CN1666150A - 基于多环聚合物的感光组合物 - Google Patents

基于多环聚合物的感光组合物 Download PDF

Info

Publication number
CN1666150A
CN1666150A CN038158094A CN03815809A CN1666150A CN 1666150 A CN1666150 A CN 1666150A CN 038158094 A CN038158094 A CN 038158094A CN 03815809 A CN03815809 A CN 03815809A CN 1666150 A CN1666150 A CN 1666150A
Authority
CN
China
Prior art keywords
composition
group
polymer
wafer
linearity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN038158094A
Other languages
English (en)
Chinese (zh)
Inventor
埃德蒙德·埃尔切
平野孝
小杰弗里·C·克罗廷
拉里·F·罗兹
布赖恩·L·古多尔
塞库马·贾亚拉曼
克里斯·麦克杜格尔
孙申亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of CN1666150A publication Critical patent/CN1666150A/zh
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C08G61/04—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
    • C08G61/06—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Materials For Photolithography (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Polymerisation Methods In General (AREA)
  • Silicon Polymers (AREA)
CN038158094A 2002-07-03 2003-07-02 基于多环聚合物的感光组合物 Pending CN1666150A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US39372602P 2002-07-03 2002-07-03
US60/393,726 2002-07-03
US10/465,511 US7022790B2 (en) 2002-07-03 2003-06-19 Photosensitive compositions based on polycyclic polymers
US10/465,511 2003-06-19

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201110146567.6A Division CN102298265B (zh) 2002-07-03 2003-07-02 光刻介电组合物及电气或电子器件

Publications (1)

Publication Number Publication Date
CN1666150A true CN1666150A (zh) 2005-09-07

Family

ID=30118385

Family Applications (2)

Application Number Title Priority Date Filing Date
CN038158094A Pending CN1666150A (zh) 2002-07-03 2003-07-02 基于多环聚合物的感光组合物
CN201110146567.6A Expired - Fee Related CN102298265B (zh) 2002-07-03 2003-07-02 光刻介电组合物及电气或电子器件

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201110146567.6A Expired - Fee Related CN102298265B (zh) 2002-07-03 2003-07-02 光刻介电组合物及电气或电子器件

Country Status (11)

Country Link
US (2) US7022790B2 (enExample)
EP (1) EP1532486B1 (enExample)
JP (1) JP4623419B2 (enExample)
KR (1) KR100688632B1 (enExample)
CN (2) CN1666150A (enExample)
AT (1) ATE453135T1 (enExample)
AU (1) AU2003243013A1 (enExample)
DE (1) DE60330672D1 (enExample)
MY (1) MY142759A (enExample)
TW (2) TWI300167B (enExample)
WO (1) WO2004006020A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102405441A (zh) * 2009-04-20 2012-04-04 旭化成电子材料株式会社 感光性树脂层压体
CN102402137A (zh) * 2010-09-15 2012-04-04 无锡华润上华半导体有限公司 孔的光刻方法
CN102782579A (zh) * 2010-02-25 2012-11-14 日立化成工业株式会社 负型感光性树脂组合物、层间绝缘膜及其形成方法

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7022790B2 (en) * 2002-07-03 2006-04-04 Sumitomo Bakelite Company, Ltd. Photosensitive compositions based on polycyclic polymers
US20060020068A1 (en) * 2004-07-07 2006-01-26 Edmund Elce Photosensitive compositions based on polycyclic polymers for low stress, high temperature films
US7501230B2 (en) * 2002-11-04 2009-03-10 Meagley Robert P Photoactive adhesion promoter
US6893985B2 (en) * 2003-03-31 2005-05-17 Intel Corporation UV-activated dielectric layer
ATE450813T1 (de) * 2004-05-17 2009-12-15 Fujifilm Corp Verfahren zur erzeugung eines musters
JP4759311B2 (ja) * 2004-05-17 2011-08-31 富士フイルム株式会社 パターン形成方法
JP2006096812A (ja) * 2004-09-28 2006-04-13 Sumitomo Bakelite Co Ltd 半導体表面保護膜用樹脂組成物、及びそれを用いた半導体装置
TW200628981A (en) * 2004-09-29 2006-08-16 Sumitomo Bakelite Co Semiconductor device
JP2006100562A (ja) * 2004-09-29 2006-04-13 Sumitomo Bakelite Co Ltd 半導体装置
JP4556598B2 (ja) * 2004-09-30 2010-10-06 住友ベークライト株式会社 半導体装置
JP4170277B2 (ja) * 2004-09-30 2008-10-22 住友ベークライト株式会社 感光性樹脂組成物および半導体装置
JP2006098949A (ja) * 2004-09-30 2006-04-13 Sumitomo Bakelite Co Ltd 半導体装置
JP2006124648A (ja) * 2004-10-01 2006-05-18 Sumitomo Bakelite Co Ltd 樹脂組成物、樹脂層、樹脂層付きキャリア材料および回路基板
KR100892204B1 (ko) * 2004-10-13 2009-04-07 스미토모 베이클리트 컴퍼니 리미티드 수광 장치
TW200619843A (en) * 2004-10-20 2006-06-16 Sumitomo Bakelite Co Semiconductor wafer and semiconductor device
KR100789247B1 (ko) * 2005-01-05 2008-01-02 주식회사 엘지화학 광반응성 중합체 및 이의 제조 방법
KR100655801B1 (ko) 2005-01-18 2006-12-08 삼성전자주식회사 포토레지스트 조성물 및 이를 이용한 포토레지스트 패턴형성 방법
EP1788434B2 (en) * 2005-11-18 2019-01-02 Agfa Nv Method of making a lithographic printing plate
US8207279B2 (en) * 2006-06-26 2012-06-26 Lg Chem, Ltd. Method for preparing norbornene monomer composition, norbornene polymer prepared therefrom, optical film comprising the norbornene polymer, and method for preparing the norbornene polymer
JP5040432B2 (ja) * 2007-05-15 2012-10-03 住友ベークライト株式会社 感光性樹脂組成物
KR101451802B1 (ko) * 2007-07-31 2014-10-16 삼성에스디아이 주식회사 글리시딜 에테르계 화합물을 채용한 유기전해액 및 리튬전지
US7906568B2 (en) * 2007-09-04 2011-03-15 General Electric Company Coupling agent composition and associated method
US8039543B2 (en) * 2007-09-04 2011-10-18 General Electric Company Composition comprising a coupling agent and a cycloolefin, the coupling agent comprising a reaction product of an epoxy-substituted cycloolefin and an aromatic amine
US8039544B2 (en) * 2007-09-04 2011-10-18 General Electric Company Coupling agent comprising a reaction product of an epoxy-substituted cycloolefin and an aromatic amine
US7994238B2 (en) * 2007-09-04 2011-08-09 General Electric Company Article and associated method
US9786576B2 (en) 2007-11-12 2017-10-10 Hitachi Chemical Company, Ltd Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device
US7902279B2 (en) * 2007-12-04 2011-03-08 General Electric Company Composition, article, and associated method
US7879963B2 (en) * 2007-12-18 2011-02-01 General Electric Company Composition, article, and associated method
US8609574B2 (en) * 2008-04-25 2013-12-17 Promerus Llc In situ olefin polymerization catalyst system
WO2010026988A1 (ja) 2008-09-04 2010-03-11 日立化成工業株式会社 ポジ型感光性樹脂組成物、レジストパターンの製造方法及び電子部品
CN103091987B (zh) 2008-12-26 2016-11-23 日立化成株式会社 正型感光性树脂组合物、抗蚀图形的制造方法、半导体装置以及电子器件
JP5656413B2 (ja) * 2009-01-30 2015-01-21 富士フイルム株式会社 ネガ型レジストパターン形成方法、それに用いられる現像液及びネガ型化学増幅型レジスト組成物、並びにレジストパターン
US8753790B2 (en) * 2009-07-01 2014-06-17 Promerus, Llc Self-imageable film forming polymer, compositions thereof and devices and structures made therefrom
KR101238403B1 (ko) 2009-09-04 2013-02-28 주식회사 엘지화학 광 반응성기를 갖는 노보넨계 중합체를 포함하는 액정 배향용 조성물 및 이를 포함하는 광 배향 필름
US8580477B2 (en) * 2009-09-21 2013-11-12 Promerus Llc Aqueous base-developable negative-tone films based on functionalized norbornene polymers
US8829087B2 (en) * 2010-12-14 2014-09-09 Promerus, Llc Transparent layer forming polymer
JPWO2012165448A1 (ja) * 2011-06-01 2015-02-23 日本ゼオン株式会社 樹脂組成物および半導体素子基板
KR101364229B1 (ko) * 2012-12-20 2014-02-17 동우 화인켐 주식회사 감광성 수지 조성물 및 이로부터 제조되는 절연막
WO2015026445A1 (en) * 2013-08-21 2015-02-26 Applied Materials, Inc. Variable frequency microwave (vfm) processes and applications in semiconductor thin film fabrications
US20160311970A1 (en) * 2013-12-13 2016-10-27 Transfert Plus, Société En Commandite Insertion polynorbornene-based thermoset resins
WO2015141525A1 (ja) * 2014-03-20 2015-09-24 住友ベークライト株式会社 感光性樹脂組成物、および電子装置
JP6459192B2 (ja) * 2014-03-20 2019-01-30 住友ベークライト株式会社 感光性樹脂組成物
US10245562B2 (en) * 2014-08-15 2019-04-02 Promerus, Llc Pervaporation membranes derived from polycyclo-olefinic block copolymers
JP6550275B2 (ja) * 2015-06-15 2019-07-24 東京応化工業株式会社 ナノインプリント用組成物、硬化物、パターン形成方法及びパターンを含む物品
CN109313388B (zh) * 2016-06-14 2022-06-21 住友电木株式会社 负型感光性组合物
JP6558479B2 (ja) * 2018-07-18 2019-08-14 住友ベークライト株式会社 ポリマー、および感光性樹脂組成物
US12077627B2 (en) 2022-04-26 2024-09-03 Chevron Phillips Chemical Company Lp Aqueous methods for titanating a chromium/silica catalyst with an alkali metal
KR102515739B1 (ko) * 2022-12-07 2023-03-30 타코마테크놀러지 주식회사 감광성 수지 및 이를 포함하는 포토레지스트 조성물

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5468819A (en) 1993-11-16 1995-11-21 The B.F. Goodrich Company Process for making polymers containing a norbornene repeating unit by addition polymerization using an organo (nickel or palladium) complex
DE19509173B4 (de) * 1994-03-14 2005-06-16 Nippon Zeon Co., Ltd. Masse aus einem Epoxygruppen enthaltenden thermoplastischen Norbornenharz und ihre Verwendung
JP3588498B2 (ja) 1994-03-14 2004-11-10 日本ゼオン株式会社 エポキシ基を有する環状オレフィン系樹脂組成物および該樹脂組成物を用いた絶縁材料
US6294616B1 (en) * 1995-05-25 2001-09-25 B. F. Goodrich Company Blends and alloys of polycyclic polymers
US6232417B1 (en) 1996-03-07 2001-05-15 The B. F. Goodrich Company Photoresist compositions comprising polycyclic polymers with acid labile pendant groups
RU2194295C2 (ru) * 1996-03-07 2002-12-10 З Би. Эф. Гудрич Кампэни Фоторезистная композиция и полимер
US6121340A (en) * 1996-11-04 2000-09-19 The B. F. Goodrich Company Photodefinable dielectric compositions comprising polycyclic polymers
JP3971476B2 (ja) 1996-11-29 2007-09-05 日本ゼオン株式会社 エポキシ基含有ノルボルネン系付加型共重合体、その製造方法、及び架橋性重合体組成物
US5712407A (en) 1997-01-14 1998-01-27 Ppg Industries, Inc. Method for the preparation of alpha-chlorinated chloroformates
WO1999003903A1 (en) * 1997-07-18 1999-01-28 Nippon Zeon Co., Ltd. Modified cycloolefin addition polymer and curable resin composition containing the same
US5879592A (en) 1997-12-10 1999-03-09 Ppg Industries, Inc. Water soluble photochromic compounds, compositions and optical elements comprising the compounds
JP2002519487A (ja) * 1998-07-01 2002-07-02 ザ ビー．エフ．グッドリッチ カンパニー 多環式共重合体組成物
CN1249105C (zh) * 1998-10-05 2006-04-05 普罗米鲁斯有限责任公司 环烯烃聚合催化剂及聚合方法
DE19921913C2 (de) * 1999-05-12 2001-06-13 Groz Beckert Kg Nähmaschinennadel mit schlankem Öhr
US7022790B2 (en) 2002-07-03 2006-04-04 Sumitomo Bakelite Company, Ltd. Photosensitive compositions based on polycyclic polymers

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102405441A (zh) * 2009-04-20 2012-04-04 旭化成电子材料株式会社 感光性树脂层压体
CN102405441B (zh) * 2009-04-20 2013-07-24 旭化成电子材料株式会社 感光性树脂层压体、抗蚀图案形成方法和导体图案制造方法
CN102782579A (zh) * 2010-02-25 2012-11-14 日立化成工业株式会社 负型感光性树脂组合物、层间绝缘膜及其形成方法
CN104597712A (zh) * 2010-02-25 2015-05-06 日立化成工业株式会社 负型感光性树脂组合物、层间绝缘膜及其形成方法
CN102402137A (zh) * 2010-09-15 2012-04-04 无锡华润上华半导体有限公司 孔的光刻方法
CN102402137B (zh) * 2010-09-15 2014-04-09 无锡华润上华半导体有限公司 孔的光刻方法

Also Published As

Publication number Publication date
MY142759A (en) 2010-12-31
DE60330672D1 (de) 2010-02-04
JP2005531680A (ja) 2005-10-20
KR20050033565A (ko) 2005-04-12
WO2004006020A1 (en) 2004-01-15
EP1532486B1 (en) 2009-12-23
ATE453135T1 (de) 2010-01-15
AU2003243013A1 (en) 2004-01-23
US20060167197A1 (en) 2006-07-27
US7022790B2 (en) 2006-04-04
TWI398459B (zh) 2013-06-11
CN102298265A (zh) 2011-12-28
US8114948B2 (en) 2012-02-14
KR100688632B1 (ko) 2007-03-02
TW200412472A (en) 2004-07-16
TWI300167B (en) 2008-08-21
EP1532486A1 (en) 2005-05-25
CN102298265B (zh) 2014-04-16
US20040039153A1 (en) 2004-02-26
TW200835710A (en) 2008-09-01
JP4623419B2 (ja) 2011-02-02

Similar Documents

Publication Publication Date Title
CN1666150A (zh) 基于多环聚合物的感光组合物
KR100993890B1 (ko) 폴리시클릭 중합체에 기초한 감광성 조성물
JP5618537B2 (ja) チップ積層並びにチップ・ウェハ接合に有用な方法及び材料
JP6378443B2 (ja) 光イメージ化可能な水現像性ポジティブトーン組成物
JP5656349B2 (ja) チップを積層するために、そしてチップ及びウェハを接合させるために有用な方法及び材料
JP4428189B2 (ja) 樹脂封止型半導体装置
JP2019200244A (ja) リソグラフィー用膜形成材料、リソグラフィー用膜形成用組成物、リソグラフィー用下層膜及びパターン形成方法
JP5304592B2 (ja) 樹脂封止型半導体装置
TWI649620B (zh) 含有光產鹼劑的光可成像組成物
JP7275770B2 (ja) 樹脂組成物および電子デバイス製造方法
HK1077370A (en) Photosensitive compositions based on polycyclic polymers
JP2013048295A (ja) 樹脂封止型半導体装置
JP7322580B2 (ja) 電子装置の製造方法
JP7287066B2 (ja) 樹脂組成物および電子デバイス製造方法
HK1106258A (en) Photosensitive compositions based on polycyclic polymers
JP2006098762A (ja) 感光性樹脂組成物、及びそれを用いた半導体装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1077370

Country of ref document: HK

C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Open date: 20050907