CN1577798A - 制造半导体器件的方法和使用该方法的半导体器件制造装置 - Google Patents
制造半导体器件的方法和使用该方法的半导体器件制造装置 Download PDFInfo
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- CN1577798A CN1577798A CNA2004100597729A CN200410059772A CN1577798A CN 1577798 A CN1577798 A CN 1577798A CN A2004100597729 A CNA2004100597729 A CN A2004100597729A CN 200410059772 A CN200410059772 A CN 200410059772A CN 1577798 A CN1577798 A CN 1577798A
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Dicing (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims (17)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP194955/2003 | 2003-07-10 | ||
JP2003194955A JP4796271B2 (ja) | 2003-07-10 | 2003-07-10 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1577798A true CN1577798A (zh) | 2005-02-09 |
CN100370595C CN100370595C (zh) | 2008-02-20 |
Family
ID=33562535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100597729A Expired - Fee Related CN100370595C (zh) | 2003-07-10 | 2004-06-17 | 制造半导体器件的方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7081374B2 (zh) |
JP (1) | JP4796271B2 (zh) |
KR (1) | KR20050007144A (zh) |
CN (1) | CN100370595C (zh) |
TW (2) | TWI358106B (zh) |
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CN103111698A (zh) * | 2011-11-16 | 2013-05-22 | 台湾积体电路制造股份有限公司 | 在接合工艺中实施回流的方法 |
CN104347437A (zh) * | 2013-07-26 | 2015-02-11 | 瑞萨电子株式会社 | 制造半导体器件的方法 |
CN105321864A (zh) * | 2014-07-17 | 2016-02-10 | 东和株式会社 | 基板切断装置及基板切断方法 |
CN107221509A (zh) * | 2017-06-20 | 2017-09-29 | 南京矽邦半导体有限公司 | 一种识别单颗产品在qfn框架上位置信息的方法 |
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WO2006100765A1 (ja) * | 2005-03-23 | 2006-09-28 | Renesas Technology Corp. | 半導体装置の製造方法及び圧縮成形装置 |
JP2006351908A (ja) * | 2005-06-17 | 2006-12-28 | Renesas Technology Corp | 半導体装置の製造方法 |
JP4694900B2 (ja) * | 2005-06-28 | 2011-06-08 | 株式会社ディスコ | レーザー加工方法 |
JP4813855B2 (ja) * | 2005-09-12 | 2011-11-09 | 株式会社ディスコ | 切削装置および加工方法 |
NL1030004C2 (nl) * | 2005-09-21 | 2007-03-22 | Fico Singulation B V | Inrichting en werkwijze voor het separeren van elektronische componenten. |
US7799612B2 (en) * | 2007-06-25 | 2010-09-21 | Spansion Llc | Process applying die attach film to singulated die |
JP5192790B2 (ja) * | 2007-11-28 | 2013-05-08 | Towa株式会社 | 基板の切断方法及び装置 |
WO2010070964A1 (ja) * | 2008-12-16 | 2010-06-24 | 株式会社村田製作所 | 回路モジュール及びその管理方法 |
US8289388B2 (en) * | 2009-05-14 | 2012-10-16 | Asm Assembly Automation Ltd | Alignment method for singulation system |
US8844123B2 (en) * | 2009-12-03 | 2014-09-30 | Chin-Chi Yang | Method of manufacturing a hollow surface mount type electronic component |
KR101414719B1 (ko) * | 2010-07-12 | 2014-08-07 | 한미반도체 주식회사 | 반도체 패키지 집합체 정렬방법 |
KR101247341B1 (ko) * | 2011-07-11 | 2013-03-26 | 에스티에스반도체통신 주식회사 | 반도체 패키지의 싱귤레이션 시스템 및 싱귤레이션 방법 |
US8987058B2 (en) * | 2013-03-12 | 2015-03-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for wafer separation |
US8853002B2 (en) | 2013-01-04 | 2014-10-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods for metal bump die assembly |
JP6465540B2 (ja) * | 2013-07-09 | 2019-02-06 | キヤノン株式会社 | 形成方法及び製造方法 |
JP6218511B2 (ja) * | 2013-09-02 | 2017-10-25 | Towa株式会社 | 切断装置及び切断方法 |
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US9209149B2 (en) | 2013-11-14 | 2015-12-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Bump-on-trace structures with high assembly yield |
KR101515716B1 (ko) * | 2013-11-25 | 2015-04-27 | 세메스 주식회사 | 반도체 패키지 제조 장치 |
JP6257291B2 (ja) * | 2013-12-04 | 2018-01-10 | 株式会社ディスコ | パッケージ基板の加工方法 |
JP6143668B2 (ja) * | 2013-12-28 | 2017-06-07 | Towa株式会社 | 電子部品製造用の切断装置及び切断方法 |
JP6333650B2 (ja) * | 2014-07-18 | 2018-05-30 | Towa株式会社 | 切断装置及び切断方法 |
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JPH11274357A (ja) * | 1998-03-20 | 1999-10-08 | Sony Corp | 電子部品の分割方法および分割装置 |
JP3865184B2 (ja) * | 1999-04-22 | 2007-01-10 | 富士通株式会社 | 半導体装置の製造方法 |
JP3434740B2 (ja) * | 1999-06-30 | 2003-08-11 | Necエレクトロニクス株式会社 | 固体撮像装置 |
US6400173B1 (en) * | 1999-11-19 | 2002-06-04 | Hitachi, Ltd. | Test system and manufacturing of semiconductor device |
JP2002043356A (ja) * | 2000-07-31 | 2002-02-08 | Nec Corp | 半導体ウェーハ、半導体装置及びその製造方法 |
JP3619773B2 (ja) * | 2000-12-20 | 2005-02-16 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
JP2002246336A (ja) * | 2001-02-19 | 2002-08-30 | Matsushita Electric Ind Co Ltd | 電子装置およびそのダイシング方法 |
US6444501B1 (en) * | 2001-06-12 | 2002-09-03 | Micron Technology, Inc. | Two stage transfer molding method to encapsulate MMC module |
JP3881888B2 (ja) * | 2001-12-27 | 2007-02-14 | セイコーエプソン株式会社 | 光デバイスの製造方法 |
US6777265B2 (en) * | 2002-04-29 | 2004-08-17 | Advanced Interconnect Technologies Limited | Partially patterned lead frames and methods of making and using the same in semiconductor packaging |
KR100476558B1 (ko) * | 2002-05-27 | 2005-03-17 | 삼성전기주식회사 | 이미지 센서 모듈 및 그 제작 공정 |
JP4256115B2 (ja) * | 2002-05-28 | 2009-04-22 | 富士通マイクロエレクトロニクス株式会社 | マーク認識方法及び半導体装置の製造方法 |
JP2004055860A (ja) * | 2002-07-22 | 2004-02-19 | Renesas Technology Corp | 半導体装置の製造方法 |
-
2003
- 2003-07-10 JP JP2003194955A patent/JP4796271B2/ja not_active Expired - Lifetime
-
2004
- 2004-04-21 TW TW093111147A patent/TWI358106B/zh not_active IP Right Cessation
- 2004-04-21 TW TW100104680A patent/TWI426582B/zh not_active IP Right Cessation
- 2004-06-17 CN CNB2004100597729A patent/CN100370595C/zh not_active Expired - Fee Related
- 2004-06-29 US US10/878,464 patent/US7081374B2/en not_active Expired - Lifetime
- 2004-07-07 KR KR1020040052569A patent/KR20050007144A/ko not_active Application Discontinuation
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103111698A (zh) * | 2011-11-16 | 2013-05-22 | 台湾积体电路制造股份有限公司 | 在接合工艺中实施回流的方法 |
CN103111698B (zh) * | 2011-11-16 | 2016-08-03 | 台湾积体电路制造股份有限公司 | 用于形成半导体封装件的方法 |
CN104347437A (zh) * | 2013-07-26 | 2015-02-11 | 瑞萨电子株式会社 | 制造半导体器件的方法 |
US10032745B2 (en) | 2013-07-26 | 2018-07-24 | Renesas Electronics Corporation | Method of manufacturing semiconductor device |
US10192851B2 (en) | 2013-07-26 | 2019-01-29 | Renesas Electronics Corporation | Method of manufacturing semiconductor device |
CN105321864A (zh) * | 2014-07-17 | 2016-02-10 | 东和株式会社 | 基板切断装置及基板切断方法 |
CN105321864B (zh) * | 2014-07-17 | 2018-01-16 | 东和株式会社 | 基板切断装置及基板切断方法 |
CN107221509A (zh) * | 2017-06-20 | 2017-09-29 | 南京矽邦半导体有限公司 | 一种识别单颗产品在qfn框架上位置信息的方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20050007144A (ko) | 2005-01-17 |
JP4796271B2 (ja) | 2011-10-19 |
CN100370595C (zh) | 2008-02-20 |
US7081374B2 (en) | 2006-07-25 |
TWI358106B (en) | 2012-02-11 |
JP2005032910A (ja) | 2005-02-03 |
TW201125077A (en) | 2011-07-16 |
US20050009237A1 (en) | 2005-01-13 |
TWI426582B (zh) | 2014-02-11 |
TW200503169A (en) | 2005-01-16 |
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