DE3047441C2 - - Google Patents
Info
- Publication number
- DE3047441C2 DE3047441C2 DE3047441A DE3047441A DE3047441C2 DE 3047441 C2 DE3047441 C2 DE 3047441C2 DE 3047441 A DE3047441 A DE 3047441A DE 3047441 A DE3047441 A DE 3047441A DE 3047441 C2 DE3047441 C2 DE 3047441C2
- Authority
- DE
- Germany
- Prior art keywords
- plate
- treatment
- station
- chamber
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Description
Einbringen eines Plättchens, Erhitzen des Plättchens (oder alternativ Durchführung eines Hochfrequenzaufstäubungsvorgangs), Beschichten des Plättchens mittels einer Aufstäubungseinrichtung, Abkühlen des Plättchens und schließlich Entnahme des Plättchens. Hierbei könnte man auf vorteilhafte Weise von der Abfuhr von Wärme mit Hilfe von Gas Gebrauch machen, um die Erhitzung oder Abkühlung zu beschleunigen und die Plättchentemperatur während des Beschichtens zu regeln. Zwar fehlt dieser abgeänderten Ausführungsform zum Teil die Vielseitigkeit und die hohe Produktionsgeschwindigkeit, die sich bei der zuerst beschriebenen Ausführungsform erreichen lassen, doch bietet sie verschiedene vorteilhafte Merkmale, denn sie ist von einfacher Konstruktion, sie arbeitet zuverlässig, die Plättchen 15 brauchen innerhalb der evakuierten Kammer 10 nicht evakuiert zu werden, und in jedem Augenblick ist jeweils nur ein Plättchen 15 einer Gefährdung ausgesetzt, womit in dieser Beziehung ein Minimum erreicht ist.
12 Beschickungsschleuse
14 Beschichtungsstation
15 flacher Gegenstand, Plättchen
16 Druckplatte
18 Tragplatte
20 Klammern
22 Kammertür
23 Kammereingang
24 Beschickungs- und Entnahmeeinrichtung
25 Hilfsvakuumpumpen
26 Gehäuse
28 Plättchenerhitzungsstation
29 Hilfsstation
30, 31 pneumatische Stößel
32 Kammervorderwand
35 Antrieb
36 Mittelachse
37 kreisrunde Öffnung
38 Ausnehmung für O-Ringe
39 O-Ringe
41 Haltering
42 Plättchentragplatte
46, 47 Flansche
50 Klotz
53 Feder
55 Fingerabschnitt
56 Klammerabschnitte
57 Abschnitt
60 Spannfutter
62 Klammerbetätigungseinrichtungen
63 Gelenk
64 Innenfläche
66 Betätigungsstift
70 Kassette
92 Plättchenheizeinrichtung
93 Unterstützung
94 Heizelement
96, 97 Rohrleitungen
98 Stützplatte
99 Rückwand
100 Aufstäubungseinrichtung
102 Verschluß
112 Targets
114 Rohrleitung
115 O-Ring 118 Plättchenkühleinrichtung
119 zylindrisches Bauteil, Wärmeabführungsteil
120 Stützplatte
121 O-Ring
125 ebene Fläche
126 Rohrleitung
128, 129 Rohrleitungen, Beschickungsstation
130 Kühlstation
138 zweite Beschickungsstation
Claims (12)
dadurch gekennzeichnet, daß eine Transporteinrichtung (18) vorgesehen ist, die die flachen Gegenstände (15) aufeinanderfolgend in eine Stellung an der Arbeitsstation (28, 14, 130) zur thermischen Behandlung bringt und nach dieser von der Arbeitsstation (28, 14, 130) entfernt,
daß eine Einrichtung zum Zusammenschieben (16) der einzelnen Gegenstände (15) und der Wärmeaustauschfläche (94) während der thermischen Behandlung vorgesehen ist,
daß die Gaszuführeinrichtung während der Behandlung zwischen dem einzelnen Gegenstand (15) und die Wärmeaustauschfläche (94) Gas zuführt,
daß die Einrichtung zum Zusammenschieben (16) den Gasaustritt zwischen dem Gegenstand (15) und Wärmeaustauschfläche (94) hemmt und
daß die Einrichtung zum Zusammenschieben (16) eine Trennung zwischen dem einzelnen Gegenstand (15) und der Fläche (94) nach Vollendung der thermischen Behandlung wieder herstellt.
daß der in geringem Abstand angeordnete Gegenstand (15) und die Fläche (94) dazwischen einen engen Spalt während der Behandlung begrenzen,
daß die unter Vakuum stehende Umgebung (10) ein Volumen besitzt, das im Vergleich dazu wesentlich größer ist, und daß das Gas in das Umgebungsvakuum (10) beim Abschluß der Behandlung eines jeden Gegenstandes (15) entweicht.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/106,343 US4756815A (en) | 1979-12-21 | 1979-12-21 | Wafer coating system |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3047441A1 DE3047441A1 (de) | 1981-08-27 |
DE3047441C2 true DE3047441C2 (de) | 1990-05-03 |
Family
ID=22310901
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19803047441 Granted DE3047441A1 (de) | 1979-12-21 | 1980-12-17 | Vorrichtung zum beschichten von mikroplaettchen |
DE3051188A Revoked DE3051188C2 (de) | 1979-12-21 | 1980-12-17 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3051188A Revoked DE3051188C2 (de) | 1979-12-21 | 1980-12-17 |
Country Status (8)
Country | Link |
---|---|
US (1) | US4756815A (de) |
JP (10) | JPS56103442A (de) |
CH (2) | CH652148A5 (de) |
DE (2) | DE3047441A1 (de) |
FR (1) | FR2475579B1 (de) |
GB (5) | GB2066300B (de) |
IT (1) | IT1206086B (de) |
NL (3) | NL194253B (de) |
Families Citing this family (66)
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US4756815A (en) * | 1979-12-21 | 1988-07-12 | Varian Associates, Inc. | Wafer coating system |
GB2119236A (en) * | 1982-03-26 | 1983-11-16 | Philips Electronic Associated | Magazine and disc holders for supporting discs in the magazine |
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US4500407A (en) * | 1983-07-19 | 1985-02-19 | Varian Associates, Inc. | Disk or wafer handling and coating system |
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FR2170570A5 (de) * | 1971-12-29 | 1973-09-14 | Lucas Aerospace Ltd | |
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US3874525A (en) * | 1973-06-29 | 1975-04-01 | Ibm | Method and apparatus for handling workpieces |
CH573985A5 (de) * | 1973-11-22 | 1976-03-31 | Balzers Patent Beteilig Ag | |
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JPS559058B2 (de) * | 1974-04-26 | 1980-03-07 | ||
US3977955A (en) * | 1974-05-10 | 1976-08-31 | Bell Telephone Laboratories, Incorporated | Method for cathodic sputtering including suppressing temperature rise |
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DE2844491C2 (de) * | 1978-10-12 | 1983-04-14 | Leybold-Heraeus GmbH, 5000 Köln | Vakuum-Beschichtungsanlage mit einer Einrichtung zum kontinuierlichen Substrattransport |
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JPS62134791A (ja) * | 1985-12-07 | 1987-06-17 | 東芝テック株式会社 | クレジツト販売処理装置 |
JPS62134793A (ja) * | 1985-12-07 | 1987-06-17 | 東芝テック株式会社 | クレジツト販売処理装置 |
JPS62134792A (ja) * | 1985-12-07 | 1987-06-17 | 東芝テック株式会社 | クレジツト販売処理装置 |
-
1979
- 1979-12-21 US US06/106,343 patent/US4756815A/en not_active Expired - Lifetime
-
1980
- 1980-12-16 GB GB8040238A patent/GB2066300B/en not_active Expired
- 1980-12-17 DE DE19803047441 patent/DE3047441A1/de active Granted
- 1980-12-17 DE DE3051188A patent/DE3051188C2/de not_active Revoked
- 1980-12-19 JP JP17904880A patent/JPS56103442A/ja active Granted
- 1980-12-19 NL NL8006936A patent/NL194253B/xx not_active Application Discontinuation
- 1980-12-22 IT IT8026866A patent/IT1206086B/it active
- 1980-12-22 FR FR8027227A patent/FR2475579B1/fr not_active Expired
- 1980-12-22 CH CH9477/80A patent/CH652148A5/de not_active IP Right Cessation
- 1980-12-22 CH CH1849/85A patent/CH673351A5/de not_active IP Right Cessation
-
1984
- 1984-02-29 GB GB08405239A patent/GB2137663B/en not_active Expired
- 1984-02-29 GB GB08405240A patent/GB2137664B/en not_active Expired
- 1984-02-29 GB GB08405238A patent/GB2137662B/en not_active Expired
- 1984-02-29 GB GB08405237A patent/GB2137661B/en not_active Expired
- 1984-03-16 JP JP59049397A patent/JPS59197145A/ja active Granted
-
1986
- 1986-10-08 JP JP61238189A patent/JPS62122118A/ja active Granted
- 1986-10-22 JP JP61249783A patent/JPH0751754B2/ja not_active Expired - Lifetime
-
1987
- 1987-05-29 JP JP62134791A patent/JPS6386867A/ja active Granted
- 1987-05-29 JP JP62134795A patent/JPS6386870A/ja active Granted
- 1987-05-29 JP JP62134794A patent/JPS6386869A/ja active Granted
- 1987-05-29 JP JP62134792A patent/JPS6386868A/ja active Granted
- 1987-05-29 JP JP62134793A patent/JPS63114969A/ja active Pending
-
1988
- 1988-10-18 NL NL8802562A patent/NL8802562A/nl not_active Application Discontinuation
- 1988-10-18 NL NL8802563A patent/NL8802563A/nl not_active Application Discontinuation
-
1990
- 1990-09-19 JP JP2247640A patent/JPH0633457B2/ja not_active Expired - Lifetime
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