DE29716440U1 - Sputterstation - Google Patents
SputterstationInfo
- Publication number
- DE29716440U1 DE29716440U1 DE29716440U DE29716440U DE29716440U1 DE 29716440 U1 DE29716440 U1 DE 29716440U1 DE 29716440 U DE29716440 U DE 29716440U DE 29716440 U DE29716440 U DE 29716440U DE 29716440 U1 DE29716440 U1 DE 29716440U1
- Authority
- DE
- Germany
- Prior art keywords
- sputtering station
- sputtering
- station
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004544 sputter deposition Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32743—Means for moving the material to be treated for introducing the material into processing chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
- C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32788—Means for moving the material to be treated for extracting the material from the process chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Robotics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Optical Record Carriers (AREA)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE29716440U DE29716440U1 (de) | 1997-09-12 | 1997-09-12 | Sputterstation |
US08/964,962 US6416640B1 (en) | 1997-09-12 | 1997-11-05 | Sputter station |
CH01816/98A CH693508A5 (de) | 1997-09-12 | 1998-09-04 | Sputterstation. |
NL1010046A NL1010046C2 (nl) | 1997-09-12 | 1998-09-09 | Sproeistation. |
SE9803067A SE521639C2 (sv) | 1997-09-12 | 1998-09-10 | Sputterstation |
JP10256388A JPH11140645A (ja) | 1997-09-12 | 1998-09-10 | スパッタ・ステーション |
CNB98119253XA CN1213163C (zh) | 1997-09-12 | 1998-09-14 | 溅射镀膜装置和真空表面处理设备 |
HK99105430A HK1020287A1 (en) | 1997-09-12 | 1999-11-24 | A sputtering station and a vacuum surface treatment system |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE29716440U DE29716440U1 (de) | 1997-09-12 | 1997-09-12 | Sputterstation |
US08/964,962 US6416640B1 (en) | 1997-09-12 | 1997-11-05 | Sputter station |
Publications (1)
Publication Number | Publication Date |
---|---|
DE29716440U1 true DE29716440U1 (de) | 1997-12-11 |
Family
ID=26060719
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE29716440U Expired - Lifetime DE29716440U1 (de) | 1997-09-12 | 1997-09-12 | Sputterstation |
Country Status (4)
Country | Link |
---|---|
US (1) | US6416640B1 (de) |
JP (1) | JPH11140645A (de) |
CN (1) | CN1213163C (de) |
DE (1) | DE29716440U1 (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1166180A1 (de) * | 1999-04-02 | 2002-01-02 | Silicon Valley Group Thermal Systems LLC | Halbleiter-wafer etwicklungsgerät mit vertikal gestapelteentwicklungsraüme und einachsiges dual-wafer transfer system |
EP1172842A2 (de) | 2000-06-22 | 2002-01-16 | Unaxis Balzers Aktiengesellschaft | Beschichtungsanlage für scheibenförmige Werkstücke |
EP1197988A2 (de) * | 2000-10-10 | 2002-04-17 | Applied Materials, Inc. | Mehrfach-Waferhebervorrichtung und Verfahren dafür |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10244433B4 (de) * | 2002-09-24 | 2005-12-15 | Adidas International Marketing B.V. | Gleitelement und Schuhsohle |
KR100692585B1 (ko) * | 2003-12-22 | 2007-03-13 | 어플라이드 매터리얼스 게엠베하 운트 컴퍼니 카게 | 장입용 잠금 장치를 구비한 코팅 플랜트 및 이를 위한 장치 |
CN100339730C (zh) * | 2004-05-26 | 2007-09-26 | 精碟科技股份有限公司 | 光学元件镀膜器具 |
CN101886248B (zh) * | 2009-05-15 | 2013-08-21 | 鸿富锦精密工业(深圳)有限公司 | 溅镀式镀膜装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4756815A (en) * | 1979-12-21 | 1988-07-12 | Varian Associates, Inc. | Wafer coating system |
US4523985A (en) * | 1983-12-22 | 1985-06-18 | Sputtered Films, Inc. | Wafer processing machine |
JPH0613751B2 (ja) * | 1986-03-07 | 1994-02-23 | 株式会社日立製作所 | 連続スパッタ装置 |
DE3912295C2 (de) * | 1989-04-14 | 1997-05-28 | Leybold Ag | Katodenzerstäubungsanlage |
DE4117969C2 (de) * | 1991-05-31 | 2000-11-09 | Balzers Ag Liechtenstein | Vakuumkammer |
JPH05271934A (ja) * | 1992-03-23 | 1993-10-19 | Hitachi Ltd | スパッタリング装置 |
US5766360A (en) * | 1992-03-27 | 1998-06-16 | Kabushiki Kaisha Toshiba | Substrate processing apparatus and substrate processing method |
GB2272225B (en) * | 1992-10-06 | 1996-07-17 | Balzers Hochvakuum | A method for masking a workpiece and a vacuum treatment facility |
US5738767A (en) * | 1994-01-11 | 1998-04-14 | Intevac, Inc. | Substrate handling and processing system for flat panel displays |
DE29505497U1 (de) * | 1995-03-31 | 1995-06-08 | Balzers Hochvakuum | Beschichtungsstation |
US5709785A (en) * | 1995-06-08 | 1998-01-20 | First Light Technology Inc. | Metallizing machine |
-
1997
- 1997-09-12 DE DE29716440U patent/DE29716440U1/de not_active Expired - Lifetime
- 1997-11-05 US US08/964,962 patent/US6416640B1/en not_active Expired - Fee Related
-
1998
- 1998-09-10 JP JP10256388A patent/JPH11140645A/ja not_active Withdrawn
- 1998-09-14 CN CNB98119253XA patent/CN1213163C/zh not_active Expired - Fee Related
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1166180A1 (de) * | 1999-04-02 | 2002-01-02 | Silicon Valley Group Thermal Systems LLC | Halbleiter-wafer etwicklungsgerät mit vertikal gestapelteentwicklungsraüme und einachsiges dual-wafer transfer system |
US6610150B1 (en) | 1999-04-02 | 2003-08-26 | Asml Us, Inc. | Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system |
US6846149B2 (en) | 1999-04-02 | 2005-01-25 | Aviza Technology, Inc. | Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system |
EP1172842A2 (de) | 2000-06-22 | 2002-01-16 | Unaxis Balzers Aktiengesellschaft | Beschichtungsanlage für scheibenförmige Werkstücke |
EP1172842A3 (de) * | 2000-06-22 | 2002-04-03 | Unaxis Balzers Aktiengesellschaft | Beschichtungsanlage für scheibenförmige Werkstücke |
US6656330B2 (en) | 2000-06-22 | 2003-12-02 | Unaxis Balzers Aktiengesellschaft | Coating installation for disk-form workpieces |
EP1197988A2 (de) * | 2000-10-10 | 2002-04-17 | Applied Materials, Inc. | Mehrfach-Waferhebervorrichtung und Verfahren dafür |
EP1197988A3 (de) * | 2000-10-10 | 2006-02-08 | Applied Materials, Inc. | Mehrfach-Waferhebervorrichtung und Verfahren dafür |
Also Published As
Publication number | Publication date |
---|---|
CN1213163C (zh) | 2005-08-03 |
US6416640B1 (en) | 2002-07-09 |
JPH11140645A (ja) | 1999-05-25 |
CN1217390A (zh) | 1999-05-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R207 | Utility model specification |
Effective date: 19980129 |
|
R150 | Utility model maintained after payment of first maintenance fee after three years |
Effective date: 20001214 |
|
R151 | Utility model maintained after payment of second maintenance fee after six years |
Effective date: 20031028 |
|
R152 | Utility model maintained after payment of third maintenance fee after eight years |
Effective date: 20051006 |
|
R071 | Expiry of right |