DE102013008512A1 - Gruppe lll-Nitrid-Transistor mit Ladungs-Induzierschicht - Google Patents
Gruppe lll-Nitrid-Transistor mit Ladungs-Induzierschicht Download PDFInfo
- Publication number
- DE102013008512A1 DE102013008512A1 DE102013008512A DE102013008512A DE102013008512A1 DE 102013008512 A1 DE102013008512 A1 DE 102013008512A1 DE 102013008512 A DE102013008512 A DE 102013008512A DE 102013008512 A DE102013008512 A DE 102013008512A DE 102013008512 A1 DE102013008512 A1 DE 102013008512A1
- Authority
- DE
- Germany
- Prior art keywords
- layer
- charge
- inducing
- barrier layer
- gate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/111—Field plates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/015—Manufacture or treatment of FETs having heterojunction interface channels or heterojunction gate electrodes, e.g. HEMT
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/475—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
- H10D30/4755—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs having wide bandgap charge-carrier supplying layers, e.g. modulation doped HEMTs such as n-AlGaAs/GaAs HEMTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/517—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
- H10D64/518—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers characterised by their lengths or sectional shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/256—Source or drain electrodes for field-effect devices for lateral devices wherein the source or drain electrodes are recessed in semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
Landscapes
- Junction Field-Effect Transistors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/481,198 US20130313561A1 (en) | 2012-05-25 | 2012-05-25 | Group iii-nitride transistor with charge-inducing layer |
| US13/481,198 | 2012-05-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102013008512A1 true DE102013008512A1 (de) | 2013-11-28 |
Family
ID=49547107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102013008512A Withdrawn DE102013008512A1 (de) | 2012-05-25 | 2013-05-16 | Gruppe lll-Nitrid-Transistor mit Ladungs-Induzierschicht |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20130313561A1 (enExample) |
| JP (1) | JP2013247363A (enExample) |
| DE (1) | DE102013008512A1 (enExample) |
| TW (1) | TW201407780A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110808211A (zh) * | 2019-11-08 | 2020-02-18 | 中国电子科技集团公司第十三研究所 | 斜型栅结构氧化镓场效应晶体管及其制备方法 |
Families Citing this family (58)
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| US8884334B2 (en) * | 2012-11-09 | 2014-11-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Composite layer stacking for enhancement mode transistor |
| KR20150092172A (ko) | 2012-11-16 | 2015-08-12 | 메사추세츠 인스티튜트 오브 테크놀로지 | 반도체 구조물, 및 리세스 형성 에칭 수법 |
| US9105578B2 (en) * | 2013-03-12 | 2015-08-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Interface for metal gate integration |
| US9263275B2 (en) | 2013-03-12 | 2016-02-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Interface for metal gate integration |
| KR102309747B1 (ko) * | 2013-08-30 | 2021-10-08 | 고쿠리츠켄큐카이하츠호진 카가쿠기쥬츠신코키코 | InGaAlN계 반도체 소자 |
| KR102086360B1 (ko) * | 2013-11-07 | 2020-03-09 | 삼성전자주식회사 | n형 질화물 반도체의 전극형성방법, 질화물 반도체 소자 및 그 제조방법 |
| US10483386B2 (en) * | 2014-01-17 | 2019-11-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device, transistor having doped seed layer and method of manufacturing the same |
| JP2017509150A (ja) * | 2014-03-25 | 2017-03-30 | インテル・コーポレーション | 急峻なサブスレッショルドスイングを提供するエピタキシャル層を有するiii−nトランジスタ |
| US9318593B2 (en) | 2014-07-21 | 2016-04-19 | Transphorm Inc. | Forming enhancement mode III-nitride devices |
| WO2016043748A1 (en) | 2014-09-18 | 2016-03-24 | Intel Corporation | Wurtzite heteroepitaxial structures with inclined sidewall facets for defect propagation control in silicon cmos-compatible semiconductor devices |
| US10229991B2 (en) | 2014-09-25 | 2019-03-12 | Intel Corporation | III-N epitaxial device structures on free standing silicon mesas |
| CN106796953B (zh) * | 2014-10-30 | 2021-03-30 | 英特尔公司 | 源极/漏极至氮化镓晶体管中的2d电子气的低接触电阻再生长 |
| CN107078098B (zh) * | 2014-11-18 | 2021-04-06 | 英特尔公司 | 使用n沟道和p沟道氮化镓晶体管的cmos电路 |
| US11164970B2 (en) | 2014-11-25 | 2021-11-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Contact field plate |
| US10756208B2 (en) | 2014-11-25 | 2020-08-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated chip and method of forming the same |
| KR102309482B1 (ko) | 2014-12-18 | 2021-10-07 | 인텔 코포레이션 | N-채널 갈륨 질화물 트랜지스터들 |
| US20160293596A1 (en) * | 2015-03-30 | 2016-10-06 | Texas Instruments Incorporated | Normally off iii-nitride transistor |
| JP2016207890A (ja) * | 2015-04-24 | 2016-12-08 | トヨタ自動車株式会社 | ヘテロ接合半導体装置 |
| US10211327B2 (en) | 2015-05-19 | 2019-02-19 | Intel Corporation | Semiconductor devices with raised doped crystalline structures |
| TWI880237B (zh) * | 2015-06-05 | 2025-04-11 | 美商蘭姆研究公司 | GaN及其他Ⅲ-Ⅴ族材料之原子層蝕刻 |
| EP3314659A4 (en) | 2015-06-26 | 2019-01-23 | INTEL Corporation | HETEROEPITAXISTRUCTURES WITH HIGH-TEMPERATURE-RESISTANT SUBSTRATE INTERMEDIATE MATERIAL |
| CN108604596A (zh) * | 2015-07-17 | 2018-09-28 | 剑桥电子有限公司 | 用于半导体装置的场板结构 |
| US10096487B2 (en) | 2015-08-19 | 2018-10-09 | Lam Research Corporation | Atomic layer etching of tungsten and other metals |
| DE102015118440A1 (de) * | 2015-10-28 | 2017-05-04 | Infineon Technologies Austria Ag | Halbleiterbauelement |
| WO2017111888A1 (en) * | 2015-12-21 | 2017-06-29 | Intel Corporation | Envelope-tracking control techniques for highly-efficient rf power amplifiers |
| US10658471B2 (en) | 2015-12-24 | 2020-05-19 | Intel Corporation | Transition metal dichalcogenides (TMDCS) over III-nitride heteroepitaxial layers |
| US9991128B2 (en) | 2016-02-05 | 2018-06-05 | Lam Research Corporation | Atomic layer etching in continuous plasma |
| US10062776B2 (en) * | 2016-02-05 | 2018-08-28 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and manufacturing method thereof |
| US9941398B2 (en) * | 2016-03-17 | 2018-04-10 | Taiwan Semiconductor Manufacturing Company Ltd. | High-electron-mobility transistor (HEMT) capable of protecting a III-V compound layer |
| WO2018004650A1 (en) * | 2016-07-01 | 2018-01-04 | Intel Corporation | 1t-1r rram cell including group iii-n access transistor |
| US10991817B2 (en) * | 2016-07-01 | 2021-04-27 | Intel Corporation | Group III-N transistors including source to channel heterostructure design |
| US10068976B2 (en) * | 2016-07-21 | 2018-09-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Enhancement mode field-effect transistor with a gate dielectric layer recessed on a composite barrier layer for high static performance |
| CN106712829A (zh) * | 2016-11-28 | 2017-05-24 | 深圳天珑无线科技有限公司 | 一种天线切换方法和电路 |
| US10566212B2 (en) | 2016-12-19 | 2020-02-18 | Lam Research Corporation | Designer atomic layer etching |
| US10446544B2 (en) * | 2017-06-08 | 2019-10-15 | Qorvo Us, Inc. | Enhancement-mode/depletion-mode field-effect transistor GAN technology |
| CN110754001B (zh) * | 2017-06-15 | 2023-09-26 | 宜普电源转换公司 | 用以改善氮化镓间隔件厚度均匀度的增强型氮化镓晶体管 |
| US11380806B2 (en) * | 2017-09-28 | 2022-07-05 | Intel Corporation | Variable capacitance device with multiple two-dimensional electron gas (2DEG) layers |
| US11233053B2 (en) | 2017-09-29 | 2022-01-25 | Intel Corporation | Group III-nitride (III-N) devices with reduced contact resistance and their methods of fabrication |
| WO2019066935A1 (en) | 2017-09-29 | 2019-04-04 | Intel Corporation | REDUCED CONTACT RESISTANCE GROUP III (N-N) NITRIDE DEVICES AND METHODS OF MAKING THE SAME |
| US11557667B2 (en) | 2017-09-30 | 2023-01-17 | Intel Corporation | Group III-nitride devices with improved RF performance and their methods of fabrication |
| CN110034186B (zh) * | 2018-01-12 | 2021-03-16 | 中国科学院苏州纳米技术与纳米仿生研究所 | 基于复合势垒层结构的iii族氮化物增强型hemt及其制作方法 |
| US10516023B2 (en) | 2018-03-06 | 2019-12-24 | Infineon Technologies Austria Ag | High electron mobility transistor with deep charge carrier gas contact structure |
| US10541313B2 (en) | 2018-03-06 | 2020-01-21 | Infineon Technologies Austria Ag | High Electron Mobility Transistor with dual thickness barrier layer |
| US11563098B2 (en) * | 2018-06-22 | 2023-01-24 | Intel Corporation | Transistor gate shape structuring approaches |
| DE102018212736B4 (de) * | 2018-07-31 | 2022-05-12 | Christian-Albrechts-Universität Zu Kiel | Ferroelektrische Halbleitervorrichtung mit einer einen Mischkristall aufweisenden ferroelektrischen Speicherschicht und Verfahren zu deren Herstellung |
| US20200194551A1 (en) * | 2018-12-13 | 2020-06-18 | Intel Corporation | High conductivity source and drain structure for hemt devices |
| US11610971B2 (en) * | 2018-12-17 | 2023-03-21 | Intel Corporation | Cap layer on a polarization layer to preserve channel sheet resistance |
| CN113646870B (zh) * | 2019-04-04 | 2022-11-25 | Hrl实验室有限责任公司 | 微型场板t型栅极及其制造方法 |
| JP7448314B2 (ja) * | 2019-04-19 | 2024-03-12 | 株式会社東芝 | 半導体装置 |
| CN112216738B (zh) * | 2019-07-09 | 2025-04-11 | 台湾积体电路制造股份有限公司 | 集成芯片及其形成方法 |
| CN112349773A (zh) * | 2019-08-07 | 2021-02-09 | 苏州能讯高能半导体有限公司 | 一种半导体器件及其制备方法 |
| CN118099203A (zh) | 2019-08-14 | 2024-05-28 | 联华电子股份有限公司 | 高电子迁移率晶体管及其制作方法 |
| US11239802B2 (en) * | 2019-10-02 | 2022-02-01 | Wolfspeed, Inc. | Radio frequency transistor amplifiers having engineered instrinsic capacitances for improved performance |
| US20210399119A1 (en) * | 2020-06-23 | 2021-12-23 | Intel Corporation | Transition metal-iii-nitride alloys for robust high performance hemts |
| CN113972266B (zh) * | 2020-07-23 | 2024-10-01 | 安徽长飞先进半导体有限公司 | 隧穿增强型垂直结构的hemt器件 |
| KR20230136016A (ko) | 2021-02-03 | 2023-09-26 | 램 리써치 코포레이션 | 원자 층 에칭의 에칭 선택도 제어 |
| US20240072130A1 (en) * | 2022-08-29 | 2024-02-29 | Raytheon Company | T-gate transistor with mini field plate and angled gate stem |
| US20240266403A1 (en) * | 2023-02-03 | 2024-08-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Buffer structure with interlayer buffer layers for high voltage device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006086398A (ja) * | 2004-09-17 | 2006-03-30 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
| JP2008270794A (ja) * | 2007-03-29 | 2008-11-06 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
| WO2009066434A1 (ja) * | 2007-11-19 | 2009-05-28 | Nec Corporation | 電界効果トランジスタおよびその製造方法 |
| US8309987B2 (en) * | 2008-07-15 | 2012-11-13 | Imec | Enhancement mode semiconductor device |
| US7985986B2 (en) * | 2008-07-31 | 2011-07-26 | Cree, Inc. | Normally-off semiconductor devices |
| WO2010151721A1 (en) * | 2009-06-25 | 2010-12-29 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Transistor with enhanced channel charge inducing material layer and threshold voltage control |
-
2012
- 2012-05-25 US US13/481,198 patent/US20130313561A1/en not_active Abandoned
-
2013
- 2013-04-29 TW TW102115230A patent/TW201407780A/zh unknown
- 2013-05-16 DE DE102013008512A patent/DE102013008512A1/de not_active Withdrawn
- 2013-05-23 JP JP2013108851A patent/JP2013247363A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110808211A (zh) * | 2019-11-08 | 2020-02-18 | 中国电子科技集团公司第十三研究所 | 斜型栅结构氧化镓场效应晶体管及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013247363A (ja) | 2013-12-09 |
| TW201407780A (zh) | 2014-02-16 |
| US20130313561A1 (en) | 2013-11-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |