DE602004008033D1 - Poly(phenylenether)harzzusammensetzung, prepreg und laminatfolie - Google Patents
Poly(phenylenether)harzzusammensetzung, prepreg und laminatfolieInfo
- Publication number
- DE602004008033D1 DE602004008033D1 DE200460008033 DE602004008033T DE602004008033D1 DE 602004008033 D1 DE602004008033 D1 DE 602004008033D1 DE 200460008033 DE200460008033 DE 200460008033 DE 602004008033 T DE602004008033 T DE 602004008033T DE 602004008033 D1 DE602004008033 D1 DE 602004008033D1
- Authority
- DE
- Germany
- Prior art keywords
- phenylenether
- prepreg
- poly
- resin composition
- laminate foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- OMIHGPLIXGGMJB-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]hepta-1,3,5-triene Chemical compound C1=CC=C2OC2=C1 OMIHGPLIXGGMJB-UHFFFAOYSA-N 0.000 title 1
- 239000011888 foil Substances 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
- C08L71/126—Polyphenylene oxides modified by chemical after-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/06—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
- C08F283/08—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals on to polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/48—Polymers modified by chemical after-treatment
- C08G65/485—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
- C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterized by the type of post-polymerisation functionalisation
- C08G2650/20—Cross-linking
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2371/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
- C08J2371/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08J2371/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08J2371/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003019475 | 2003-01-28 | ||
JP2003019475 | 2003-01-28 | ||
JP2003136496 | 2003-05-14 | ||
JP2003136496 | 2003-05-14 | ||
PCT/JP2004/000554 WO2004067634A1 (en) | 2003-01-28 | 2004-01-22 | Poly(phenylene ether) resin composition, prepreg, and laminated sheet |
Publications (2)
Publication Number | Publication Date |
---|---|
DE602004008033D1 true DE602004008033D1 (de) | 2007-09-20 |
DE602004008033T2 DE602004008033T2 (de) | 2008-04-30 |
Family
ID=32737719
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200460008033 Expired - Lifetime DE602004008033T2 (de) | 2003-01-28 | 2004-01-22 | Poly(phenylenether)harzzusammensetzung, prepreg und laminatfolie |
Country Status (7)
Country | Link |
---|---|
US (2) | US7413791B2 (de) |
EP (1) | EP1592747B1 (de) |
JP (4) | JP4211784B2 (de) |
KR (1) | KR100728423B1 (de) |
DE (1) | DE602004008033T2 (de) |
TW (1) | TWI279418B (de) |
WO (1) | WO2004067634A1 (de) |
Families Citing this family (106)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6905637B2 (en) * | 2001-01-18 | 2005-06-14 | General Electric Company | Electrically conductive thermoset composition, method for the preparation thereof, and articles derived therefrom |
US7235192B2 (en) * | 1999-12-01 | 2007-06-26 | General Electric Company | Capped poly(arylene ether) composition and method |
US6878782B2 (en) * | 1999-12-01 | 2005-04-12 | General Electric | Thermoset composition, method, and article |
US6897282B2 (en) * | 2000-07-10 | 2005-05-24 | General Electric | Compositions comprising functionalized polyphenylene ether resins |
JP2002265777A (ja) * | 2001-03-12 | 2002-09-18 | Matsushita Electric Works Ltd | ポリフェニレンオキサイド樹脂組成物、プリプレグ、積層板、プリント配線板、多層プリント配線板 |
DE60336074D1 (de) | 2002-10-11 | 2011-03-31 | Univ Connecticut | Mischungen von amorphen und semikristallinen polymeren mit formgedächtniseigenscchaften |
US7250477B2 (en) * | 2002-12-20 | 2007-07-31 | General Electric Company | Thermoset composite composition, method, and article |
US7413791B2 (en) * | 2003-01-28 | 2008-08-19 | Matsushita Electric Works, Ltd. | Poly (phenylene ether) resin composition, prepreg, and laminated sheet |
JP2005045150A (ja) * | 2003-07-25 | 2005-02-17 | Matsushita Electric Ind Co Ltd | 中間接続用配線基材および多層配線基板、ならびにこれらの製造方法 |
US7067595B2 (en) * | 2003-10-03 | 2006-06-27 | General Electric Company | Poly (arylene ether) composition and method |
US7148296B2 (en) * | 2003-10-03 | 2006-12-12 | General Electric Company | Capped poly(arylene ether) composition and process |
US7211639B2 (en) * | 2003-10-03 | 2007-05-01 | General Electric Company | Composition comprising functionalized poly(arylene ether) and ethylene-alkyl (meth)acrylate copolymer, method for the preparation thereof, and articles prepared therefrom |
US7329708B2 (en) * | 2004-08-18 | 2008-02-12 | General Electric Company | Functionalized poly(arylene ether) composition and method |
JP2006206689A (ja) * | 2005-01-26 | 2006-08-10 | Matsushita Electric Works Ltd | ポリフェニレンエーテル樹脂組成物、プリプレグ、積層板 |
JP4747608B2 (ja) * | 2005-02-23 | 2011-08-17 | パナソニック電工株式会社 | ポリフェニレン樹脂組成物を含有するプリプレグ及び積層体 |
US7378455B2 (en) * | 2005-06-30 | 2008-05-27 | General Electric Company | Molding composition and method, and molded article |
US7429800B2 (en) * | 2005-06-30 | 2008-09-30 | Sabic Innovative Plastics Ip B.V. | Molding composition and method, and molded article |
US20070004871A1 (en) * | 2005-06-30 | 2007-01-04 | Qiwei Lu | Curable composition and method |
US20070066710A1 (en) * | 2005-09-21 | 2007-03-22 | Peters Edward N | Method for electrical insulation and insulated electrical conductor |
JP5123477B2 (ja) * | 2005-10-18 | 2013-01-23 | パナソニック株式会社 | 樹脂組成物、プリプレグ、積層体 |
TWI441866B (zh) * | 2006-02-17 | 2014-06-21 | Hitachi Chemical Co Ltd | A thermosetting resin composition of a semi-IPN type composite and a varnish, a prepreg and a metal laminate |
JP5303852B2 (ja) * | 2006-04-13 | 2013-10-02 | 日立化成株式会社 | セミipn型複合体の樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
JP5303853B2 (ja) * | 2006-04-14 | 2013-10-02 | 日立化成株式会社 | Ipn型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
JP5199569B2 (ja) * | 2006-06-27 | 2013-05-15 | パナソニック株式会社 | 低誘電樹脂組成物、プリプレグ、金属張積層板、プリント配線板 |
JP5433416B2 (ja) * | 2006-08-08 | 2014-03-05 | ワールド プラパティーズ、 インコーポレイテッド | 回路材料、回路および多層回路積層板 |
WO2008018483A1 (fr) * | 2006-08-08 | 2008-02-14 | Namics Corporation | Composition de résine thermodurcissable et film non durci en étant composé |
US20080071036A1 (en) * | 2006-09-15 | 2008-03-20 | Delsman Erik R | Cured poly(arylene ether) composition, method, and article |
US20080071035A1 (en) * | 2006-09-15 | 2008-03-20 | Delsman Erik R | Curable poly(arylene ether) composition and method |
US20080097069A1 (en) * | 2006-10-20 | 2008-04-24 | Hua Guo | Poly(arylene ether) method and composition |
US20080097027A1 (en) * | 2006-10-23 | 2008-04-24 | General Electric Company | Varnish composition for insulating electrical machinery |
JP5303854B2 (ja) * | 2006-10-24 | 2013-10-02 | 日立化成株式会社 | 新規なセミipn型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
US7582691B2 (en) | 2007-01-17 | 2009-09-01 | Sabic Innovative Plastics Ip B.V. | Poly(arylene ether) compositions and articles |
WO2009040921A1 (ja) * | 2007-09-27 | 2009-04-02 | Panasonic Electric Works Co., Ltd. | エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ及び金属張積層板 |
US8025926B2 (en) | 2008-04-23 | 2011-09-27 | Sabic Innovative Plastics Ip B.V. | Varnish compositions for electrical insulation and method of using the same |
JP5465854B2 (ja) * | 2008-08-26 | 2014-04-09 | パナソニック株式会社 | ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板 |
US8092722B2 (en) * | 2008-09-30 | 2012-01-10 | Sabic Innovative Plastics Ip B.V. | Varnish compositions for electrical insulation and method of using the same |
JP2011046083A (ja) * | 2009-08-26 | 2011-03-10 | Panasonic Electric Works Co Ltd | 金属張り積層板とその製造方法 |
KR20110139462A (ko) * | 2010-06-23 | 2011-12-29 | 삼성전기주식회사 | 절연수지 조성물 및 이를 이용하여 제조된 인쇄회로기판 |
TWI418594B (zh) * | 2010-12-16 | 2013-12-11 | Asahi Kasei E Materials Corp | Hardened resin composition |
WO2012164612A1 (ja) | 2011-05-31 | 2012-12-06 | パナソニック株式会社 | 接合体の製造方法及び接合体 |
WO2013047041A1 (ja) * | 2011-09-30 | 2013-04-04 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ及び金属箔張り積層板 |
US9051465B1 (en) | 2012-02-21 | 2015-06-09 | Park Electrochemical Corporation | Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound |
US9243164B1 (en) | 2012-02-21 | 2016-01-26 | Park Electrochemical Corporation | Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound |
KR101505358B1 (ko) | 2012-03-19 | 2015-03-23 | 아사히 가세이 이-매터리얼즈 가부시키가이샤 | 폴리페닐렌에테르 입자를 포함하는 프리프레그 |
KR20140138677A (ko) * | 2012-03-23 | 2014-12-04 | 미츠비시 가스 가가쿠 가부시키가이샤 | 프리프레그 및 적층판 |
JP6163292B2 (ja) * | 2012-06-15 | 2017-07-12 | 旭化成株式会社 | 硬化性樹脂組成物 |
JP5952100B2 (ja) * | 2012-06-15 | 2016-07-13 | 旭化成株式会社 | 硬化性樹脂組成物 |
JP6062667B2 (ja) * | 2012-06-15 | 2017-01-18 | 旭化成株式会社 | 硬化性樹脂組成物 |
CN102807658B (zh) | 2012-08-09 | 2014-06-11 | 广东生益科技股份有限公司 | 聚苯醚树脂组合物及使用其制作的半固化片与覆铜箔层压板 |
JP5914812B2 (ja) * | 2012-08-29 | 2016-05-11 | パナソニックIpマネジメント株式会社 | 変性ポリフェニレンエーテル、その製造方法、ポリフェニレンエーテル樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板 |
TWI464213B (zh) * | 2013-03-07 | 2014-12-11 | Taiwan Union Technology Corp | 樹脂組合物及其應用 |
TWI513761B (zh) | 2013-04-30 | 2015-12-21 | Ind Tech Res Inst | 樹脂組合物、膠片、及包含其之基材 |
US10590223B2 (en) * | 2013-06-18 | 2020-03-17 | Panasonic Intellectual Property Management Co., Ltd. | Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board |
JP6148118B2 (ja) * | 2013-08-28 | 2017-06-14 | 旭化成株式会社 | Ppe含有樹脂組成物 |
US10047224B2 (en) | 2013-11-20 | 2018-08-14 | Asahi Kasei Kabushiki Kaisha | Cured product of polyphenylene ether-containing resin composition |
KR20150068181A (ko) * | 2013-12-11 | 2015-06-19 | 주식회사 두산 | 저유전 손실 특성을 가진 고주파용 열경화성 수지 조성물, 이를 이용한 프리프레그, 및 동박적층판 |
WO2015089807A1 (en) * | 2013-12-19 | 2015-06-25 | Dow Global Technologies Llc | Vinyl-capped poly(phenylene) ether and styrene-butadiene copolymer blends for curable compositions |
CN106660322B (zh) * | 2014-07-16 | 2019-11-22 | 松下知识产权经营株式会社 | 覆金属箔层压板及其制造方法、附着树脂的金属箔、和印刷电路板 |
WO2016038878A1 (ja) * | 2014-09-09 | 2016-03-17 | パナソニックIpマネジメント株式会社 | 硬化性組成物、プリプレグ、樹脂付き金属箔、金属張積層板、及びプリント配線板 |
JP6504386B2 (ja) * | 2014-12-16 | 2019-04-24 | パナソニックIpマネジメント株式会社 | ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板及びプリント配線板 |
KR101865649B1 (ko) * | 2014-12-22 | 2018-07-04 | 주식회사 두산 | 고주파용 열경화성 수지 조성물, 이를 이용한 프리프레그, 적층 시트 및 인쇄회로기판 |
KR102455920B1 (ko) | 2015-01-13 | 2022-10-17 | 쇼와덴코머티리얼즈가부시끼가이샤 | 수지 조성물, 수지층 부착 지지체, 프리프레그, 적층판, 다층 프린트 배선판 및 밀리미터파 레이더용 프린트 배선판 |
JP6817564B2 (ja) | 2015-01-19 | 2021-01-20 | パナソニックIpマネジメント株式会社 | 樹脂付き金属箔 |
US9637596B2 (en) | 2015-03-10 | 2017-05-02 | International Business Machines Corporation | Polyhemiaminal and polyhexahydrotriazine materials from 1,4 conjugate addition reactions |
JP6579309B2 (ja) * | 2015-05-01 | 2019-09-25 | 味の素株式会社 | 硬化性組成物 |
JP6724305B2 (ja) * | 2015-07-24 | 2020-07-15 | 三菱瓦斯化学株式会社 | プリプレグ |
JP2017031276A (ja) * | 2015-07-30 | 2017-02-09 | パナソニックIpマネジメント株式会社 | 熱硬化性樹脂組成物、並びに、それを用いた樹脂ワニス、樹脂付金属箔、樹脂フィルム、金属張積層板及びプリント配線板 |
JP2017047648A (ja) * | 2015-09-04 | 2017-03-09 | 三菱瓦斯化学株式会社 | 銅張積層板 |
JP6623640B2 (ja) * | 2015-09-18 | 2019-12-25 | 三菱瓦斯化学株式会社 | プリプレグ |
JP7422046B2 (ja) | 2015-10-14 | 2024-01-25 | 三菱瓦斯化学株式会社 | プリプレグ |
JP7082454B2 (ja) * | 2015-10-16 | 2022-06-08 | 三菱瓦斯化学株式会社 | プリプレグ、積層体及びプリント配線基板 |
CN106609030B (zh) * | 2015-10-21 | 2018-12-25 | 广东生益科技股份有限公司 | 一种聚苯醚树脂组合物及其在高频电路基板中的应用 |
CN106609039B (zh) * | 2015-10-21 | 2019-09-13 | 广东生益科技股份有限公司 | 一种聚苯醚树脂组合物及其在高频电路基板中的应用 |
JP6601675B2 (ja) * | 2016-01-14 | 2019-11-06 | パナソニックIpマネジメント株式会社 | 金属張積層板および樹脂付金属箔 |
JP6906171B2 (ja) * | 2016-01-19 | 2021-07-21 | パナソニックIpマネジメント株式会社 | ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板及びプリント配線板 |
KR20180104631A (ko) | 2016-01-26 | 2018-09-21 | 파나소닉 아이피 매니지먼트 가부시키가이샤 | 다층 프린트 배선판 및 다층 금속 클래드 적층판 |
JP2017141314A (ja) * | 2016-02-08 | 2017-08-17 | 三菱瓦斯化学株式会社 | プリプレグ |
JP6769049B2 (ja) * | 2016-03-04 | 2020-10-14 | 三菱瓦斯化学株式会社 | 多層基板 |
KR101708146B1 (ko) * | 2016-03-11 | 2017-02-17 | 주식회사 두산 | 저유전 손실 특성을 가진 고주파용 열경화성 수지 조성물, 이를 이용한 프리프레그, 및 동박적층판 |
EP3464449B1 (de) | 2016-05-26 | 2019-08-21 | SABIC Global Technologies B.V. | Thermoplastische zusammensetzungen für elektronik oder telekommunikationsanwendungen und daraus geformte gegenstände |
WO2018030112A1 (ja) * | 2016-08-10 | 2018-02-15 | パナソニックIpマネジメント株式会社 | 封止用アクリル組成物、シート材、積層シート、硬化物、半導体装置及び半導体装置の製造方法 |
WO2018061736A1 (ja) * | 2016-09-27 | 2018-04-05 | パナソニックIpマネジメント株式会社 | 金属張積層板、プリント配線板および樹脂付金属箔 |
CN110099932A (zh) | 2016-12-16 | 2019-08-06 | 诺佛赛特有限责任公司 | 树脂组合物 |
JPWO2018159080A1 (ja) * | 2017-03-02 | 2019-12-19 | パナソニックIpマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
CN111148782B (zh) | 2017-09-29 | 2022-10-14 | 松下知识产权经营株式会社 | 预浸料、覆金属箔层压板及布线板 |
US11820105B2 (en) | 2017-09-29 | 2023-11-21 | Panasonic Intellectual Property Management Co., Ltd. | Prepreg, metal-clad laminate, and wiring board |
WO2019189829A1 (ja) | 2018-03-29 | 2019-10-03 | 旭化成株式会社 | ポリフェニレンエーテル、その組成物及び製造方法 |
JP7102202B2 (ja) * | 2018-04-19 | 2022-07-19 | 旭化成株式会社 | ポリフェニレンエーテル及びその製造方法 |
CN112020523B (zh) * | 2018-04-27 | 2023-10-24 | 松下知识产权经营株式会社 | 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板、以及布线板 |
CN112368311B (zh) * | 2018-07-19 | 2023-11-03 | 松下知识产权经营株式会社 | 树脂组合物、预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板、以及布线板 |
JP7401917B2 (ja) | 2019-02-12 | 2023-12-20 | ナミックス株式会社 | 光硬化性樹脂組成物及びそれを硬化させて得られる硬化物 |
JP7202920B2 (ja) * | 2019-02-20 | 2023-01-12 | 旭化成株式会社 | ポリフェニレンエーテル含有樹脂組成物 |
WO2020196759A1 (ja) * | 2019-03-27 | 2020-10-01 | パナソニックIpマネジメント株式会社 | プリプレグ、金属張積層板、及び配線板 |
JP7308082B2 (ja) * | 2019-06-13 | 2023-07-13 | 旭化成株式会社 | ポリフェニレンエーテル含有樹脂組成物 |
US20220259424A1 (en) * | 2019-07-17 | 2022-08-18 | Panasonic Intellectual Property Management Co., Ltd. | Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board |
CN114174434B (zh) | 2019-08-06 | 2024-03-08 | 日本曹达株式会社 | 聚苯醚树脂组合物、预浸料坯、及覆金属层叠板 |
JPWO2021059911A1 (de) * | 2019-09-27 | 2021-04-01 | ||
CN111471144B (zh) * | 2020-03-27 | 2022-05-31 | 顺德职业技术学院 | 丙烯酸改性低介电含氟聚苯醚混合胶及其制备的5g覆铜板 |
JP2023120458A (ja) * | 2020-07-10 | 2023-08-30 | Agc株式会社 | 樹脂組成物、プリプレグ、樹脂付き金属箔、樹脂付きフィルム、金属張積層板、及び配線基板、並びに、変性ポリフェニレンエーテルの製造方法 |
TWI795658B (zh) * | 2020-07-23 | 2023-03-11 | 南亞塑膠工業股份有限公司 | 高頻基板用樹脂組成物及金屬積層板 |
CN112358717A (zh) * | 2020-11-23 | 2021-02-12 | 江苏诺德新材料股份有限公司 | 一种改性聚苯醚树脂组合物及其制造的高频覆铜板 |
JP2022103683A (ja) | 2020-12-28 | 2022-07-08 | 日揮触媒化成株式会社 | シリカ系中空粒子及びその製造方法、並びに樹脂組成物 |
KR20230164008A (ko) | 2021-03-31 | 2023-12-01 | 니끼 쇼꾸바이 카세이 가부시키가이샤 | 분체 및 그 제조 방법, 그리고 수지 조성물의 제조 방법 |
TW202302744A (zh) | 2021-03-31 | 2023-01-16 | 日商日揮觸媒化成股份有限公司 | 粉體及其製造方法、以及樹脂組合物的製造方法 |
CN113698755A (zh) * | 2021-08-17 | 2021-11-26 | 广东兴盛迪科技有限公司 | 一种高耐热的ppe材料及其制备方法 |
TW202342631A (zh) * | 2022-03-14 | 2023-11-01 | 日商三菱瓦斯化學股份有限公司 | 樹脂組成物、硬化物、預浸體、覆金屬箔疊層板、樹脂複合片、印刷配線板、及半導體裝置 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4059568A (en) | 1976-08-30 | 1977-11-22 | General Electric Company | Method for the control of diamine catalyzed polyphenylene ether polymerization |
US4707558A (en) | 1986-09-03 | 1987-11-17 | The Dow Chemical Company | Monomers and oligomers containing a plurality of vinylbenzyl ether groups, method for their preparation and cured products therefrom |
JPH0692532B2 (ja) | 1989-03-08 | 1994-11-16 | 旭化成工業株式会社 | 難燃化複合材料 |
JPH0726013B2 (ja) | 1989-02-08 | 1995-03-22 | 旭化成工業株式会社 | 硬化性ポリフェニレンエーテル樹脂組成物並びにこれを用いた複合材料および積層体 |
JPH0488056A (ja) | 1990-07-31 | 1992-03-19 | Asahi Chem Ind Co Ltd | 新規な硬化性ポリフェニレンエーテル樹脂組成物並びにこれを用いた複合材料および積層体 |
JPH0488055A (ja) | 1990-07-31 | 1992-03-19 | Asahi Chem Ind Co Ltd | 硬化性多官能ポリフェニレンエーテル樹脂組成物、並びにこれを用いた複合材料および積層体 |
JPH0488054A (ja) | 1990-08-01 | 1992-03-19 | Asahi Chem Ind Co Ltd | 硬化性ポリフェニレンエーテル系樹脂組成物 |
JP3069367B2 (ja) | 1990-08-07 | 2000-07-24 | 旭化成工業株式会社 | 硬化性ポリフェニレンエーテル樹脂組成物並びにこれを用いた複合材料および積層体 |
DE4128135A1 (de) | 1991-08-24 | 1993-02-25 | Basf Ag | Thermoplastische formmasse auf basis von polyamiden und polyphenylenethern |
US5214099A (en) | 1992-02-25 | 1993-05-25 | General Electric Company | Epoxy-functionalized polyphenylene ethers of low gel content, method for their preparation, and copolymer-containing compositions prepared therefrom |
JPH06172468A (ja) | 1992-12-07 | 1994-06-21 | Asahi Chem Ind Co Ltd | 新規な硬化性ポリフェニレンエーテル系樹脂組成物 |
JP3289534B2 (ja) | 1995-02-28 | 2002-06-10 | 松下電工株式会社 | ポリフェニレンオキサイド樹脂組成物並びにそれを用いたプリプレグ及び積層板 |
US6211327B1 (en) | 1999-02-05 | 2001-04-03 | General Electric Company | Process for the manufacture of low molecular weight polyphenylene ether resins |
US6878782B2 (en) | 1999-12-01 | 2005-04-12 | General Electric | Thermoset composition, method, and article |
US6627704B2 (en) | 1999-12-01 | 2003-09-30 | General Electric Company | Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom |
US6812276B2 (en) | 1999-12-01 | 2004-11-02 | General Electric Company | Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom |
US6352782B2 (en) | 1999-12-01 | 2002-03-05 | General Electric Company | Poly(phenylene ether)-polyvinyl thermosetting resin |
US6306963B1 (en) | 2000-05-08 | 2001-10-23 | General Electric Co. | Thermosetting resins and laminates |
WO2002018493A1 (fr) | 2000-08-30 | 2002-03-07 | Asahi Kasei Kabushiki Kaisha | Composition de resine durcissable |
JP4448930B2 (ja) | 2000-09-04 | 2010-04-14 | 財団法人新産業創造研究機構 | 中空高分子微粒子及びその製造法 |
JP2002265777A (ja) | 2001-03-12 | 2002-09-18 | Matsushita Electric Works Ltd | ポリフェニレンオキサイド樹脂組成物、プリプレグ、積層板、プリント配線板、多層プリント配線板 |
JP2002308948A (ja) | 2001-04-11 | 2002-10-23 | Asahi Kasei Corp | 硬化性樹脂組成物 |
JP4298943B2 (ja) * | 2001-10-18 | 2009-07-22 | 日鉱金属株式会社 | 銅箔表面処理剤 |
US7413791B2 (en) * | 2003-01-28 | 2008-08-19 | Matsushita Electric Works, Ltd. | Poly (phenylene ether) resin composition, prepreg, and laminated sheet |
-
2003
- 2003-11-24 US US10/718,525 patent/US7413791B2/en active Active
-
2004
- 2004-01-19 TW TW93101338A patent/TWI279418B/zh not_active IP Right Cessation
- 2004-01-22 DE DE200460008033 patent/DE602004008033T2/de not_active Expired - Lifetime
- 2004-01-22 JP JP2005518364A patent/JP4211784B2/ja not_active Expired - Lifetime
- 2004-01-22 KR KR1020057013931A patent/KR100728423B1/ko active IP Right Grant
- 2004-01-22 EP EP04704333A patent/EP1592747B1/de not_active Expired - Lifetime
- 2004-01-22 WO PCT/JP2004/000554 patent/WO2004067634A1/en active IP Right Grant
-
2008
- 2008-04-28 JP JP2008117237A patent/JP4900314B2/ja not_active Expired - Lifetime
- 2008-04-28 JP JP2008117238A patent/JP4900315B2/ja not_active Expired - Lifetime
- 2008-04-28 JP JP2008117236A patent/JP4900313B2/ja not_active Expired - Lifetime
- 2008-06-17 US US12/140,888 patent/US7838576B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE602004008033T2 (de) | 2008-04-30 |
KR20050100645A (ko) | 2005-10-19 |
US7413791B2 (en) | 2008-08-19 |
JP2008303382A (ja) | 2008-12-18 |
WO2004067634A1 (en) | 2004-08-12 |
JP4900314B2 (ja) | 2012-03-21 |
EP1592747B1 (de) | 2007-08-08 |
US7838576B2 (en) | 2010-11-23 |
US20080254257A1 (en) | 2008-10-16 |
JP4900313B2 (ja) | 2012-03-21 |
TWI279418B (en) | 2007-04-21 |
KR100728423B1 (ko) | 2007-06-13 |
JP2006516297A (ja) | 2006-06-29 |
JP4900315B2 (ja) | 2012-03-21 |
JP2008260941A (ja) | 2008-10-30 |
JP2008260942A (ja) | 2008-10-30 |
US20040146692A1 (en) | 2004-07-29 |
JP4211784B2 (ja) | 2009-01-21 |
EP1592747A1 (de) | 2005-11-09 |
TW200420663A (en) | 2004-10-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE602004008033D1 (de) | Poly(phenylenether)harzzusammensetzung, prepreg und laminatfolie | |
GB2444010B (en) | Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate | |
HK1076119A1 (en) | Resin composition and prepreg for laminate and metal-clad laminate | |
EP1860133A4 (de) | Epoxidharz, epoxidharzzusammensetzung sowie prepreg und verbundplatte damit | |
DE602006011456D1 (de) | Weisses prepreg, weisse laminatplatte und mit weisser laminatplatte ummantelte metallfolie | |
DK1646685T3 (da) | Cellulosefyldte, termoplastiske kompositter | |
DE602004023568D1 (de) | Bipolare Batterie, Mehrschichtfolien und Kunstharzschicht | |
HK1130277A1 (en) | Resin composition, prepreg and laminate using the same | |
DE602005008523D1 (de) | Vernetzbare Harzzusammensetzung, vernetzbarer Film und vernetzter Film | |
IL177325A0 (en) | Permanent resist composition, cured product thereof, and use thereof | |
DE602005012281D1 (de) | Mundpflegezusammensetzung mit vernetztem polymerperoxid | |
DE10197110T1 (de) | Atmungsaktive, biologisch abbaubare/kompostierbare Laminate | |
DE602004023521D1 (de) | Sperrlaminate ohne folie | |
BR0300219B1 (pt) | fluorocopolìmero e laminado de múltiplas camadas. | |
HK1120312A1 (en) | Multilayer films including thermoplastic silicone block copolymers | |
EP2039715A4 (de) | Thermoplastisches polyimid und kaschierte polyimidfolie und metallfolienkaschierte polyimidfolie unter verwendung des thermoplastischen polyimids | |
EP1928930A4 (de) | Polyalkylenglykolmonomer, dieses enthaltendes polyalkylenglykolpolymer und anwendung davon | |
TWI369383B (en) | Curable liquid composition, cured film, and antistantic laminate | |
TWI339614B (en) | Solution casitng method and polymer film | |
GB2432837B (en) | Polymeric compound, thin polymer film, and thin polymer film element including the same | |
DE602004029009D1 (de) | Laminatfolie | |
DE60223228D1 (de) | Polymerverbundschaumstoff | |
SG115798A1 (en) | Polymer composite | |
DE60336040D1 (de) | Verbundfolie, Laminatbatterie und zugehöriges Verfahren | |
DE60211302D1 (de) | Transparenter Harzschichtstoff und damit versehener Formkörper |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |