DE60144530D1 - Positiv lichtempfindliche polyimidharzzusammensetzung - Google Patents

Positiv lichtempfindliche polyimidharzzusammensetzung

Info

Publication number
DE60144530D1
DE60144530D1 DE60144530T DE60144530T DE60144530D1 DE 60144530 D1 DE60144530 D1 DE 60144530D1 DE 60144530 T DE60144530 T DE 60144530T DE 60144530 T DE60144530 T DE 60144530T DE 60144530 D1 DE60144530 D1 DE 60144530D1
Authority
DE
Germany
Prior art keywords
resin composition
polyimide resin
positive light
sensitive polyimide
sensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60144530T
Other languages
English (en)
Inventor
Tadashi Hatanaka
Tomonari Nakayama
Takayasu Nihira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Chemical Corp
Original Assignee
Nissan Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Application granted granted Critical
Publication of DE60144530D1 publication Critical patent/DE60144530D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE60144530T 2000-10-04 2001-10-03 Positiv lichtempfindliche polyimidharzzusammensetzung Expired - Lifetime DE60144530D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000304767A JP4390028B2 (ja) 2000-10-04 2000-10-04 ポジ型感光性ポリイミド樹脂組成物
PCT/JP2001/008692 WO2002029494A1 (fr) 2000-10-04 2001-10-03 Composition de resine de polyimide photosensible positive

Publications (1)

Publication Number Publication Date
DE60144530D1 true DE60144530D1 (de) 2011-06-09

Family

ID=18785754

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60144530T Expired - Lifetime DE60144530D1 (de) 2000-10-04 2001-10-03 Positiv lichtempfindliche polyimidharzzusammensetzung

Country Status (8)

Country Link
US (1) US6875554B2 (de)
EP (1) EP1329769B1 (de)
JP (1) JP4390028B2 (de)
KR (1) KR100824573B1 (de)
CN (1) CN1223901C (de)
DE (1) DE60144530D1 (de)
TW (1) TWI245974B (de)
WO (1) WO2002029494A1 (de)

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JP2009019105A (ja) 2007-07-11 2009-01-29 Nitto Denko Corp ポリイミドからなる光半導体素子封止用樹脂
US9005785B2 (en) * 2007-09-24 2015-04-14 GM Global Technology Operations LLC Open-loop system and method for fuel cell stack start-up with low-voltage source
CN101809057B (zh) * 2007-10-19 2012-07-18 日产化学工业株式会社 热固化膜形成用聚酯组合物
US8258017B2 (en) * 2007-12-04 2012-09-04 Hitachi Chemical Company, Ltd. Photosensitive adhesive
KR101113063B1 (ko) * 2008-05-22 2012-02-15 주식회사 엘지화학 폴리이미드와 노볼락 수지를 포함하는 감광성 수지 조성물
CN102186904A (zh) * 2008-10-20 2011-09-14 日本化药株式会社 聚酰亚胺树脂及其组合物
CN102187277B (zh) 2008-10-20 2014-07-09 住友电木株式会社 喷涂用正型感光性树脂组合物及使用该组合物的贯通电极的制造方法
US8257901B2 (en) * 2009-03-10 2012-09-04 Lg Chem, Ltd. Polyimide-based polymers, copolymers thereof and positive type photoresist compositions comprising the same
CN102361932B (zh) * 2009-03-23 2013-07-17 日产化学工业株式会社 热固化膜形成用聚酯组合物
JP5626536B2 (ja) * 2009-04-14 2014-11-19 日産化学工業株式会社 熱硬化膜形成用感光性ポリエステル組成物
US20110144297A1 (en) * 2009-12-15 2011-06-16 E. I. Du Pont De Nemours And Company Rapid thermal conversion of a polyamic acid fiber to a polyimide fiber
CN102985876A (zh) * 2010-07-14 2013-03-20 株式会社Lg化学 正型光敏树脂组合物及包含其的有机发光装置遮屏
JP5537345B2 (ja) * 2010-09-03 2014-07-02 株式会社ジャパンディスプレイ 液晶表示装置
KR20130035779A (ko) 2011-09-30 2013-04-09 코오롱인더스트리 주식회사 포지티브형 감광성 수지 조성물，이로부터 형성된 절연막 및 유기발광소자
WO2014007544A1 (ko) * 2012-07-03 2014-01-09 주식회사 엘지화학 폴리아믹산 고분자 복합체 및 이의 제조방법
KR101382170B1 (ko) 2012-07-03 2014-04-07 주식회사 엘지화학 폴리아믹산 고분자 복합체 및 이의 제조방법
TWI583773B (zh) 2012-12-18 2017-05-21 財團法人工業技術研究院 有機發光二極體
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US9502231B2 (en) 2013-03-12 2016-11-22 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist layer and method
US9175173B2 (en) 2013-03-12 2015-11-03 Taiwan Semiconductor Manufacturing Company, Ltd. Unlocking layer and method
US9543147B2 (en) 2013-03-12 2017-01-10 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist and method of manufacture
US9256128B2 (en) 2013-03-12 2016-02-09 Taiwan Semiconductor Manufacturing Company, Ltd. Method for manufacturing semiconductor device
US9245751B2 (en) 2013-03-12 2016-01-26 Taiwan Semiconductor Manufacturing Company, Ltd. Anti-reflective layer and method
US9354521B2 (en) 2013-03-12 2016-05-31 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist system and method
US8932799B2 (en) 2013-03-12 2015-01-13 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist system and method
US9110376B2 (en) 2013-03-12 2015-08-18 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist system and method
US9117881B2 (en) 2013-03-15 2015-08-25 Taiwan Semiconductor Manufacturing Company, Ltd. Conductive line system and process
KR101685743B1 (ko) * 2013-06-11 2016-12-12 주식회사 엘지화학 고감도 및 고잔막율 특성을 가지는 감광성 수지 조성물
US9341945B2 (en) 2013-08-22 2016-05-17 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist and method of formation and use
US10036953B2 (en) 2013-11-08 2018-07-31 Taiwan Semiconductor Manufacturing Company Photoresist system and method
US10095113B2 (en) 2013-12-06 2018-10-09 Taiwan Semiconductor Manufacturing Company Photoresist and method
US9761449B2 (en) 2013-12-30 2017-09-12 Taiwan Semiconductor Manufacturing Company, Ltd. Gap filling materials and methods
US9599896B2 (en) 2014-03-14 2017-03-21 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist system and method
JP5759042B2 (ja) * 2014-04-25 2015-08-05 株式会社ジャパンディスプレイ 液晶用配向膜材料
US9581908B2 (en) 2014-05-16 2017-02-28 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist and method
US20170293224A1 (en) * 2014-09-26 2017-10-12 Toray Industries, Inc. Organic el display device
EP3225647A4 (de) * 2014-11-27 2018-08-01 Toray Industries, Inc. Harz sowie lichtempfindliche harzzusammensetzung
KR102637508B1 (ko) 2015-08-03 2024-02-15 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 세정 조성물
CN106750292A (zh) * 2016-12-28 2017-05-31 杭州福斯特光伏材料股份有限公司 一种用于印刷电子的聚酰亚胺
CN109517172B (zh) * 2017-09-18 2023-08-29 嘉兴山蒲照明电器有限公司 一种有机硅改性聚酰亚胺树脂组合物及其应用
JP7008732B2 (ja) * 2018-01-29 2022-01-25 富士フイルム株式会社 感光性樹脂組成物、樹脂、硬化膜、積層体、硬化膜の製造方法、半導体デバイス
KR102303748B1 (ko) 2019-03-13 2021-09-16 주식회사 엘지화학 폴리이미드 공중합체, 폴리이미드 공중합체의 제조방법, 이를 이용한 감광성 수지 조성물, 감광성 수지 필름 및 광학 장치
KR20220079584A (ko) * 2019-10-03 2022-06-13 다이요 홀딩스 가부시키가이샤 감광성 수지 조성물, 드라이 필름, 경화물 및 전자 부품
CN111303420A (zh) * 2019-11-19 2020-06-19 上海极紫科技有限公司 一种可碱显影的正性聚酰亚胺光敏树脂及其制备方法
CN111303421A (zh) * 2019-11-20 2020-06-19 上海极紫科技有限公司 一种可用作正性光刻胶的聚酰亚胺树脂及其制备方法
CN111303422A (zh) * 2019-11-21 2020-06-19 上海极紫科技有限公司 一种可正性光刻胶用聚酰亚胺树脂及其制备方法
CN111393643A (zh) * 2019-11-28 2020-07-10 艾森半导体材料(南通)有限公司 一种正性光敏聚酰亚胺树脂及其制备方法
CN111333837B (zh) * 2020-01-07 2022-11-25 上海极紫科技有限公司 一种正性光敏聚酰亚胺树脂及其制备方法
CN111423582B (zh) * 2020-01-09 2023-04-18 上海极紫科技有限公司 正性光刻胶用聚酰亚胺树脂及其制备方法

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Also Published As

Publication number Publication date
TWI245974B (en) 2005-12-21
JP2002116541A (ja) 2002-04-19
JP4390028B2 (ja) 2009-12-24
KR20040004387A (ko) 2004-01-13
KR100824573B1 (ko) 2008-04-23
CN1468391A (zh) 2004-01-14
CN1223901C (zh) 2005-10-19
EP1329769A4 (de) 2007-11-21
EP1329769A1 (de) 2003-07-23
WO2002029494A1 (fr) 2002-04-11
US20040048188A1 (en) 2004-03-11
US6875554B2 (en) 2005-04-05
EP1329769B1 (de) 2011-04-27

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