TWI300167B - Photosensitive compositions based on polycyclic polymers - Google Patents

Photosensitive compositions based on polycyclic polymers Download PDF

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Publication number
TWI300167B
TWI300167B TW092118096A TW92118096A TWI300167B TW I300167 B TWI300167 B TW I300167B TW 092118096 A TW092118096 A TW 092118096A TW 92118096 A TW92118096 A TW 92118096A TW I300167 B TWI300167 B TW I300167B
Authority
TW
Taiwan
Prior art keywords
group
composition
ether
copolymer
branched
Prior art date
Application number
TW092118096A
Other languages
English (en)
Chinese (zh)
Other versions
TW200412472A (en
Inventor
Elce Edmund
Hirano Takashi
C Krotine Jeffrey Jr
F Rhodes Larry
L Goodall Brian
Jayaraman Saikumar
Mcdougal Chris
Sun Shenliang
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of TW200412472A publication Critical patent/TW200412472A/zh
Application granted granted Critical
Publication of TWI300167B publication Critical patent/TWI300167B/zh

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • C08G59/3218Carbocyclic compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C08G61/04Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
    • C08G61/06Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Materials For Photolithography (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Polymerisation Methods In General (AREA)
  • Silicon Polymers (AREA)
TW092118096A 2002-07-03 2003-07-02 Photosensitive compositions based on polycyclic polymers TWI300167B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US39372602P 2002-07-03 2002-07-03
US10/465,511 US7022790B2 (en) 2002-07-03 2003-06-19 Photosensitive compositions based on polycyclic polymers

Publications (2)

Publication Number Publication Date
TW200412472A TW200412472A (en) 2004-07-16
TWI300167B true TWI300167B (en) 2008-08-21

Family

ID=30118385

Family Applications (2)

Application Number Title Priority Date Filing Date
TW092118096A TWI300167B (en) 2002-07-03 2003-07-02 Photosensitive compositions based on polycyclic polymers
TW097115706A TWI398459B (zh) 2002-07-03 2003-07-02 以多環聚合物為主的光敏感性組成物(一)

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW097115706A TWI398459B (zh) 2002-07-03 2003-07-02 以多環聚合物為主的光敏感性組成物(一)

Country Status (11)

Country Link
US (2) US7022790B2 (enExample)
EP (1) EP1532486B1 (enExample)
JP (1) JP4623419B2 (enExample)
KR (1) KR100688632B1 (enExample)
CN (2) CN1666150A (enExample)
AT (1) ATE453135T1 (enExample)
AU (1) AU2003243013A1 (enExample)
DE (1) DE60330672D1 (enExample)
MY (1) MY142759A (enExample)
TW (2) TWI300167B (enExample)
WO (1) WO2004006020A1 (enExample)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7022790B2 (en) * 2002-07-03 2006-04-04 Sumitomo Bakelite Company, Ltd. Photosensitive compositions based on polycyclic polymers
US20060020068A1 (en) * 2004-07-07 2006-01-26 Edmund Elce Photosensitive compositions based on polycyclic polymers for low stress, high temperature films
US7501230B2 (en) * 2002-11-04 2009-03-10 Meagley Robert P Photoactive adhesion promoter
US6893985B2 (en) * 2003-03-31 2005-05-17 Intel Corporation UV-activated dielectric layer
ATE450813T1 (de) * 2004-05-17 2009-12-15 Fujifilm Corp Verfahren zur erzeugung eines musters
JP4759311B2 (ja) * 2004-05-17 2011-08-31 富士フイルム株式会社 パターン形成方法
JP2006096812A (ja) * 2004-09-28 2006-04-13 Sumitomo Bakelite Co Ltd 半導体表面保護膜用樹脂組成物、及びそれを用いた半導体装置
TW200628981A (en) * 2004-09-29 2006-08-16 Sumitomo Bakelite Co Semiconductor device
JP2006100562A (ja) * 2004-09-29 2006-04-13 Sumitomo Bakelite Co Ltd 半導体装置
JP4556598B2 (ja) * 2004-09-30 2010-10-06 住友ベークライト株式会社 半導体装置
JP4170277B2 (ja) * 2004-09-30 2008-10-22 住友ベークライト株式会社 感光性樹脂組成物および半導体装置
JP2006098949A (ja) * 2004-09-30 2006-04-13 Sumitomo Bakelite Co Ltd 半導体装置
JP2006124648A (ja) * 2004-10-01 2006-05-18 Sumitomo Bakelite Co Ltd 樹脂組成物、樹脂層、樹脂層付きキャリア材料および回路基板
KR100892204B1 (ko) * 2004-10-13 2009-04-07 스미토모 베이클리트 컴퍼니 리미티드 수광 장치
TW200619843A (en) * 2004-10-20 2006-06-16 Sumitomo Bakelite Co Semiconductor wafer and semiconductor device
KR100789247B1 (ko) * 2005-01-05 2008-01-02 주식회사 엘지화학 광반응성 중합체 및 이의 제조 방법
KR100655801B1 (ko) 2005-01-18 2006-12-08 삼성전자주식회사 포토레지스트 조성물 및 이를 이용한 포토레지스트 패턴형성 방법
EP1788434B2 (en) * 2005-11-18 2019-01-02 Agfa Nv Method of making a lithographic printing plate
US8207279B2 (en) * 2006-06-26 2012-06-26 Lg Chem, Ltd. Method for preparing norbornene monomer composition, norbornene polymer prepared therefrom, optical film comprising the norbornene polymer, and method for preparing the norbornene polymer
JP5040432B2 (ja) * 2007-05-15 2012-10-03 住友ベークライト株式会社 感光性樹脂組成物
KR101451802B1 (ko) * 2007-07-31 2014-10-16 삼성에스디아이 주식회사 글리시딜 에테르계 화합물을 채용한 유기전해액 및 리튬전지
US7906568B2 (en) * 2007-09-04 2011-03-15 General Electric Company Coupling agent composition and associated method
US8039543B2 (en) * 2007-09-04 2011-10-18 General Electric Company Composition comprising a coupling agent and a cycloolefin, the coupling agent comprising a reaction product of an epoxy-substituted cycloolefin and an aromatic amine
US8039544B2 (en) * 2007-09-04 2011-10-18 General Electric Company Coupling agent comprising a reaction product of an epoxy-substituted cycloolefin and an aromatic amine
US7994238B2 (en) * 2007-09-04 2011-08-09 General Electric Company Article and associated method
US9786576B2 (en) 2007-11-12 2017-10-10 Hitachi Chemical Company, Ltd Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device
US7902279B2 (en) * 2007-12-04 2011-03-08 General Electric Company Composition, article, and associated method
US7879963B2 (en) * 2007-12-18 2011-02-01 General Electric Company Composition, article, and associated method
US8609574B2 (en) * 2008-04-25 2013-12-17 Promerus Llc In situ olefin polymerization catalyst system
WO2010026988A1 (ja) 2008-09-04 2010-03-11 日立化成工業株式会社 ポジ型感光性樹脂組成物、レジストパターンの製造方法及び電子部品
CN103091987B (zh) 2008-12-26 2016-11-23 日立化成株式会社 正型感光性树脂组合物、抗蚀图形的制造方法、半导体装置以及电子器件
JP5656413B2 (ja) * 2009-01-30 2015-01-21 富士フイルム株式会社 ネガ型レジストパターン形成方法、それに用いられる現像液及びネガ型化学増幅型レジスト組成物、並びにレジストパターン
TWI430036B (zh) * 2009-04-20 2014-03-11 Asahi Kasei E Materials Corp Photosensitive resin laminate
US8753790B2 (en) * 2009-07-01 2014-06-17 Promerus, Llc Self-imageable film forming polymer, compositions thereof and devices and structures made therefrom
KR101238403B1 (ko) 2009-09-04 2013-02-28 주식회사 엘지화학 광 반응성기를 갖는 노보넨계 중합체를 포함하는 액정 배향용 조성물 및 이를 포함하는 광 배향 필름
US8580477B2 (en) * 2009-09-21 2013-11-12 Promerus Llc Aqueous base-developable negative-tone films based on functionalized norbornene polymers
WO2011105443A1 (ja) * 2010-02-25 2011-09-01 日立化成工業株式会社 ネガ型感光性樹脂組成物、層間絶縁膜及びその形成方法
CN102402137B (zh) * 2010-09-15 2014-04-09 无锡华润上华半导体有限公司 孔的光刻方法
US8829087B2 (en) * 2010-12-14 2014-09-09 Promerus, Llc Transparent layer forming polymer
JPWO2012165448A1 (ja) * 2011-06-01 2015-02-23 日本ゼオン株式会社 樹脂組成物および半導体素子基板
KR101364229B1 (ko) * 2012-12-20 2014-02-17 동우 화인켐 주식회사 감광성 수지 조성물 및 이로부터 제조되는 절연막
WO2015026445A1 (en) * 2013-08-21 2015-02-26 Applied Materials, Inc. Variable frequency microwave (vfm) processes and applications in semiconductor thin film fabrications
US20160311970A1 (en) * 2013-12-13 2016-10-27 Transfert Plus, Société En Commandite Insertion polynorbornene-based thermoset resins
WO2015141525A1 (ja) * 2014-03-20 2015-09-24 住友ベークライト株式会社 感光性樹脂組成物、および電子装置
JP6459192B2 (ja) * 2014-03-20 2019-01-30 住友ベークライト株式会社 感光性樹脂組成物
US10245562B2 (en) * 2014-08-15 2019-04-02 Promerus, Llc Pervaporation membranes derived from polycyclo-olefinic block copolymers
JP6550275B2 (ja) * 2015-06-15 2019-07-24 東京応化工業株式会社 ナノインプリント用組成物、硬化物、パターン形成方法及びパターンを含む物品
CN109313388B (zh) * 2016-06-14 2022-06-21 住友电木株式会社 负型感光性组合物
JP6558479B2 (ja) * 2018-07-18 2019-08-14 住友ベークライト株式会社 ポリマー、および感光性樹脂組成物
US12077627B2 (en) 2022-04-26 2024-09-03 Chevron Phillips Chemical Company Lp Aqueous methods for titanating a chromium/silica catalyst with an alkali metal
KR102515739B1 (ko) * 2022-12-07 2023-03-30 타코마테크놀러지 주식회사 감광성 수지 및 이를 포함하는 포토레지스트 조성물

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5468819A (en) 1993-11-16 1995-11-21 The B.F. Goodrich Company Process for making polymers containing a norbornene repeating unit by addition polymerization using an organo (nickel or palladium) complex
DE19509173B4 (de) * 1994-03-14 2005-06-16 Nippon Zeon Co., Ltd. Masse aus einem Epoxygruppen enthaltenden thermoplastischen Norbornenharz und ihre Verwendung
JP3588498B2 (ja) 1994-03-14 2004-11-10 日本ゼオン株式会社 エポキシ基を有する環状オレフィン系樹脂組成物および該樹脂組成物を用いた絶縁材料
US6294616B1 (en) * 1995-05-25 2001-09-25 B. F. Goodrich Company Blends and alloys of polycyclic polymers
US6232417B1 (en) 1996-03-07 2001-05-15 The B. F. Goodrich Company Photoresist compositions comprising polycyclic polymers with acid labile pendant groups
RU2194295C2 (ru) * 1996-03-07 2002-12-10 З Би. Эф. Гудрич Кампэни Фоторезистная композиция и полимер
US6121340A (en) * 1996-11-04 2000-09-19 The B. F. Goodrich Company Photodefinable dielectric compositions comprising polycyclic polymers
JP3971476B2 (ja) 1996-11-29 2007-09-05 日本ゼオン株式会社 エポキシ基含有ノルボルネン系付加型共重合体、その製造方法、及び架橋性重合体組成物
US5712407A (en) 1997-01-14 1998-01-27 Ppg Industries, Inc. Method for the preparation of alpha-chlorinated chloroformates
WO1999003903A1 (en) * 1997-07-18 1999-01-28 Nippon Zeon Co., Ltd. Modified cycloolefin addition polymer and curable resin composition containing the same
US5879592A (en) 1997-12-10 1999-03-09 Ppg Industries, Inc. Water soluble photochromic compounds, compositions and optical elements comprising the compounds
JP2002519487A (ja) * 1998-07-01 2002-07-02 ザ ビー.エフ.グッドリッチ カンパニー 多環式共重合体組成物
CN1249105C (zh) * 1998-10-05 2006-04-05 普罗米鲁斯有限责任公司 环烯烃聚合催化剂及聚合方法
DE19921913C2 (de) * 1999-05-12 2001-06-13 Groz Beckert Kg Nähmaschinennadel mit schlankem Öhr
US7022790B2 (en) 2002-07-03 2006-04-04 Sumitomo Bakelite Company, Ltd. Photosensitive compositions based on polycyclic polymers

Also Published As

Publication number Publication date
MY142759A (en) 2010-12-31
DE60330672D1 (de) 2010-02-04
JP2005531680A (ja) 2005-10-20
CN1666150A (zh) 2005-09-07
KR20050033565A (ko) 2005-04-12
WO2004006020A1 (en) 2004-01-15
EP1532486B1 (en) 2009-12-23
ATE453135T1 (de) 2010-01-15
AU2003243013A1 (en) 2004-01-23
US20060167197A1 (en) 2006-07-27
US7022790B2 (en) 2006-04-04
TWI398459B (zh) 2013-06-11
CN102298265A (zh) 2011-12-28
US8114948B2 (en) 2012-02-14
KR100688632B1 (ko) 2007-03-02
TW200412472A (en) 2004-07-16
EP1532486A1 (en) 2005-05-25
CN102298265B (zh) 2014-04-16
US20040039153A1 (en) 2004-02-26
TW200835710A (en) 2008-09-01
JP4623419B2 (ja) 2011-02-02

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