CN1217390A - 溅射镀膜装置 - Google Patents
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Abstract
用于圆片形工件的溅射镀膜装置,它包含:一个闸室(3),一个溅射源(7),一个运输室(1),一个运输机构(13),其特征在于:闸室和溅射源(7)的作用面(7a),彼此对峙,运输机构(13)可以被回转驱动地安置在运输室(1)中,而且包含可径向移出及缩回的承载臂(19),在该承载臂一端有工件承接件(21)。
Description
本发明涉及一种用于圆片形工件的溅射镀膜装置,特别适用于在光学数据载体亦称CD上溅镀反射层。本装置包含一个闸室、一个具有作用面的溅射源及一个运输室,运输室具有连接开口,分别连接闸室和溅射源,运输室同时用于通运或者说用于将工件输入或输出溅射位置。本装置在运输室中还有一个运输机构,用来在上述开口之间运输工件。
本发明所要达到的目的是提供这样一种溅射镀膜装置,它综合了下述各项优点:
-结构尽可能最小,占地尽可能少;
-工件入闸出闸之间的周期时间短;
-可自由选择的任一安装位置,就是说可以由上向下、由下向上水平地实现溅射操作;
-可以在一个溅射镀膜总体设备中装入模块式组件;
-组装简单、牢固;
-在制造和保养方面可节约费用。
开头提及的这种溅射镀膜装置所具有的上述优点是通过以下的措施取得的:闸室和溅射源,跨过运输室,沿着相关的横轴线彼此处于对峙位置,而运输机构绕一个与上述横轴线限定一平面并垂直于横轴线的旋转轴可被回转驱动地加以安置在运输室中,而且至少包含一个可依旋转轴径向地或者相应平行地移出或缩回的承载臂,在承载臂背向旋转轴的一端上配有一个工件承接件。
在一个优选的结构形式中,所述运输机构至少有两个上述的臂。
此外,所述的臂的彼此被对向地移动的部分最好是装在皮囊中的。
本发明提出的装置的构造特别简单,这是因为采取了下述措施:按优选的结构形式,工件承接件构成闸室的在运输室一侧的闸阀和/或构成溅射源和运输室之间的密封件。
通过下述措施来确保以最简单的方式实现可任意选择的安装位置:工件承接件具有一个用于工件的定位连接件,最好是一个卡合定位件,对于具有中心孔的圆片形工件,最好是一个能卡合到此中心孔中的弹簧珠卡定机构。
高度紧凑的结构的优点特别是和首先是通过下述措施取得的:闸室基本上是通过围绕着前述开口之一的运输室壁的壁厚来界定的,并且/或者溅射操作基本上是通过围绕着前述开孔的另一个开口的运输室壁的壁厚来加以界定的。
此外,按优选的结构形式,闸室以及运输室和/或溅射源的操作室同样分别配有泵连接件和/或溢流连接件。
在作为溅射镀膜装置的一种真空表面处理设备中,连同前述的溅射镀膜装置模块,最好还在这样一种设备上配装一个电子模块,以之用于特别是所述镀膜装置的监控目的,此外还可配装另一个运输机构,它可以从外面操纵闸室。于此,该运输机构最好特别在一个与镀膜装置的运输室和闸室之间的开口的平面相平行的平面中运动,并且最好还构成镀膜装置闸室的外部的闸阀。
以下将根据附图来说明本发明。这些附图是:
图1:示意的和简化的本发明提出的溅射镀膜装置局部切面;
图2:图1所示镀膜装置上的一个工件承接盘的局部纵剖面,配有球体卡定机构以用于CD-盘;
图3,
3a:示意地示明本发明提出的镀膜装置,具有一外部的闸盖或闸阀的第一种结构;
3b:图3a所示镀膜装置的顶视图,具有作为外部运输机构的装载臂;
图4:与图3相似的图示,本发明提出的镀膜装置配有另一种结构的装载/卸载机构;
图5至图7:在一种配备本发明提出的镀膜装置的相似于图3所示依本发明的设备上,装载/卸载机构的另一种结构形式。
如图1所示,本发明提出的溅射镀膜装置包含一个运输室1,该运输室有两个沿着通过运输室1的横轴线Q而彼此处于对向位置的开孔30和50。在开孔50上用法兰连接一个溅射源7,它配有示意地示明的周边掩蔽罩9和一个中心掩蔽罩11以及一个溅射作用面7a。与轴线Q相垂直并与之处于一平面E中的,是所装配的运输机构13的旋转轴A1,它配有一驱动装置15和一承载座17。在承载座17上安置了两个套在皮囊中的臂19,这两个臂是彼此对向的,能相对于开孔30或50退出或返回,它们在其端部各有一个承接盘21以用于具有中心孔的圆片形工件23。
以其相应壁厚环绕着开孔30的运输室1的壁25界定出闸室3。朝向运输室1的闸阀是通过置于相应位置的用于工件23的承接盘21来构成。在工件的结构具有如图2中所示的中心孔时,在工件承接盘21上配有一个中心心轴30,它具有径向由弹簧张紧的卡定珠32,这些卡定珠在工件23套上时将工件保持住。代替卡定的保持方式,也可以采用吸力保持方式或磁铁保持方式。
这样,本发明提出的溅射镀膜装置可以在空间全方位地进行操作。图中以虚线表示的是外部的闸室盖或外部的闸室阀34,它是通过另一个相应设计的不直接属于本发明提出的装置而是属于本设备的运输机构构成的,或者是通过专门为此配置的盖构成的。如从图2中可以看出的,外部的闸室阀34可以具有一个中心凹口,用于接收或送回工件的心轴30就啮合在此凹口中,如用箭头V表示的,在阀34上例如有一个吸力机构将工件吸在该阀上或者将工件释放。溅射源7用法兰连接在开孔50上,在开孔50的范围中,通过运输室1的壁24或其壁厚来构成溅射操作室。
由于本装置具有高度紧凑性,特别是由于小体积的闸室3的高度紧凑性,所以CD-镀膜的周期时间很短,例如在三秒钟内可以完成同一个工件从装入闸室3到从闸室3卸出的全过程。
图中的36表示一个连通闸室的泵/注流连接件,38也表示这样一个连接件,它是用于运输室和开口50中溅射镀膜装置的操作室5的,在这里还可以附加地设置一个泵/注流连接件,这视情况而定。
在图3a中示明了刚才述及的溅射镀膜装置,在此用图1中所用的相同标号,只示出运输机构的驱动机构15、溅射源7及承载件17。根据对图1所做的说明,对专业人员来说,图3a所示溅射镀膜装置的构造是一目了然的。外部的闸室阀是通过一个盖34a构成的,例如可用一气动驱动装置40来操纵此盖。图3b示明图3a中Ⅲ-Ⅲ线所看的溅射镀膜装置。此外,在图3b中还示意地示明了装载臂42,例如用于CD的一个压力机装载臂,该装载臂在完成加压工序之后,将作为工件23的CD依照回转运动ω2推入到图1中所示开口30和图3a所示闸室盖34a之间,在这里将圆片形工件交到承接盘21上,并返回,随后闸室盖34a将闸室3关闭。
在图4、5、6和7中分别示明如图3a所示本发明提出的溅射镀膜装置。本装置在图4至7中均以50表示。
如图4所示,双臂运输机构52至少有两个依其回转轴A2径向安置的错开90°的运输臂54,这两个运输臂可以各自依径向移出或者返回。回转轴A2垂直于平面E,如图1中所示。例如,配有吸力保持机构的承接盘56与运输臂54相连,它允许由一个直线的输送器去接收圆片形工件,并将之带到入闸位置,于此,其时定位在闸对面的运输盘56最好起着外部的闸阀的作用。在这里,闸装置50是依水平轴线Q运转的。
如图5所示,对专业人员来说是一目了然的,配置了一个外部的或者另一个运输机构52a,它也带有依径向伸出的臂54和工件承接盘56,它围绕一个位于平面E中并与图1所示装置的轴A2相平行的A3可回转地运行。在这里,在另一个运输机构52a上相应定位的工件承接盘56也为装置50构成外部的闸阀。按图5所示的结构方案,装置50是按垂直向下的工作方式配置的。
如图6所示,外部的运输机构52b具有与其回转轴A3相平行的可以移出和缩回的臂54b,这些臂各自带有相应的工件承接盘56b。轴A3是与本装置的轴线Q平行的,按图6所示的结构形式,本装置是垂直向下地工作的。
在这里,工件承接盘56b在其相应位置上也承担外部闸阀的功能。
如图7示意地示明的,外部的运输机构包含一个活动臂58,其上配有可回转地安置的工件承接盘60。在这里,工件承接运输盘60也可构成装置50的外部闸阀。
如在图1中以55进一步示明的,按照本发明提出的设备构造,为本装置配置了作为专用模块的监控单元。
Claims (10)
1.用于工圆片形工件的溅射镀膜装置,它包含:
-一个闸室(3),
-一个具有作用面(7a)的溅射源(7),
-一个运输室(1),它分别具有连通闸室(3)和溅射源(7)的开口(30,50),用于运输或运送工件(23)进入并离开溅射位置,
-一个运输机构(13),在运输室(1)中用来在上述开口之间运送工件,
其特征在于:
闸室和溅射源(7)的作用面(7a),跨过运输室(1),沿着相关的横轴线(Q)彼此处于对峙位置,
运输机构(13)绕与一个与所述横轴线(Q)限定一平面(E)并与横轴线(Q)相垂直的回转轴(A)可以被回转地安置在运输室(1)中,而且至少包含一个可依回转轴(A1)径向移出及缩回的承载臂(19),在该承载臂背向回转轴(A1)的一端上配有一个工件承接件(21)。
2.按照权利要求1中所述的装置,其特征在于:运输机构(13)至少配有两个上述的臂(19)。
3.按照权利要求1或2的一项中所述的装置,其特征在于:承载臂(19)的彼此相对地移动的部分是装在皮囊中的。
4.按照权利要求1至3的一项中所述的装置,其特征在于:工件承接件(21)构成闸室(3)的在运输室一侧的闸阀并且/或者构成溅射源(7)和运输室(1)之间的密封机构。
5.按照权利要求1至4的一项中所述的装置,其特征在于:工件承接件(21)具有一个用于工件(23)的卡定连接件(32),在具有中心孔的圆片形工件情况下,最好具有一个卡入该中心孔的弹簧珠卡定机构。
6.按照权利要求1至5的一项中所述的装置,其特征在于:闸室(3)基本上是通过环绕着开口(30)中的一个开口的真空室壁(25)的壁厚形成的,并且/或溅射操作室(5)基本上是通过环绕着所述开口中的另一开口(50)的运输室臂(25)的壁厚形成的。
7.按照权利要求1至6的一项中所述的装置,其特征在于:无论如何,闸室(3),但还有运输室(1)和/或溅射源(7)的溅射操作室(5)分别配有泵接头(36、38)和/或注流接头。
8.配备有按照权利要求1至7的一项中所述装置(50)的真空表面处理设备,其特征在于:连同所述及的装置模块(50),还配置了一个用于监控目的的电子模块(55)及另一个运输机构(42,52,58),该运输机构是从外面操纵闸室(3)的。
9.按照权利要求8中所述的设备,其特征在于:另一运输机构是可以在一个与在运输室(1)和闸室(3)之间的开口(30)的平面相平行的平面中移动的。
10.按照权利要求9中所述的设备,其特征在于:另一运输机构构成装置的闸室(3)的对外闸封闸阀。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE29716440.6 | 1997-09-12 | ||
DE29716440U DE29716440U1 (de) | 1997-09-12 | 1997-09-12 | Sputterstation |
US08/964,962 US6416640B1 (en) | 1997-09-12 | 1997-11-05 | Sputter station |
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CN1217390A true CN1217390A (zh) | 1999-05-26 |
CN1213163C CN1213163C (zh) | 2005-08-03 |
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ID=26060719
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB98119253XA Expired - Fee Related CN1213163C (zh) | 1997-09-12 | 1998-09-14 | 溅射镀膜装置和真空表面处理设备 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6416640B1 (zh) |
JP (1) | JPH11140645A (zh) |
CN (1) | CN1213163C (zh) |
DE (1) | DE29716440U1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100339730C (zh) * | 2004-05-26 | 2007-09-26 | 精碟科技股份有限公司 | 光学元件镀膜器具 |
CN1745192B (zh) * | 2003-12-22 | 2010-08-18 | 应用材料有限责任与两合公司 | 带有一装料锁及相应装置的涂敷机 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6610150B1 (en) | 1999-04-02 | 2003-08-26 | Asml Us, Inc. | Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system |
ATE280436T1 (de) * | 2000-06-22 | 2004-11-15 | Unaxis Balzers Ag | Beschichtungsanlage für scheibenförmige werkstücke |
US6485248B1 (en) * | 2000-10-10 | 2002-11-26 | Applied Materials, Inc. | Multiple wafer lift apparatus and associated method |
DE10244433B4 (de) * | 2002-09-24 | 2005-12-15 | Adidas International Marketing B.V. | Gleitelement und Schuhsohle |
CN101886248B (zh) * | 2009-05-15 | 2013-08-21 | 鸿富锦精密工业(深圳)有限公司 | 溅镀式镀膜装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4756815A (en) * | 1979-12-21 | 1988-07-12 | Varian Associates, Inc. | Wafer coating system |
US4523985A (en) * | 1983-12-22 | 1985-06-18 | Sputtered Films, Inc. | Wafer processing machine |
JPH0613751B2 (ja) * | 1986-03-07 | 1994-02-23 | 株式会社日立製作所 | 連続スパッタ装置 |
DE3912295C2 (de) * | 1989-04-14 | 1997-05-28 | Leybold Ag | Katodenzerstäubungsanlage |
DE4117969C2 (de) * | 1991-05-31 | 2000-11-09 | Balzers Ag Liechtenstein | Vakuumkammer |
JPH05271934A (ja) * | 1992-03-23 | 1993-10-19 | Hitachi Ltd | スパッタリング装置 |
US5766360A (en) * | 1992-03-27 | 1998-06-16 | Kabushiki Kaisha Toshiba | Substrate processing apparatus and substrate processing method |
GB2272225B (en) * | 1992-10-06 | 1996-07-17 | Balzers Hochvakuum | A method for masking a workpiece and a vacuum treatment facility |
US5738767A (en) * | 1994-01-11 | 1998-04-14 | Intevac, Inc. | Substrate handling and processing system for flat panel displays |
DE29505497U1 (de) * | 1995-03-31 | 1995-06-08 | Balzers Hochvakuum GmbH, 65205 Wiesbaden | Beschichtungsstation |
US5709785A (en) * | 1995-06-08 | 1998-01-20 | First Light Technology Inc. | Metallizing machine |
-
1997
- 1997-09-12 DE DE29716440U patent/DE29716440U1/de not_active Expired - Lifetime
- 1997-11-05 US US08/964,962 patent/US6416640B1/en not_active Expired - Fee Related
-
1998
- 1998-09-10 JP JP10256388A patent/JPH11140645A/ja not_active Withdrawn
- 1998-09-14 CN CNB98119253XA patent/CN1213163C/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1745192B (zh) * | 2003-12-22 | 2010-08-18 | 应用材料有限责任与两合公司 | 带有一装料锁及相应装置的涂敷机 |
CN100339730C (zh) * | 2004-05-26 | 2007-09-26 | 精碟科技股份有限公司 | 光学元件镀膜器具 |
Also Published As
Publication number | Publication date |
---|---|
CN1213163C (zh) | 2005-08-03 |
JPH11140645A (ja) | 1999-05-25 |
US6416640B1 (en) | 2002-07-09 |
DE29716440U1 (de) | 1997-12-11 |
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