DE60112860D1 - Dünnfilmspeicheranordnungen - Google Patents

Dünnfilmspeicheranordnungen

Info

Publication number
DE60112860D1
DE60112860D1 DE60112860T DE60112860T DE60112860D1 DE 60112860 D1 DE60112860 D1 DE 60112860D1 DE 60112860 T DE60112860 T DE 60112860T DE 60112860 T DE60112860 T DE 60112860T DE 60112860 D1 DE60112860 D1 DE 60112860D1
Authority
DE
Germany
Prior art keywords
thin film
memory arrays
film memory
arrays
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60112860T
Other languages
English (en)
Other versions
DE60112860T2 (de
Inventor
Frederick A Perner
Thomas C Anthony
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of DE60112860D1 publication Critical patent/DE60112860D1/de
Application granted granted Critical
Publication of DE60112860T2 publication Critical patent/DE60112860T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
    • G11C11/15—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
    • G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
    • G11C17/146—Write once memory, i.e. allowing changing of memory content by writing additional bits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Memories (AREA)
  • Mram Or Spin Memory Techniques (AREA)
  • Hall/Mr Elements (AREA)
DE60112860T 2000-09-15 2001-09-14 Dünnfilmspeicheranordnungen Expired - Lifetime DE60112860T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US663016 2000-09-15
US09/663,016 US6324093B1 (en) 2000-09-15 2000-09-15 Write-once thin-film memory

Publications (2)

Publication Number Publication Date
DE60112860D1 true DE60112860D1 (de) 2005-09-29
DE60112860T2 DE60112860T2 (de) 2006-07-13

Family

ID=24660165

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60112860T Expired - Lifetime DE60112860T2 (de) 2000-09-15 2001-09-14 Dünnfilmspeicheranordnungen

Country Status (8)

Country Link
US (1) US6324093B1 (de)
EP (1) EP1189239B1 (de)
JP (1) JP2002117684A (de)
KR (1) KR20020021614A (de)
CN (1) CN100380527C (de)
DE (1) DE60112860T2 (de)
HK (1) HK1045754B (de)
TW (1) TW511089B (de)

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US6925001B2 (en) * 2001-06-28 2005-08-02 Sharp Laboratories Of America, Inc. Electrically programmable resistance cross point memory sensing method
US6512690B1 (en) * 2001-08-15 2003-01-28 Read-Rite Corporation High sensitivity common source amplifier MRAM cell, memory array and read/write scheme
US6501697B1 (en) * 2001-10-11 2002-12-31 Hewlett-Packard Company High density memory sense amplifier
JP4073690B2 (ja) * 2001-11-14 2008-04-09 株式会社ルネサステクノロジ 薄膜磁性体記憶装置
JP2003151262A (ja) * 2001-11-15 2003-05-23 Toshiba Corp 磁気ランダムアクセスメモリ
US6483734B1 (en) * 2001-11-26 2002-11-19 Hewlett Packard Company Memory device having memory cells capable of four states
JP2003196142A (ja) * 2001-12-25 2003-07-11 Sony Corp ライトワンス型メモリ装置及びファイル管理方法
JP4046513B2 (ja) * 2002-01-30 2008-02-13 株式会社ルネサステクノロジ 半導体集積回路
US20030154426A1 (en) * 2002-02-11 2003-08-14 David Chow Method and apparatus for programmable BIST and an optional error counter
US6678189B2 (en) * 2002-02-25 2004-01-13 Hewlett-Packard Development Company, L.P. Method and system for performing equipotential sensing across a memory array to eliminate leakage currents
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JP4071531B2 (ja) * 2002-04-23 2008-04-02 株式会社ルネサステクノロジ 薄膜磁性体記憶装置
KR100505104B1 (ko) * 2002-04-30 2005-07-29 삼성전자주식회사 자기 램 셀들, 그 구조체들 및 그 구동방법
JP3808799B2 (ja) * 2002-05-15 2006-08-16 株式会社東芝 磁気ランダムアクセスメモリ
JP3808802B2 (ja) * 2002-06-20 2006-08-16 株式会社東芝 磁気ランダムアクセスメモリ
JP4646485B2 (ja) * 2002-06-25 2011-03-09 ルネサスエレクトロニクス株式会社 薄膜磁性体記憶装置
US6768661B2 (en) * 2002-06-27 2004-07-27 Matrix Semiconductor, Inc. Multiple-mode memory and method for forming same
JP2004103179A (ja) * 2002-09-12 2004-04-02 Renesas Technology Corp 薄膜磁性体記憶装置およびその製造方法
JP2004110992A (ja) * 2002-09-20 2004-04-08 Renesas Technology Corp 薄膜磁性体記憶装置
EP1550132A2 (de) 2002-10-03 2005-07-06 Koninklijke Philips Electronics N.V. Programmierbarer magnetspeicherbaustein, fp-mram
JP2004133969A (ja) * 2002-10-08 2004-04-30 Renesas Technology Corp 半導体装置
US6940744B2 (en) * 2002-10-31 2005-09-06 Unity Semiconductor Corporation Adaptive programming technique for a re-writable conductive memory device
JP3766380B2 (ja) * 2002-12-25 2006-04-12 株式会社東芝 磁気ランダムアクセスメモリ及びその磁気ランダムアクセスメモリのデータ読み出し方法
JP4294307B2 (ja) * 2002-12-26 2009-07-08 株式会社ルネサステクノロジ 不揮発性記憶装置
US6839270B2 (en) * 2003-01-17 2005-01-04 Hewlett-Packard Development Company, L.P. System for and method of accessing a four-conductor magnetic random access memory
US6842389B2 (en) * 2003-01-17 2005-01-11 Hewlett-Packard Development Company, L.P. System for and method of four-conductor magnetic random access memory cell and decoding scheme
JP4405162B2 (ja) 2003-02-14 2010-01-27 株式会社ルネサステクノロジ 薄膜磁性体記憶装置
US6822903B2 (en) * 2003-03-31 2004-11-23 Matrix Semiconductor, Inc. Apparatus and method for disturb-free programming of passive element memory cells
US7233024B2 (en) * 2003-03-31 2007-06-19 Sandisk 3D Llc Three-dimensional memory device incorporating segmented bit line memory array
US6879505B2 (en) * 2003-03-31 2005-04-12 Matrix Semiconductor, Inc. Word line arrangement having multi-layer word line segments for three-dimensional memory array
US6768150B1 (en) * 2003-04-17 2004-07-27 Infineon Technologies Aktiengesellschaft Magnetic memory
US6873543B2 (en) * 2003-05-30 2005-03-29 Hewlett-Packard Development Company, L.P. Memory device
US7291878B2 (en) * 2003-06-03 2007-11-06 Hitachi Global Storage Technologies Netherlands B.V. Ultra low-cost solid-state memory
US6985383B2 (en) * 2003-10-20 2006-01-10 Taiwan Semiconductor Manufacturing Company, Ltd. Reference generator for multilevel nonlinear resistivity memory storage elements
US7038941B2 (en) * 2003-12-19 2006-05-02 Hewlett-Packard Development Company, L.P. Magnetic memory storage device
US7142456B2 (en) * 2004-10-08 2006-11-28 Lexmark International Distributed programmed memory cells used as memory reference currents
US7272052B2 (en) * 2005-03-31 2007-09-18 Sandisk 3D Llc Decoding circuit for non-binary groups of memory line drivers
US7142471B2 (en) * 2005-03-31 2006-11-28 Sandisk 3D Llc Method and apparatus for incorporating block redundancy in a memory array
US7054219B1 (en) 2005-03-31 2006-05-30 Matrix Semiconductor, Inc. Transistor layout configuration for tight-pitched memory array lines
US7359279B2 (en) * 2005-03-31 2008-04-15 Sandisk 3D Llc Integrated circuit memory array configuration including decoding compatibility with partial implementation of multiple memory layers
US7361561B2 (en) 2005-06-24 2008-04-22 Freescale Semiconductor, Inc. Method of making a metal gate semiconductor device
US7224630B2 (en) * 2005-06-24 2007-05-29 Freescale Semiconductor, Inc. Antifuse circuit
US7777261B2 (en) * 2005-09-20 2010-08-17 Grandis Inc. Magnetic device having stabilized free ferromagnetic layer
JP4940144B2 (ja) * 2005-10-17 2012-05-30 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP4410272B2 (ja) * 2007-05-11 2010-02-03 株式会社東芝 不揮発性メモリ装置及びそのデータ書き込み方法
KR101493868B1 (ko) * 2008-07-10 2015-02-17 삼성전자주식회사 자기 메모리 소자의 구동 방법
JP4749454B2 (ja) * 2008-09-02 2011-08-17 ルネサスエレクトロニクス株式会社 薄膜磁性体記憶装置
US7894248B2 (en) * 2008-09-12 2011-02-22 Grandis Inc. Programmable and redundant circuitry based on magnetic tunnel junction (MTJ)
US8400860B2 (en) * 2010-07-20 2013-03-19 Taiwan Semiconductor Manufacturing Company, Ltd. Electrical fuse memory
US8547736B2 (en) * 2010-08-03 2013-10-01 Qualcomm Incorporated Generating a non-reversible state at a bitcell having a first magnetic tunnel junction and a second magnetic tunnel junction
US8927909B2 (en) 2010-10-11 2015-01-06 Stmicroelectronics, Inc. Closed loop temperature controlled circuit to improve device stability
US8767435B1 (en) * 2010-12-03 2014-07-01 Iii Holdings 1, Llc Field programming method for magnetic memory devices
US9159413B2 (en) 2010-12-29 2015-10-13 Stmicroelectronics Pte Ltd. Thermo programmable resistor based ROM
US8809861B2 (en) 2010-12-29 2014-08-19 Stmicroelectronics Pte Ltd. Thin film metal-dielectric-metal transistor
US8526214B2 (en) * 2011-11-15 2013-09-03 Stmicroelectronics Pte Ltd. Resistor thin film MTP memory
US8923044B2 (en) * 2012-08-20 2014-12-30 Qualcomm Incorporated MTP MTJ device
US9165631B2 (en) * 2012-09-13 2015-10-20 Qualcomm Incorporated OTP scheme with multiple magnetic tunnel junction devices in a cell
FR3018137A1 (de) * 2014-03-03 2015-09-04 St Microelectronics Grenoble 2
US9455015B2 (en) * 2014-10-10 2016-09-27 Everspin Technologies, Inc. High temperature data retention in magnetoresistive random access memory
KR20170056242A (ko) * 2015-11-13 2017-05-23 에스케이하이닉스 주식회사 전자 장치
DE102016112765B4 (de) 2016-07-12 2024-04-25 Infineon Technologies Ag Magnetspeicherbauelement und Verfahren zum Betreiben desselben
JP2023132810A (ja) * 2022-03-11 2023-09-22 ソニーセミコンダクタソリューションズ株式会社 半導体装置及び電子機器

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US4162538A (en) * 1977-07-27 1979-07-24 Xerox Corporation Thin film programmable read-only memory having transposable input and output lines
US4931763A (en) * 1988-02-16 1990-06-05 California Institute Of Technology Memory switches based on metal oxide thin films
US5640343A (en) * 1996-03-18 1997-06-17 International Business Machines Corporation Magnetic memory array using magnetic tunnel junction devices in the memory cells
US5995409A (en) * 1998-03-20 1999-11-30 Silicon Aquarius, Inc. Electrically-programmable read-only memory fabricated using a dynamic random access memory fabrication process and methods for programming same
US6169688B1 (en) * 1998-03-23 2001-01-02 Kabushiki Kaisha Toshiba Magnetic storage device using unipole currents for selecting memory cells
EP0959475A3 (de) * 1998-05-18 2000-11-08 Canon Kabushiki Kaisha Magnetischer Dünnfilmspeicher sowie Schreibe- und Leseverfahren und Anordnung unter Verwendung solchen Speichers

Also Published As

Publication number Publication date
KR20020021614A (ko) 2002-03-21
EP1189239A2 (de) 2002-03-20
HK1045754B (zh) 2009-01-09
CN1345071A (zh) 2002-04-17
EP1189239B1 (de) 2005-08-24
EP1189239A3 (de) 2004-05-19
TW511089B (en) 2002-11-21
CN100380527C (zh) 2008-04-09
DE60112860T2 (de) 2006-07-13
JP2002117684A (ja) 2002-04-19
HK1045754A1 (en) 2002-12-06
US6324093B1 (en) 2001-11-27

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD DEVELOPMENT CO., L.P., HOUSTON, TE

8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: SAMSUNG ELECTRONICS CO., LTD., SUWON, GYEONGGI, KR