DE60107543D1 - Wärmehärtbare harzzusammensetzung - Google Patents

Wärmehärtbare harzzusammensetzung

Info

Publication number
DE60107543D1
DE60107543D1 DE60107543T DE60107543T DE60107543D1 DE 60107543 D1 DE60107543 D1 DE 60107543D1 DE 60107543 T DE60107543 T DE 60107543T DE 60107543 T DE60107543 T DE 60107543T DE 60107543 D1 DE60107543 D1 DE 60107543D1
Authority
DE
Germany
Prior art keywords
heat
resin composition
curable resin
curable
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60107543T
Other languages
English (en)
Other versions
DE60107543T2 (de
Inventor
Takao Fukuzawa
Takayoshi Hirai
Tetsuro Imura
Yoshinobu Ohnuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resolution Research Nederland BV
Original Assignee
Resolution Research Nederland BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resolution Research Nederland BV filed Critical Resolution Research Nederland BV
Application granted granted Critical
Publication of DE60107543D1 publication Critical patent/DE60107543D1/de
Publication of DE60107543T2 publication Critical patent/DE60107543T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
    • C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
    • C08G14/06—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
    • C08G14/10—Melamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C08G59/623—Aminophenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C08L61/04, C08L61/18 and C08L61/20
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
DE60107543T 2000-02-15 2001-02-15 Wärmehärtbare harzzusammensetzung Expired - Lifetime DE60107543T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000077231 2000-02-15
JP2000077231A JP2001226464A (ja) 2000-02-15 2000-02-15 熱硬化性樹脂組成物
PCT/EP2001/001778 WO2001060913A1 (en) 2000-02-15 2001-02-15 Thermosetting resin composition

Publications (2)

Publication Number Publication Date
DE60107543D1 true DE60107543D1 (de) 2005-01-05
DE60107543T2 DE60107543T2 (de) 2005-12-15

Family

ID=18594837

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60107543T Expired - Lifetime DE60107543T2 (de) 2000-02-15 2001-02-15 Wärmehärtbare harzzusammensetzung

Country Status (10)

Country Link
US (1) US6515047B2 (de)
EP (1) EP1259566B1 (de)
JP (1) JP2001226464A (de)
KR (1) KR100794064B1 (de)
CN (1) CN1189517C (de)
AU (1) AU2001233775A1 (de)
DE (1) DE60107543T2 (de)
MY (1) MY133799A (de)
TW (1) TW539716B (de)
WO (1) WO2001060913A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6605354B1 (en) * 2001-08-28 2003-08-12 Borden Chemical, Inc. High nitrogen containing triazine-phenol-aldehyde condensate
TW513482B (en) * 2001-08-31 2002-12-11 Chang Chun Plastics Co Ltd Nitrogen-containing flame-retardant epoxy resin and its compositions
EP1312638A1 (de) * 2001-11-16 2003-05-21 Resolution Research Nederland B.V. Halogenfreie, Phosphor- und Stickstoff-enthaltende, flammhemmende Epoxyharzzusammensetzung, und davon abgeleitete Prepregs
CN100398592C (zh) * 2005-05-20 2008-07-02 长兴化学工业股份有限公司 阻燃剂和含所述阻燃剂的阻燃性树脂组成物及其用途
TWI475038B (zh) 2005-11-30 2015-03-01 Dainippon Ink & Chemicals 苯酚樹脂組成物、其硬化物、覆銅積層板用樹脂組成物、覆銅積層板及新穎苯酚樹脂
KR20100071485A (ko) * 2008-12-19 2010-06-29 삼성전기주식회사 웨이퍼 레벨 패키지의 제조방법
JP5439818B2 (ja) * 2009-01-07 2014-03-12 日立化成株式会社 接着剤組成物、フィルム状接着剤、接着シート及び半導体装置
US9249251B2 (en) 2010-08-17 2016-02-02 Hexion Inc. Compositions and methods to produce triazine-arylhydroxy-aldehyde condensates with improved solubility
JP2017088656A (ja) * 2015-11-04 2017-05-25 信越化学工業株式会社 難燃性樹脂組成物、難燃性樹脂フィルム及び半導体装置とその製造方法
CN105566848B (zh) * 2016-01-19 2018-02-02 南京航空航天大学 一种改性耐高温三聚氰胺甲醛泡沫及其制备方法
KR101943698B1 (ko) * 2016-01-29 2019-01-29 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자
KR20220061086A (ko) 2019-09-06 2022-05-12 다이요 잉키 세이조 가부시키가이샤 경화성 수지 조성물, 그의 드라이 필름 및 경화물, 그리고 그 경화물을 포함하는 전자 부품

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5277163A (en) * 1975-12-24 1977-06-29 Asahi Chem Ind Co Ltd Stabilized polyurethane composition
JPS6018531A (ja) * 1983-07-12 1985-01-30 Toshiba Chem Corp 難燃性積層板用樹脂組成物
JPS6023467A (ja) * 1983-07-20 1985-02-06 Yuka Meramin Kk 木材用接着剤組成物
WO1997012925A1 (en) * 1995-09-29 1997-04-10 Toshiba Chemical Corporation Halogen-free flame-retardant epoxy resin composition, and prepreg and laminate containing the same
JPH10195178A (ja) * 1997-01-06 1998-07-28 Toshiba Chem Corp 難燃性エポキシ樹脂組成物、プリプレグ、積層板、銅張積層板及びプリント配線板
JP3785749B2 (ja) * 1997-04-17 2006-06-14 味の素株式会社 エポキシ樹脂組成物並びに該組成物を用いた多層プリント配線板の製造法
DE69800113T2 (de) * 1997-05-09 2000-09-28 Dainippon Ink & Chemicals Phenolharz-Zusammensetzungen und Verfahren zu deren Herstellung

Also Published As

Publication number Publication date
JP2001226464A (ja) 2001-08-21
DE60107543T2 (de) 2005-12-15
WO2001060913A1 (en) 2001-08-23
TW539716B (en) 2003-07-01
US20010031851A1 (en) 2001-10-18
CN1400988A (zh) 2003-03-05
MY133799A (en) 2007-11-30
EP1259566A1 (de) 2002-11-27
AU2001233775A1 (en) 2001-08-27
EP1259566B1 (de) 2004-12-01
KR20020086534A (ko) 2002-11-18
CN1189517C (zh) 2005-02-16
KR100794064B1 (ko) 2008-01-10
US6515047B2 (en) 2003-02-04

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