DE60205569D1 - MRAM mit gestapelten Speicherzellen - Google Patents

MRAM mit gestapelten Speicherzellen

Info

Publication number
DE60205569D1
DE60205569D1 DE60205569T DE60205569T DE60205569D1 DE 60205569 D1 DE60205569 D1 DE 60205569D1 DE 60205569 T DE60205569 T DE 60205569T DE 60205569 T DE60205569 T DE 60205569T DE 60205569 D1 DE60205569 D1 DE 60205569D1
Authority
DE
Germany
Prior art keywords
mram
memory cells
stacked memory
stacked
cells
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60205569T
Other languages
English (en)
Other versions
DE60205569T2 (de
Inventor
Yoshihisa Iwata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE60205569D1 publication Critical patent/DE60205569D1/de
Publication of DE60205569T2 publication Critical patent/DE60205569T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • H10B61/20—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
    • H10B61/22—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
    • G11C11/15—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165—Auxiliary circuits
    • G11C11/1653—Address circuits or decoders
    • G11C11/1657—Word-line or row circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165—Auxiliary circuits
    • G11C11/1659—Cell access
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C8/00—Arrangements for selecting an address in a digital store
    • G11C8/10—Decoders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • H10B61/10—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having two electrodes, e.g. diodes or MIM elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • H10B61/20—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mram Or Spin Memory Techniques (AREA)
  • Hall/Mr Elements (AREA)
  • Semiconductor Memories (AREA)
DE60205569T 2001-12-21 2002-06-05 MRAM mit gestapelten Speicherzellen Expired - Lifetime DE60205569T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001390549 2001-12-21
JP2001390549 2001-12-21

Publications (2)

Publication Number Publication Date
DE60205569D1 true DE60205569D1 (de) 2005-09-22
DE60205569T2 DE60205569T2 (de) 2006-05-18

Family

ID=19188387

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60205569T Expired - Lifetime DE60205569T2 (de) 2001-12-21 2002-06-05 MRAM mit gestapelten Speicherzellen

Country Status (6)

Country Link
US (4) US20030123271A1 (de)
EP (1) EP1321941B1 (de)
KR (1) KR100509774B1 (de)
CN (1) CN1294596C (de)
DE (1) DE60205569T2 (de)
TW (1) TW582033B (de)

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JP2002246567A (ja) * 2001-02-14 2002-08-30 Toshiba Corp 磁気ランダムアクセスメモリ
JP2002299575A (ja) * 2001-03-29 2002-10-11 Toshiba Corp 半導体記憶装置
US6795334B2 (en) * 2001-12-21 2004-09-21 Kabushiki Kaisha Toshiba Magnetic random access memory
US6940748B2 (en) 2002-05-16 2005-09-06 Micron Technology, Inc. Stacked 1T-nMTJ MRAM structure
US7042749B2 (en) 2002-05-16 2006-05-09 Micron Technology, Inc. Stacked 1T-nmemory cell structure
WO2003098636A2 (en) * 2002-05-16 2003-11-27 Micron Technology, Inc. STACKED 1T-nMEMORY CELL STRUCTURE
US6754124B2 (en) * 2002-06-11 2004-06-22 Micron Technology, Inc. Hybrid MRAM array structure and operation
JP2004079632A (ja) * 2002-08-12 2004-03-11 Toshiba Corp 半導体集積回路装置
JP3935049B2 (ja) * 2002-11-05 2007-06-20 株式会社東芝 磁気記憶装置及びその製造方法
JP3766380B2 (ja) * 2002-12-25 2006-04-12 株式会社東芝 磁気ランダムアクセスメモリ及びその磁気ランダムアクセスメモリのデータ読み出し方法
JP2004213771A (ja) * 2002-12-27 2004-07-29 Toshiba Corp 磁気ランダムアクセスメモリ
US20050248042A1 (en) * 2004-05-04 2005-11-10 Lee Jong-Eon Semiconductor memory device
KR100604913B1 (ko) 2004-10-28 2006-07-28 삼성전자주식회사 멀티 비트 셀 어레이 구조를 가지는 마그네틱 램
JP2006165327A (ja) * 2004-12-08 2006-06-22 Toshiba Corp 磁気ランダムアクセスメモリ
JP4591821B2 (ja) * 2005-02-09 2010-12-01 エルピーダメモリ株式会社 半導体装置
KR100697282B1 (ko) * 2005-03-28 2007-03-20 삼성전자주식회사 저항 메모리 셀, 그 형성 방법 및 이를 이용한 저항 메모리배열
US7286393B2 (en) * 2005-03-31 2007-10-23 Honeywell International Inc. System and method for hardening MRAM bits
JP2008034456A (ja) 2006-07-26 2008-02-14 Toshiba Corp 不揮発性半導体記憶装置
US7911830B2 (en) * 2007-05-17 2011-03-22 Integrated Magnetoelectronics Scalable nonvolatile memory
JP2009043804A (ja) * 2007-08-07 2009-02-26 Panasonic Corp 半導体記憶装置、メモリ搭載ｌｓｉ、及び半導体記憶装置の製造方法
US8072792B2 (en) * 2008-02-15 2011-12-06 Qimonda Ag Integrated circuit with resistive memory cells and method for manufacturing same
US8159870B2 (en) * 2008-04-04 2012-04-17 Qualcomm Incorporated Array structural design of magnetoresistive random access memory (MRAM) bit cells
US20150021724A1 (en) 2011-04-11 2015-01-22 Magsil Corporation Self contacting bit line to mram cell
US8638605B2 (en) 2011-05-25 2014-01-28 Micron Technology, Inc. Apparatus and methods including a bipolar junction transistor coupled to a string of memory cells
JP5543027B2 (ja) * 2011-06-10 2014-07-09 株式会社日立製作所 半導体記憶装置
JP2014049547A (ja) * 2012-08-30 2014-03-17 Toshiba Corp 半導体記憶装置
US9165631B2 (en) * 2012-09-13 2015-10-20 Qualcomm Incorporated OTP scheme with multiple magnetic tunnel junction devices in a cell
KR101967352B1 (ko) * 2012-10-31 2019-04-10 삼성전자주식회사 자기 메모리 소자 및 그 제조 방법
US8901687B2 (en) 2012-11-27 2014-12-02 Industrial Technology Research Institute Magnetic device with a substrate, a sensing block and a repair layer
CN105070314A (zh) * 2015-08-24 2015-11-18 西安电子科技大学宁波信息技术研究院 一种用于提高自旋磁随机存储器读取可靠性的电路
US9679643B1 (en) * 2016-03-09 2017-06-13 Taiwan Semiconductor Manufacturing Co., Ltd. Resistive memory device having a trimmable resistance of at least on of a driver and a sinker is trimmed based on a row location
JP2019192869A (ja) * 2018-04-27 2019-10-31 東芝メモリ株式会社 半導体記憶装置
JP2020042879A (ja) 2018-09-12 2020-03-19 キオクシア株式会社 磁気記憶装置
CN111293136A (zh) * 2018-12-07 2020-06-16 中国科学院上海微系统与信息技术研究所 基于二维器件的三维mram存储结构及其制作方法
EP4075529A4 (de) * 2020-01-15 2023-05-10 Huawei Technologies Co., Ltd. Magnetischer direktzugriffsspeicher und elektronisches gerät
JP2022050059A (ja) * 2020-09-17 2022-03-30 キオクシア株式会社 磁気記憶装置及びメモリシステム
US11488662B2 (en) * 2020-11-16 2022-11-01 Sandisk Technologies Llc Concurrent multi-bit access in cross-point array
US11763857B2 (en) * 2021-05-14 2023-09-19 Taiwan Semiconductor Manufacturing Company, Ltd. Memory device and method of forming the same

Family Cites Families (28)

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JPS5837948A (ja) * 1981-08-31 1983-03-05 Toshiba Corp 積層半導体記憶装置
EP0395886A2 (de) * 1989-04-03 1990-11-07 Olympus Optical Co., Ltd. Speicherzelle und multidimensionale Speichereinrichtung, die durch die Anordnung der Speicherzellen konstituiert ist
US5894447A (en) * 1996-09-26 1999-04-13 Kabushiki Kaisha Toshiba Semiconductor memory device including a particular memory cell block structure
TW411471B (en) * 1997-09-17 2000-11-11 Siemens Ag Memory-cell device
US6038091A (en) * 1997-10-06 2000-03-14 Cirrus Logic, Inc. Magnetic disk drive read channel with digital thermal asperity detector
DE19744095A1 (de) * 1997-10-06 1999-04-15 Siemens Ag Speicherzellenanordnung
US6169688B1 (en) * 1998-03-23 2001-01-02 Kabushiki Kaisha Toshiba Magnetic storage device using unipole currents for selecting memory cells
US5936882A (en) * 1998-03-31 1999-08-10 Motorola, Inc. Magnetoresistive random access memory device and method of manufacture
US6055179A (en) * 1998-05-19 2000-04-25 Canon Kk Memory device utilizing giant magnetoresistance effect
TW440835B (en) 1998-09-30 2001-06-16 Siemens Ag Magnetoresistive memory with raised interference security
US6111783A (en) * 1999-06-16 2000-08-29 Hewlett-Packard Company MRAM device including write circuit for supplying word and bit line current having unequal magnitudes
US6611405B1 (en) * 1999-09-16 2003-08-26 Kabushiki Kaisha Toshiba Magnetoresistive element and magnetic memory device
US6169668B1 (en) * 1999-10-27 2001-01-02 Space Systems/Loral, Inc. Zero voltage switching isolated boost converters
JP3913971B2 (ja) * 1999-12-16 2007-05-09 株式会社東芝 磁気メモリ装置
JP2001217398A (ja) 2000-02-03 2001-08-10 Rohm Co Ltd 強磁性トンネル接合素子を用いた記憶装置
JP3877490B2 (ja) 2000-03-28 2007-02-07 株式会社東芝 磁気素子およびその製造方法
US6205073B1 (en) * 2000-03-31 2001-03-20 Motorola, Inc. Current conveyor and method for readout of MTJ memories
DE10020128A1 (de) * 2000-04-14 2001-10-18 Infineon Technologies Ag MRAM-Speicher
JP4477199B2 (ja) * 2000-06-16 2010-06-09 株式会社ルネサステクノロジ 磁気ランダムアクセスメモリ、磁気ランダムアクセスメモリへのアクセス方法および磁気ランダムアクセスメモリの製造方法
US6335890B1 (en) * 2000-11-01 2002-01-01 International Business Machines Corporation Segmented write line architecture for writing magnetic random access memories
JP4667594B2 (ja) * 2000-12-25 2011-04-13 ルネサスエレクトロニクス株式会社 薄膜磁性体記憶装置
US6611453B2 (en) * 2001-01-24 2003-08-26 Infineon Technologies Ag Self-aligned cross-point MRAM device with aluminum metallization layers
US6356477B1 (en) * 2001-01-29 2002-03-12 Hewlett Packard Company Cross point memory array including shared devices for blocking sneak path currents
US6385109B1 (en) * 2001-01-30 2002-05-07 Motorola, Inc. Reference voltage generator for MRAM and method
US6512690B1 (en) * 2001-08-15 2003-01-28 Read-Rite Corporation High sensitivity common source amplifier MRAM cell, memory array and read/write scheme
US6445612B1 (en) * 2001-08-27 2002-09-03 Motorola, Inc. MRAM with midpoint generator reference and method for readout
US6574129B1 (en) * 2002-04-30 2003-06-03 Hewlett-Packard Development Company, L.P. Resistive cross point memory cell arrays having a cross-couple latch sense amplifier
US6597598B1 (en) * 2002-04-30 2003-07-22 Hewlett-Packard Development Company, L.P. Resistive cross point memory arrays having a charge injection differential sense amplifier

Also Published As

Publication number Publication date
US6990004B2 (en) 2006-01-24
US7064975B2 (en) 2006-06-20
CN1294596C (zh) 2007-01-10
KR20030053051A (ko) 2003-06-27
TW200304144A (en) 2003-09-16
DE60205569T2 (de) 2006-05-18
KR100509774B1 (ko) 2005-08-24
US20050083731A1 (en) 2005-04-21
US20030123271A1 (en) 2003-07-03
TW582033B (en) 2004-04-01
EP1321941A1 (de) 2003-06-25
US20050083730A1 (en) 2005-04-21
EP1321941B1 (de) 2005-08-17
CN1428785A (zh) 2003-07-09
US20050083734A1 (en) 2005-04-21

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Legal Events

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