JP4623419B2 - 多環式コポリマーに基づく感光性組成物 - Google Patents

多環式コポリマーに基づく感光性組成物 Download PDF

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Publication number
JP4623419B2
JP4623419B2 JP2004519232A JP2004519232A JP4623419B2 JP 4623419 B2 JP4623419 B2 JP 4623419B2 JP 2004519232 A JP2004519232 A JP 2004519232A JP 2004519232 A JP2004519232 A JP 2004519232A JP 4623419 B2 JP4623419 B2 JP 4623419B2
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Prior art keywords
polymer
composition
photosensitive
wafer
solvent
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Expired - Fee Related
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JP2004519232A
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English (en)
Japanese (ja)
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JP2005531680A5 (enExample
JP2005531680A (ja
Inventor
エルセ,エドムンド
孝 平野
クロティン,ジェフリー・シー,ジュニア
ローズ,ラリー・エフ
グッドール,ブライアン・エル
ジャヤラマン,サイクマール
マクダガル,クリス
サン,シェンライアン
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Publication of JP2005531680A5 publication Critical patent/JP2005531680A5/ja
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • C08G59/3218Carbocyclic compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C08G61/04Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
    • C08G61/06Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Materials For Photolithography (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Polymerisation Methods In General (AREA)
  • Silicon Polymers (AREA)
JP2004519232A 2002-07-03 2003-07-02 多環式コポリマーに基づく感光性組成物 Expired - Fee Related JP4623419B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US39372602P 2002-07-03 2002-07-03
US10/465,511 US7022790B2 (en) 2002-07-03 2003-06-19 Photosensitive compositions based on polycyclic polymers
PCT/JP2003/008407 WO2004006020A1 (en) 2002-07-03 2003-07-02 Photosensitive compositions based on polycyclic polymers

Publications (3)

Publication Number Publication Date
JP2005531680A JP2005531680A (ja) 2005-10-20
JP2005531680A5 JP2005531680A5 (enExample) 2006-08-03
JP4623419B2 true JP4623419B2 (ja) 2011-02-02

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Family Applications (1)

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JP2004519232A Expired - Fee Related JP4623419B2 (ja) 2002-07-03 2003-07-02 多環式コポリマーに基づく感光性組成物

Country Status (11)

Country Link
US (2) US7022790B2 (enExample)
EP (1) EP1532486B1 (enExample)
JP (1) JP4623419B2 (enExample)
KR (1) KR100688632B1 (enExample)
CN (2) CN1666150A (enExample)
AT (1) ATE453135T1 (enExample)
AU (1) AU2003243013A1 (enExample)
DE (1) DE60330672D1 (enExample)
MY (1) MY142759A (enExample)
TW (2) TWI300167B (enExample)
WO (1) WO2004006020A1 (enExample)

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JP2006098949A (ja) * 2004-09-30 2006-04-13 Sumitomo Bakelite Co Ltd 半導体装置
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Also Published As

Publication number Publication date
MY142759A (en) 2010-12-31
DE60330672D1 (de) 2010-02-04
JP2005531680A (ja) 2005-10-20
CN1666150A (zh) 2005-09-07
KR20050033565A (ko) 2005-04-12
WO2004006020A1 (en) 2004-01-15
EP1532486B1 (en) 2009-12-23
ATE453135T1 (de) 2010-01-15
AU2003243013A1 (en) 2004-01-23
US20060167197A1 (en) 2006-07-27
US7022790B2 (en) 2006-04-04
TWI398459B (zh) 2013-06-11
CN102298265A (zh) 2011-12-28
US8114948B2 (en) 2012-02-14
KR100688632B1 (ko) 2007-03-02
TW200412472A (en) 2004-07-16
TWI300167B (en) 2008-08-21
EP1532486A1 (en) 2005-05-25
CN102298265B (zh) 2014-04-16
US20040039153A1 (en) 2004-02-26
TW200835710A (en) 2008-09-01

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