602004008033T DE 602004008033 D1 DE602004008033 D1 DE 602004008033D1
Authority
DE
Germany
Prior art keywords
phenylenether
prepreg
poly
resin composition
laminate foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE200460008033
Other languages
English (en)
Other versions
DE602004008033T2 (de
Inventor
Hiroharu Inoue
Eiichiro Saito
Hiroaki Fujiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Publication of DE602004008033D1 publication Critical patent/DE602004008033D1/de
Application granted granted Critical
Publication of DE602004008033T2 publication Critical patent/DE602004008033T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/14Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12Polyphenylene oxides
    • C08L71/126Polyphenylene oxides modified by chemical after-treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/04Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/06Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
    • C08F283/08Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals on to polyphenylene oxides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/48Polymers modified by chemical after-treatment
    • C08G65/485Polyphenylene oxides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0008Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025Crosslinking or vulcanising agents; including accelerators
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477Six-membered rings
    • C08K5/3492Triazines
    • C08K5/34924Triazines containing cyanurate groups; Tautomers thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • C08K7/14Glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/02Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterized by the type of post-polymerisation functionalisation
    • C08G2650/20Cross-linking
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2371/00Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
    • C08J2371/08Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08J2371/10Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08J2371/12Polyphenylene oxides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00Crosslinking
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31855Of addition polymer from unsaturated monomers
DE200460008033 2003-01-28 2004-01-22 Poly(phenylenether)harzzusammensetzung, prepreg und laminatfolie Expired - Lifetime DE602004008033T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2003019475 2003-01-28
JP2003019475 2003-01-28
JP2003136496 2003-05-14
JP2003136496 2003-05-14
PCT/JP2004/000554 WO2004067634A1 (en) 2003-01-28 2004-01-22 Poly(phenylene ether) resin composition, prepreg, and laminated sheet

Publications (2)

Publication Number Publication Date
DE602004008033D1 true DE602004008033D1 (de) 2007-09-20
DE602004008033T2 DE602004008033T2 (de) 2008-04-30

Family

ID=32737719

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200460008033 Expired - Lifetime DE602004008033T2 (de) 2003-01-28 2004-01-22 Poly(phenylenether)harzzusammensetzung, prepreg und laminatfolie

Country Status (7)

Country Link
US (2) US7413791B2 (de)
EP (1) EP1592747B1 (de)
JP (4) JP4211784B2 (de)
KR (1) KR100728423B1 (de)
DE (1) DE602004008033T2 (de)
TW (1) TWI279418B (de)
WO (1) WO2004067634A1 (de)

Families Citing this family (106)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6905637B2 (en) * 2001-01-18 2005-06-14 General Electric Company Electrically conductive thermoset composition, method for the preparation thereof, and articles derived therefrom
US7235192B2 (en) * 1999-12-01 2007-06-26 General Electric Company Capped poly(arylene ether) composition and method
US6878782B2 (en) * 1999-12-01 2005-04-12 General Electric Thermoset composition, method, and article
US6897282B2 (en) * 2000-07-10 2005-05-24 General Electric Compositions comprising functionalized polyphenylene ether resins
JP2002265777A (ja) * 2001-03-12 2002-09-18 Matsushita Electric Works Ltd ポリフェニレンオキサイド樹脂組成物、プリプレグ、積層板、プリント配線板、多層プリント配線板
DE60336074D1 (de) 2002-10-11 2011-03-31 Univ Connecticut Mischungen von amorphen und semikristallinen polymeren mit formgedächtniseigenscchaften
US7250477B2 (en) * 2002-12-20 2007-07-31 General Electric Company Thermoset composite composition, method, and article
US7413791B2 (en) * 2003-01-28 2008-08-19 Matsushita Electric Works, Ltd. Poly (phenylene ether) resin composition, prepreg, and laminated sheet
JP2005045150A (ja) * 2003-07-25 2005-02-17 Matsushita Electric Ind Co Ltd 中間接続用配線基材および多層配線基板、ならびにこれらの製造方法
US7067595B2 (en) * 2003-10-03 2006-06-27 General Electric Company Poly (arylene ether) composition and method
US7148296B2 (en) * 2003-10-03 2006-12-12 General Electric Company Capped poly(arylene ether) composition and process
US7211639B2 (en) * 2003-10-03 2007-05-01 General Electric Company Composition comprising functionalized poly(arylene ether) and ethylene-alkyl (meth)acrylate copolymer, method for the preparation thereof, and articles prepared therefrom
US7329708B2 (en) * 2004-08-18 2008-02-12 General Electric Company Functionalized poly(arylene ether) composition and method
JP2006206689A (ja) * 2005-01-26 2006-08-10 Matsushita Electric Works Ltd ポリフェニレンエーテル樹脂組成物、プリプレグ、積層板
JP4747608B2 (ja) * 2005-02-23 2011-08-17 パナソニック電工株式会社 ポリフェニレン樹脂組成物を含有するプリプレグ及び積層体
US7378455B2 (en) * 2005-06-30 2008-05-27 General Electric Company Molding composition and method, and molded article
US7429800B2 (en) * 2005-06-30 2008-09-30 Sabic Innovative Plastics Ip B.V. Molding composition and method, and molded article
US20070004871A1 (en) * 2005-06-30 2007-01-04 Qiwei Lu Curable composition and method
US20070066710A1 (en) * 2005-09-21 2007-03-22 Peters Edward N Method for electrical insulation and insulated electrical conductor
JP5123477B2 (ja) * 2005-10-18 2013-01-23 パナソニック株式会社 樹脂組成物、プリプレグ、積層体
TWI441866B (zh) * 2006-02-17 2014-06-21 Hitachi Chemical Co Ltd A thermosetting resin composition of a semi-IPN type composite and a varnish, a prepreg and a metal laminate
JP5303852B2 (ja) * 2006-04-13 2013-10-02 日立化成株式会社 セミipn型複合体の樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
JP5303853B2 (ja) * 2006-04-14 2013-10-02 日立化成株式会社 Ipn型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
JP5199569B2 (ja) * 2006-06-27 2013-05-15 パナソニック株式会社 低誘電樹脂組成物、プリプレグ、金属張積層板、プリント配線板
JP5433416B2 (ja) * 2006-08-08 2014-03-05 ワールド プラパティーズ、 インコーポレイテッド 回路材料、回路および多層回路積層板
WO2008018483A1 (fr) * 2006-08-08 2008-02-14 Namics Corporation Composition de résine thermodurcissable et film non durci en étant composé
US20080071036A1 (en) * 2006-09-15 2008-03-20 Delsman Erik R Cured poly(arylene ether) composition, method, and article
US20080071035A1 (en) * 2006-09-15 2008-03-20 Delsman Erik R Curable poly(arylene ether) composition and method
US20080097069A1 (en) * 2006-10-20 2008-04-24 Hua Guo Poly(arylene ether) method and composition
US20080097027A1 (en) * 2006-10-23 2008-04-24 General Electric Company Varnish composition for insulating electrical machinery
JP5303854B2 (ja) * 2006-10-24 2013-10-02 日立化成株式会社 新規なセミipn型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
US7582691B2 (en) 2007-01-17 2009-09-01 Sabic Innovative Plastics Ip B.V. Poly(arylene ether) compositions and articles
WO2009040921A1 (ja) * 2007-09-27 2009-04-02 Panasonic Electric Works Co., Ltd. エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ及び金属張積層板
US8025926B2 (en) 2008-04-23 2011-09-27 Sabic Innovative Plastics Ip B.V. Varnish compositions for electrical insulation and method of using the same
JP5465854B2 (ja) * 2008-08-26 2014-04-09 パナソニック株式会社 ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板
US8092722B2 (en) * 2008-09-30 2012-01-10 Sabic Innovative Plastics Ip B.V. Varnish compositions for electrical insulation and method of using the same
JP2011046083A (ja) * 2009-08-26 2011-03-10 Panasonic Electric Works Co Ltd 金属張り積層板とその製造方法
KR20110139462A (ko) * 2010-06-23 2011-12-29 삼성전기주식회사 절연수지 조성물 및 이를 이용하여 제조된 인쇄회로기판
TWI418594B (zh) * 2010-12-16 2013-12-11 Asahi Kasei E Materials Corp Hardened resin composition
WO2012164612A1 (ja) 2011-05-31 2012-12-06 パナソニック株式会社 接合体の製造方法及び接合体
WO2013047041A1 (ja) * 2011-09-30 2013-04-04 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ及び金属箔張り積層板
US9051465B1 (en) 2012-02-21 2015-06-09 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
US9243164B1 (en) 2012-02-21 2016-01-26 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
KR101505358B1 (ko) 2012-03-19 2015-03-23 아사히 가세이 이-매터리얼즈 가부시키가이샤 폴리페닐렌에테르 입자를 포함하는 프리프레그
KR20140138677A (ko) * 2012-03-23 2014-12-04 미츠비시 가스 가가쿠 가부시키가이샤 프리프레그 및 적층판
JP6163292B2 (ja) * 2012-06-15 2017-07-12 旭化成株式会社 硬化性樹脂組成物
JP5952100B2 (ja) * 2012-06-15 2016-07-13 旭化成株式会社 硬化性樹脂組成物
JP6062667B2 (ja) * 2012-06-15 2017-01-18 旭化成株式会社 硬化性樹脂組成物
CN102807658B (zh) 2012-08-09 2014-06-11 广东生益科技股份有限公司 聚苯醚树脂组合物及使用其制作的半固化片与覆铜箔层压板
JP5914812B2 (ja) * 2012-08-29 2016-05-11 パナソニックIpマネジメント株式会社 変性ポリフェニレンエーテル、その製造方法、ポリフェニレンエーテル樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板
TWI464213B (zh) * 2013-03-07 2014-12-11 Taiwan Union Technology Corp 樹脂組合物及其應用
TWI513761B (zh) 2013-04-30 2015-12-21 Ind Tech Res Inst 樹脂組合物、膠片、及包含其之基材
US10590223B2 (en) * 2013-06-18 2020-03-17 Panasonic Intellectual Property Management Co., Ltd. Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board
JP6148118B2 (ja) * 2013-08-28 2017-06-14 旭化成株式会社 Ppe含有樹脂組成物
US10047224B2 (en) 2013-11-20 2018-08-14 Asahi Kasei Kabushiki Kaisha Cured product of polyphenylene ether-containing resin composition
KR20150068181A (ko) * 2013-12-11 2015-06-19 주식회사 두산 저유전 손실 특성을 가진 고주파용 열경화성 수지 조성물, 이를 이용한 프리프레그, 및 동박적층판
WO2015089807A1 (en) * 2013-12-19 2015-06-25 Dow Global Technologies Llc Vinyl-capped poly(phenylene) ether and styrene-butadiene copolymer blends for curable compositions
CN106660322B (zh) * 2014-07-16 2019-11-22 松下知识产权经营株式会社 覆金属箔层压板及其制造方法、附着树脂的金属箔、和印刷电路板
WO2016038878A1 (ja) * 2014-09-09 2016-03-17 パナソニックIpマネジメント株式会社 硬化性組成物、プリプレグ、樹脂付き金属箔、金属張積層板、及びプリント配線板
JP6504386B2 (ja) * 2014-12-16 2019-04-24 パナソニックIpマネジメント株式会社 ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板及びプリント配線板
KR101865649B1 (ko) * 2014-12-22 2018-07-04 주식회사 두산 고주파용 열경화성 수지 조성물, 이를 이용한 프리프레그, 적층 시트 및 인쇄회로기판
KR102455920B1 (ko) 2015-01-13 2022-10-17 쇼와덴코머티리얼즈가부시끼가이샤 수지 조성물, 수지층 부착 지지체, 프리프레그, 적층판, 다층 프린트 배선판 및 밀리미터파 레이더용 프린트 배선판
JP6817564B2 (ja) 2015-01-19 2021-01-20 パナソニックIpマネジメント株式会社 樹脂付き金属箔
US9637596B2 (en) 2015-03-10 2017-05-02 International Business Machines Corporation Polyhemiaminal and polyhexahydrotriazine materials from 1,4 conjugate addition reactions
JP6579309B2 (ja) * 2015-05-01 2019-09-25 味の素株式会社 硬化性組成物
JP6724305B2 (ja) * 2015-07-24 2020-07-15 三菱瓦斯化学株式会社 プリプレグ
JP2017031276A (ja) * 2015-07-30 2017-02-09 パナソニックIpマネジメント株式会社 熱硬化性樹脂組成物、並びに、それを用いた樹脂ワニス、樹脂付金属箔、樹脂フィルム、金属張積層板及びプリント配線板
JP2017047648A (ja) * 2015-09-04 2017-03-09 三菱瓦斯化学株式会社 銅張積層板
JP6623640B2 (ja) * 2015-09-18 2019-12-25 三菱瓦斯化学株式会社 プリプレグ
JP7422046B2 (ja) 2015-10-14 2024-01-25 三菱瓦斯化学株式会社 プリプレグ
JP7082454B2 (ja) * 2015-10-16 2022-06-08 三菱瓦斯化学株式会社 プリプレグ、積層体及びプリント配線基板
CN106609030B (zh) * 2015-10-21 2018-12-25 广东生益科技股份有限公司 一种聚苯醚树脂组合物及其在高频电路基板中的应用
CN106609039B (zh) * 2015-10-21 2019-09-13 广东生益科技股份有限公司 一种聚苯醚树脂组合物及其在高频电路基板中的应用
JP6601675B2 (ja) * 2016-01-14 2019-11-06 パナソニックIpマネジメント株式会社 金属張積層板および樹脂付金属箔
JP6906171B2 (ja) * 2016-01-19 2021-07-21 パナソニックIpマネジメント株式会社 ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板及びプリント配線板
KR20180104631A (ko) 2016-01-26 2018-09-21 파나소닉 아이피 매니지먼트 가부시키가이샤 다층 프린트 배선판 및 다층 금속 클래드 적층판
JP2017141314A (ja) * 2016-02-08 2017-08-17 三菱瓦斯化学株式会社 プリプレグ
JP6769049B2 (ja) * 2016-03-04 2020-10-14 三菱瓦斯化学株式会社 多層基板
KR101708146B1 (ko) * 2016-03-11 2017-02-17 주식회사 두산 저유전 손실 특성을 가진 고주파용 열경화성 수지 조성물, 이를 이용한 프리프레그, 및 동박적층판
EP3464449B1 (de) 2016-05-26 2019-08-21 SABIC Global Technologies B.V. Thermoplastische zusammensetzungen für elektronik oder telekommunikationsanwendungen und daraus geformte gegenstände
WO2018030112A1 (ja) * 2016-08-10 2018-02-15 パナソニックIpマネジメント株式会社 封止用アクリル組成物、シート材、積層シート、硬化物、半導体装置及び半導体装置の製造方法
WO2018061736A1 (ja) * 2016-09-27 2018-04-05 パナソニックIpマネジメント株式会社 金属張積層板、プリント配線板および樹脂付金属箔
CN110099932A (zh) 2016-12-16 2019-08-06 诺佛赛特有限责任公司 树脂组合物
JPWO2018159080A1 (ja) * 2017-03-02 2019-12-19 パナソニックIpマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
CN111148782B (zh) 2017-09-29 2022-10-14 松下知识产权经营株式会社 预浸料、覆金属箔层压板及布线板
US11820105B2 (en) 2017-09-29 2023-11-21 Panasonic Intellectual Property Management Co., Ltd. Prepreg, metal-clad laminate, and wiring board
WO2019189829A1 (ja) 2018-03-29 2019-10-03 旭化成株式会社 ポリフェニレンエーテル、その組成物及び製造方法
JP7102202B2 (ja) * 2018-04-19 2022-07-19 旭化成株式会社 ポリフェニレンエーテル及びその製造方法
CN112020523B (zh) * 2018-04-27 2023-10-24 松下知识产权经营株式会社 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板、以及布线板
CN112368311B (zh) * 2018-07-19 2023-11-03 松下知识产权经营株式会社 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板、以及布线板
JP7401917B2 (ja) 2019-02-12 2023-12-20 ナミックス株式会社 光硬化性樹脂組成物及びそれを硬化させて得られる硬化物
JP7202920B2 (ja) * 2019-02-20 2023-01-12 旭化成株式会社 ポリフェニレンエーテル含有樹脂組成物
WO2020196759A1 (ja) * 2019-03-27 2020-10-01 パナソニックIpマネジメント株式会社 プリプレグ、金属張積層板、及び配線板
JP7308082B2 (ja) * 2019-06-13 2023-07-13 旭化成株式会社 ポリフェニレンエーテル含有樹脂組成物
US20220259424A1 (en) * 2019-07-17 2022-08-18 Panasonic Intellectual Property Management Co., Ltd. Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board
CN114174434B (zh) 2019-08-06 2024-03-08 日本曹达株式会社 聚苯醚树脂组合物、预浸料坯、及覆金属层叠板
JPWO2021059911A1 (de) * 2019-09-27 2021-04-01
CN111471144B (zh) * 2020-03-27 2022-05-31 顺德职业技术学院 丙烯酸改性低介电含氟聚苯醚混合胶及其制备的5g覆铜板
JP2023120458A (ja) * 2020-07-10 2023-08-30 Agc株式会社 樹脂組成物、プリプレグ、樹脂付き金属箔、樹脂付きフィルム、金属張積層板、及び配線基板、並びに、変性ポリフェニレンエーテルの製造方法
TWI795658B (zh) * 2020-07-23 2023-03-11 南亞塑膠工業股份有限公司 高頻基板用樹脂組成物及金屬積層板
CN112358717A (zh) * 2020-11-23 2021-02-12 江苏诺德新材料股份有限公司 一种改性聚苯醚树脂组合物及其制造的高频覆铜板
JP2022103683A (ja) 2020-12-28 2022-07-08 日揮触媒化成株式会社 シリカ系中空粒子及びその製造方法、並びに樹脂組成物
KR20230164008A (ko) 2021-03-31 2023-12-01 니끼 쇼꾸바이 카세이 가부시키가이샤 분체 및 그 제조 방법, 그리고 수지 조성물의 제조 방법
TW202302744A (zh) 2021-03-31 2023-01-16 日商日揮觸媒化成股份有限公司 粉體及其製造方法、以及樹脂組合物的製造方法
CN113698755A (zh) * 2021-08-17 2021-11-26 广东兴盛迪科技有限公司 一种高耐热的ppe材料及其制备方法
TW202342631A (zh) * 2022-03-14 2023-11-01 日商三菱瓦斯化學股份有限公司 樹脂組成物、硬化物、預浸體、覆金屬箔疊層板、樹脂複合片、印刷配線板、及半導體裝置

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4059568A (en) 1976-08-30 1977-11-22 General Electric Company Method for the control of diamine catalyzed polyphenylene ether polymerization
US4707558A (en) 1986-09-03 1987-11-17 The Dow Chemical Company Monomers and oligomers containing a plurality of vinylbenzyl ether groups, method for their preparation and cured products therefrom
JPH0692532B2 (ja) 1989-03-08 1994-11-16 旭化成工業株式会社 難燃化複合材料
JPH0726013B2 (ja) 1989-02-08 1995-03-22 旭化成工業株式会社 硬化性ポリフェニレンエーテル樹脂組成物並びにこれを用いた複合材料および積層体
JPH0488056A (ja) 1990-07-31 1992-03-19 Asahi Chem Ind Co Ltd 新規な硬化性ポリフェニレンエーテル樹脂組成物並びにこれを用いた複合材料および積層体
JPH0488055A (ja) 1990-07-31 1992-03-19 Asahi Chem Ind Co Ltd 硬化性多官能ポリフェニレンエーテル樹脂組成物、並びにこれを用いた複合材料および積層体
JPH0488054A (ja) 1990-08-01 1992-03-19 Asahi Chem Ind Co Ltd 硬化性ポリフェニレンエーテル系樹脂組成物
JP3069367B2 (ja) 1990-08-07 2000-07-24 旭化成工業株式会社 硬化性ポリフェニレンエーテル樹脂組成物並びにこれを用いた複合材料および積層体
DE4128135A1 (de) 1991-08-24 1993-02-25 Basf Ag Thermoplastische formmasse auf basis von polyamiden und polyphenylenethern
US5214099A (en) 1992-02-25 1993-05-25 General Electric Company Epoxy-functionalized polyphenylene ethers of low gel content, method for their preparation, and copolymer-containing compositions prepared therefrom
JPH06172468A (ja) 1992-12-07 1994-06-21 Asahi Chem Ind Co Ltd 新規な硬化性ポリフェニレンエーテル系樹脂組成物
JP3289534B2 (ja) 1995-02-28 2002-06-10 松下電工株式会社 ポリフェニレンオキサイド樹脂組成物並びにそれを用いたプリプレグ及び積層板
US6211327B1 (en) 1999-02-05 2001-04-03 General Electric Company Process for the manufacture of low molecular weight polyphenylene ether resins
US6878782B2 (en) 1999-12-01 2005-04-12 General Electric Thermoset composition, method, and article
US6627704B2 (en) 1999-12-01 2003-09-30 General Electric Company Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom
US6812276B2 (en) 1999-12-01 2004-11-02 General Electric Company Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom
US6352782B2 (en) 1999-12-01 2002-03-05 General Electric Company Poly(phenylene ether)-polyvinyl thermosetting resin
US6306963B1 (en) 2000-05-08 2001-10-23 General Electric Co. Thermosetting resins and laminates
WO2002018493A1 (fr) 2000-08-30 2002-03-07 Asahi Kasei Kabushiki Kaisha Composition de resine durcissable
JP4448930B2 (ja) 2000-09-04 2010-04-14 財団法人新産業創造研究機構 中空高分子微粒子及びその製造法
JP2002265777A (ja) 2001-03-12 2002-09-18 Matsushita Electric Works Ltd ポリフェニレンオキサイド樹脂組成物、プリプレグ、積層板、プリント配線板、多層プリント配線板
JP2002308948A (ja) 2001-04-11 2002-10-23 Asahi Kasei Corp 硬化性樹脂組成物
JP4298943B2 (ja) * 2001-10-18 2009-07-22 日鉱金属株式会社 銅箔表面処理剤
US7413791B2 (en) * 2003-01-28 2008-08-19 Matsushita Electric Works, Ltd. Poly (phenylene ether) resin composition, prepreg, and laminated sheet

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