DE3751002T2 - Halbleiterspeicher. - Google Patents

Halbleiterspeicher.

Info

Publication number
DE3751002T2
DE3751002T2 DE3751002T DE3751002T DE3751002T2 DE 3751002 T2 DE3751002 T2 DE 3751002T2 DE 3751002 T DE3751002 T DE 3751002T DE 3751002 T DE3751002 T DE 3751002T DE 3751002 T2 DE3751002 T2 DE 3751002T2
Authority
DE
Germany
Prior art keywords
semiconductor memory
semiconductor
memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3751002T
Other languages
English (en)
Other versions
DE3751002D1 (de
Inventor
Tsuneo Nippon Telegr Matsumura
Tsuneo Nippon Telegraph T Mano
Junzo Nippon Telegraph Yamada
Junichi Nippon Telegraph Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP61247641A external-priority patent/JPH0817040B2/ja
Priority claimed from JP62159843A external-priority patent/JP2670049B2/ja
Priority claimed from JP62185382A external-priority patent/JPS6430099A/ja
Priority claimed from JP62203099A external-priority patent/JPS6446300A/ja
Priority claimed from JP62253516A external-priority patent/JPH0196899A/ja
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Application granted granted Critical
Publication of DE3751002D1 publication Critical patent/DE3751002D1/de
Publication of DE3751002T2 publication Critical patent/DE3751002T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/70—Masking faults in memories by using spares or by reconfiguring
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C29/18—Address generation devices; Devices for accessing memories, e.g. details of addressing circuits
    • G11C29/30—Accessing single arrays
    • G11C29/34—Accessing multiple bits simultaneously
DE3751002T 1986-10-20 1987-10-19 Halbleiterspeicher. Expired - Lifetime DE3751002T2 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP61247641A JPH0817040B2 (ja) 1986-10-20 1986-10-20 半導体メモリ
JP62159843A JP2670049B2 (ja) 1987-06-29 1987-06-29 半導体メモリの試験方法
JP17307787 1987-07-13
JP62185382A JPS6430099A (en) 1987-07-27 1987-07-27 Method for testing semiconductor memory having redundant constitution
JP62203099A JPS6446300A (en) 1987-08-17 1987-08-17 Semiconductor memory
JP20800287 1987-08-21
JP62253516A JPH0196899A (ja) 1987-10-09 1987-10-09 半導体メモリ

Publications (2)

Publication Number Publication Date
DE3751002D1 DE3751002D1 (de) 1995-03-02
DE3751002T2 true DE3751002T2 (de) 1995-10-05

Family

ID=27566214

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3751002T Expired - Lifetime DE3751002T2 (de) 1986-10-20 1987-10-19 Halbleiterspeicher.

Country Status (4)

Country Link
US (1) US5400342A (de)
EP (1) EP0264893B1 (de)
KR (1) KR900004312B1 (de)
DE (1) DE3751002T2 (de)

Families Citing this family (62)

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GB2222461B (en) * 1988-08-30 1993-05-19 Mitsubishi Electric Corp On chip testing of semiconductor memory devices
KR920001081B1 (ko) * 1989-06-10 1992-02-01 삼성전자 주식회사 램 테스트시 고속기록회로
JP2717712B2 (ja) * 1989-08-18 1998-02-25 三菱電機株式会社 半導体記憶装置
JP3253296B2 (ja) * 1989-12-20 2002-02-04 セイコーエプソン株式会社 記憶装置及びデータ処理装置
FR2665793B1 (fr) * 1990-08-10 1993-06-18 Sgs Thomson Microelectronics Circuit integre de memoire avec redondance et adressage ameliore en mode de test.
JP2673395B2 (ja) * 1990-08-29 1997-11-05 三菱電機株式会社 半導体記憶装置およびそのテスト方法
JPH04356799A (ja) * 1990-08-29 1992-12-10 Mitsubishi Electric Corp 半導体記憶装置
JP3237127B2 (ja) * 1991-04-19 2001-12-10 日本電気株式会社 ダイナミックランダムアクセスメモリ装置
US5241500A (en) * 1992-07-29 1993-08-31 International Business Machines Corporation Method for setting test voltages in a flash write mode
JP3645578B2 (ja) * 1992-09-17 2005-05-11 テキサス インスツルメンツ インコーポレイテツド スマート・メモリの組込み自己検査のための装置と方法
JPH06203597A (ja) 1992-09-25 1994-07-22 Nec Corp ダイナミックｒａｍ
JP3293935B2 (ja) * 1993-03-12 2002-06-17 株式会社東芝 並列ビットテストモード内蔵半導体メモリ
JP3346827B2 (ja) * 1993-05-25 2002-11-18 三菱電機株式会社 同期型半導体記憶装置
EP0642137B1 (de) * 1993-09-01 2001-11-28 Koninklijke Philips Electronics N.V. Ruhestromprüfbarer RAM
KR960008824B1 (en) * 1993-11-17 1996-07-05 Samsung Electronics Co Ltd Multi bit test circuit and method of semiconductor memory device
JP3563779B2 (ja) * 1994-09-13 2004-09-08 株式会社ルネサステクノロジ 半導体記憶装置
US5461588A (en) * 1994-11-15 1995-10-24 Digital Equipment Corporation Memory testing with preservation of in-use data
US5533194A (en) * 1994-12-28 1996-07-02 International Business Machines Corporation Hardware-assisted high speed memory test apparatus and method
JPH08305638A (ja) * 1995-05-01 1996-11-22 Nec Corp Ｒｏｍデータ検査方法
JPH0963300A (ja) * 1995-08-22 1997-03-07 Advantest Corp 半導体メモリ試験装置のフェイル解析装置
JP3865828B2 (ja) 1995-11-28 2007-01-10 株式会社ルネサステクノロジ 半導体記憶装置
JP3816560B2 (ja) * 1995-12-25 2006-08-30 株式会社ルネサステクノロジ 連想メモリ回路のテスト方法及び連想メモリ回路のテスト回路
US6072719A (en) * 1996-04-19 2000-06-06 Kabushiki Kaisha Toshiba Semiconductor memory device
JP3601913B2 (ja) * 1996-08-30 2004-12-15 株式会社東芝 メモリ解析装置及びメモリ解析方法
US6009536A (en) * 1996-09-20 1999-12-28 Micron Electronics, Inc. Method for using fuse identification codes for masking bad bits on memory modules
US5826006A (en) * 1996-09-30 1998-10-20 International Business Machines Corporation Method and apparatus for testing the data output system of a memory system
US5966388A (en) * 1997-01-06 1999-10-12 Micron Technology, Inc. High-speed test system for a memory device
JP2002501654A (ja) 1997-05-30 2002-01-15 ミクロン テクノロジー，インコーポレイテッド ２５６Ｍｅｇダイナミックランダムアクセスメモリ
US6009026A (en) * 1997-07-28 1999-12-28 International Business Machines Corporation Compressed input/output test mode
US6332183B1 (en) 1998-03-05 2001-12-18 Micron Technology, Inc. Method for recovery of useful areas of partially defective synchronous memory components
US6314527B1 (en) 1998-03-05 2001-11-06 Micron Technology, Inc. Recovery of useful areas of partially defective synchronous memory components
US5936901A (en) * 1998-03-19 1999-08-10 Micron Technology, Inc. Shared data lines for memory write and memory test operations
US6381708B1 (en) 1998-04-28 2002-04-30 Micron Technology, Inc. Method for decoding addresses for a defective memory array
US6381707B1 (en) 1998-04-28 2002-04-30 Micron Technology, Inc. System for decoding addresses for a defective memory array
JP2000021193A (ja) * 1998-07-01 2000-01-21 Fujitsu Ltd メモリ試験方法及び装置並びに記憶媒体
US6424161B2 (en) * 1998-09-03 2002-07-23 Micron Technology, Inc. Apparatus and method for testing fuses
JP2000156096A (ja) * 1998-11-20 2000-06-06 Fujitsu Ltd 半導体記憶装置
JP2000182398A (ja) * 1998-12-15 2000-06-30 Nec Corp 半導体装置及び半導体装置の試験方法
US6496876B1 (en) 1998-12-21 2002-12-17 Micron Technology, Inc. System and method for storing a tag to identify a functional storage location in a memory device
TW444127B (en) * 1999-08-20 2001-07-01 Taiwan Semiconductor Mfg Comparing circuit, testing circuit and testing method for the parallel test of DRAM devices
JP2001126470A (ja) * 1999-10-26 2001-05-11 Mitsubishi Electric Corp 半導体記憶装置
US6459634B1 (en) 2000-01-31 2002-10-01 Micron Technology, Inc. Circuits and methods for testing memory cells along a periphery of a memory array
US6578157B1 (en) 2000-03-06 2003-06-10 Micron Technology, Inc. Method and apparatus for recovery of useful areas of partially defective direct rambus rimm components
US7269765B1 (en) * 2000-04-13 2007-09-11 Micron Technology, Inc. Method and apparatus for storing failing part locations in a module
JP4146986B2 (ja) * 2000-05-19 2008-09-10 株式会社アドバンテスト 半導体試験装置
JP4846128B2 (ja) * 2001-07-12 2011-12-28 ルネサスエレクトロニクス株式会社 半導体装置およびそのテスト方法
FR2854967B1 (fr) * 2003-05-13 2005-08-05 St Microelectronics Sa Procede et dispositif d'identification d'un mode de fonctionnement d'un dispositif controle, par exemple un mode test d'une memoire eeprom
US7320100B2 (en) * 2003-05-20 2008-01-15 Cray Inc. Apparatus and method for memory with bit swapping on the fly and testing
US7184916B2 (en) * 2003-05-20 2007-02-27 Cray Inc. Apparatus and method for testing memory cards
US20050039089A1 (en) * 2003-08-11 2005-02-17 Elias Gedamu System and method for analysis of cache array test data
US20090129185A1 (en) * 2007-11-19 2009-05-21 Cassels John J Semiconductor circuits capable of self detecting defects
US7872902B2 (en) * 2008-08-18 2011-01-18 Qimonda Ag Integrated circuit with bit lines positioned in different planes
US8055958B2 (en) * 2008-12-11 2011-11-08 Samsung Electronics Co., Ltd. Replacement data storage circuit storing address of defective memory cell
TWI406290B (zh) * 2009-06-26 2013-08-21 Etron Technology Inc 一種字元線缺陷之偵測裝置與方法
JP2011048879A (ja) * 2009-08-27 2011-03-10 Renesas Electronics Corp 半導体装置
US8832508B2 (en) * 2010-11-18 2014-09-09 Advanced Micro Devices, Inc. Apparatus and methods for testing writability and readability of memory cell arrays
KR20140042312A (ko) * 2012-09-28 2014-04-07 에스케이하이닉스 주식회사 반도체 장치 및 그 동작 방법
CN105182207B (zh) * 2014-05-30 2020-10-16 国民技术股份有限公司 一种芯片错误注入测试方法及装置
JP6868466B2 (ja) * 2017-05-25 2021-05-12 ルネサスエレクトロニクス株式会社 半導体装置
US10754580B2 (en) 2017-10-23 2020-08-25 Micron Technology, Inc. Virtual partition management in a memory device
KR20220014590A (ko) * 2020-07-29 2022-02-07 삼성전자주식회사 결함 검출 회로를 포함하는 반도체 장치 및 반도체 장치의 결함 검출 방법
CN114283870B (zh) * 2022-01-14 2023-06-30 长鑫存储技术有限公司 测试方法、装置、计算机设备及存储介质

Family Cites Families (10)

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US4055754A (en) 1975-12-22 1977-10-25 Chesley Gilman D Memory device and method of testing the same
DE3176810D1 (en) * 1980-12-23 1988-08-18 Fujitsu Ltd Electrically programmable non-volatile semiconductor memory device
JPS59185097A (ja) * 1983-04-04 1984-10-20 Oki Electric Ind Co Ltd 自己診断機能付メモリ装置
US4601019B1 (en) * 1983-08-31 1997-09-30 Texas Instruments Inc Memory with redundancy
JPS60115099A (ja) * 1983-11-25 1985-06-21 Fujitsu Ltd 半導体記憶装置
US4661930A (en) * 1984-08-02 1987-04-28 Texas Instruments Incorporated High speed testing of integrated circuit
US4670878A (en) * 1984-08-14 1987-06-02 Texas Instruments Incorporated Column shift circuitry for high speed testing of semiconductor memory devices
US4654827A (en) * 1984-08-14 1987-03-31 Texas Instruments Incorporated High speed testing of semiconductor memory devices
KR900005666B1 (ko) 1984-08-30 1990-08-03 미쓰비시전기 주식회사 반도체기억장치
US4654849B1 (en) 1984-08-31 1999-06-22 Texas Instruments Inc High speed concurrent testing of dynamic read/write memory array

Also Published As

Publication number Publication date
EP0264893A3 (de) 1991-01-16
US5400342A (en) 1995-03-21
KR880005624A (ko) 1988-06-29
KR900004312B1 (ko) 1990-06-20
EP0264893B1 (de) 1995-01-18
EP0264893A2 (de) 1988-04-27
DE3751002D1 (de) 1995-03-02

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Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication of lapse of patent is to be deleted
8364 No opposition during term of opposition