DE60118833D1 - Halbleiter-Speicher mit unterteilter Wortleitungstruktur - Google Patents

Halbleiter-Speicher mit unterteilter Wortleitungstruktur

Info

Publication number
DE60118833D1
DE60118833D1 DE60118833T DE60118833T DE60118833D1 DE 60118833 D1 DE60118833 D1 DE 60118833D1 DE 60118833 T DE60118833 T DE 60118833T DE 60118833 T DE60118833 T DE 60118833T DE 60118833 D1 DE60118833 D1 DE 60118833D1
Authority
DE
Germany
Prior art keywords
subdivided
semiconductor memory
wordline structure
wordline
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60118833T
Other languages
English (en)
Other versions
DE60118833T2 (de
Inventor
Masaharu Wada
Kenji Tuchida
Tsuneo Inaba
Atsushi Takeuchi
Toshimi Ikeda
Kuninori Kawabata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Fujitsu Semiconductor Ltd
Original Assignee
Toshiba Corp
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Fujitsu Ltd filed Critical Toshiba Corp
Publication of DE60118833D1 publication Critical patent/DE60118833D1/de
Application granted granted Critical
Publication of DE60118833T2 publication Critical patent/DE60118833T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • G11C5/063—Voltage and signal distribution in integrated semi-conductor memory access lines, e.g. word-line, bit-line, cross-over resistance, propagation delay

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Dram (AREA)
  • Semiconductor Memories (AREA)
DE60118833T 2000-06-06 2001-06-06 Halbleiter-Speicher mit unterteilter Wortleitungstruktur Expired - Lifetime DE60118833T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000168995A JP2001344966A (ja) 2000-06-06 2000-06-06 半導体記憶装置
JP2000168995 2000-06-06

Publications (2)

Publication Number Publication Date
DE60118833D1 true DE60118833D1 (de) 2006-05-24
DE60118833T2 DE60118833T2 (de) 2006-11-23

Family

ID=18671926

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60118833T Expired - Lifetime DE60118833T2 (de) 2000-06-06 2001-06-06 Halbleiter-Speicher mit unterteilter Wortleitungstruktur

Country Status (6)

Country Link
US (1) US6452860B2 (de)
EP (1) EP1162623B1 (de)
JP (1) JP2001344966A (de)
KR (1) KR100420089B1 (de)
DE (1) DE60118833T2 (de)
TW (1) TW516183B (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3846277B2 (ja) * 2001-11-14 2006-11-15 セイコーエプソン株式会社 半導体記憶装置及び電子機器
US7233024B2 (en) 2003-03-31 2007-06-19 Sandisk 3D Llc Three-dimensional memory device incorporating segmented bit line memory array
US6879505B2 (en) * 2003-03-31 2005-04-12 Matrix Semiconductor, Inc. Word line arrangement having multi-layer word line segments for three-dimensional memory array
JP4970760B2 (ja) * 2004-09-15 2012-07-11 三星電子株式会社 半導体メモリ装置のライン配置構造
KR100558561B1 (ko) 2004-10-28 2006-03-10 삼성전자주식회사 반도체 메모리 장치
JP4907967B2 (ja) * 2005-12-01 2012-04-04 ルネサスエレクトロニクス株式会社 半導体記憶装置
KR102586179B1 (ko) * 2018-10-04 2023-10-10 에스케이하이닉스 주식회사 반도체 장치

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07114258B2 (ja) * 1989-09-13 1995-12-06 東芝マイクロエレクトロニクス株式会社 半導体メモリ
US5875148A (en) * 1993-01-29 1999-02-23 Oki Electric Industry Co., Ltd. Semiconductor memory
JP2785655B2 (ja) * 1993-11-01 1998-08-13 日本電気株式会社 半導体装置
JP3561012B2 (ja) 1994-11-07 2004-09-02 株式会社ルネサステクノロジ 半導体集積回路装置
JP3333352B2 (ja) * 1995-04-12 2002-10-15 株式会社東芝 半導体記憶装置
JP2751892B2 (ja) * 1995-10-11 1998-05-18 日本電気株式会社 半導体記憶装置
JP3869045B2 (ja) 1995-11-09 2007-01-17 株式会社日立製作所 半導体記憶装置
US5687108A (en) * 1996-04-10 1997-11-11 Proebsting; Robert J. Power bussing layout for memory circuits
JPH10284705A (ja) 1997-04-10 1998-10-23 Hitachi Ltd ダイナミック型ｒａｍ
US5933387A (en) 1998-03-30 1999-08-03 Richard Mann Divided word line architecture for embedded memories using multiple metal layers
JP2000022097A (ja) * 1998-06-30 2000-01-21 Fujitsu Ltd 半導体記憶装置
JP2000049305A (ja) * 1998-07-28 2000-02-18 Hitachi Ltd 半導体記憶装置
JP3898377B2 (ja) * 1999-05-11 2007-03-28 富士通株式会社 半導体集積回路

Also Published As

Publication number Publication date
KR100420089B1 (ko) 2004-02-25
TW516183B (en) 2003-01-01
KR20010111007A (ko) 2001-12-15
EP1162623A1 (de) 2001-12-12
US20010048631A1 (en) 2001-12-06
US6452860B2 (en) 2002-09-17
DE60118833T2 (de) 2006-11-23
JP2001344966A (ja) 2001-12-14
EP1162623B1 (de) 2006-04-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: FUJITSU MICROELECTRONICS LTD., TOKYO, JP

Owner name: KABUSHIKI KAISHA TOSHIBA, KAWASAKI, KANAGAWA, JP

8327 Change in the person/name/address of the patent owner

Owner name: FUJITSU SEMICONDUCTOR LTD., YOKOHAMA, KANAGAWA, JP

Owner name: KABUSHIKI KAISHA TOSHIBA, TOKYO, JP