CN1298203C - 电路装置 - Google Patents
电路装置 Download PDFInfo
- Publication number
- CN1298203C CN1298203C CNB2003101197080A CN200310119708A CN1298203C CN 1298203 C CN1298203 C CN 1298203C CN B2003101197080 A CNB2003101197080 A CN B2003101197080A CN 200310119708 A CN200310119708 A CN 200310119708A CN 1298203 C CN1298203 C CN 1298203C
- Authority
- CN
- China
- Prior art keywords
- conductive pattern
- circuit
- circuit arrangement
- circuit element
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP350774/02 | 2002-12-03 | ||
JP2002350774A JP2004186362A (ja) | 2002-12-03 | 2002-12-03 | 回路装置 |
JP350774/2002 | 2002-12-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1505459A CN1505459A (zh) | 2004-06-16 |
CN1298203C true CN1298203C (zh) | 2007-01-31 |
Family
ID=32752873
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2003101197080A Expired - Fee Related CN1298203C (zh) | 2002-12-03 | 2003-12-03 | 电路装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2004186362A (ja) |
KR (1) | KR100715409B1 (ja) |
CN (1) | CN1298203C (ja) |
TW (1) | TW595274B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006173489A (ja) * | 2004-12-17 | 2006-06-29 | Tokai Rika Co Ltd | 電子部品実装構造 |
JP2008053319A (ja) * | 2006-08-22 | 2008-03-06 | Nec Electronics Corp | 半導体装置 |
JP4958526B2 (ja) * | 2006-11-30 | 2012-06-20 | 三洋電機株式会社 | 回路装置および回路モジュール |
JP4948160B2 (ja) * | 2006-12-29 | 2012-06-06 | 三洋電機株式会社 | 回路モジュール |
JP4975655B2 (ja) * | 2007-02-01 | 2012-07-11 | 日本特殊陶業株式会社 | 配線基板、半導体パッケージ |
WO2011034137A1 (ja) * | 2009-09-16 | 2011-03-24 | 株式会社村田製作所 | 電子部品内蔵モジュール |
TWI795644B (zh) * | 2020-06-02 | 2023-03-11 | 大陸商上海兆芯集成電路有限公司 | 電子總成 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0870024A (ja) * | 1994-08-29 | 1996-03-12 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JP2001077232A (ja) * | 1999-09-06 | 2001-03-23 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
CN1315823A (zh) * | 2000-03-08 | 2001-10-03 | 三洋电机株式会社 | 电路装置的制造方法及电路装置 |
CN1348205A (zh) * | 2000-10-02 | 2002-05-08 | 三洋电机株式会社 | 电路装置的制造方法 |
US6445592B1 (en) * | 1993-08-30 | 2002-09-03 | Temic Telefunken Microelectronic Gmbh | Electronic assembly |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR970001891B1 (ko) * | 1991-02-08 | 1997-02-18 | 가부시키가이샤 도시바 | 반도체장치와 반도체장치의 제조방법 |
CN1265451C (zh) * | 2000-09-06 | 2006-07-19 | 三洋电机株式会社 | 半导体装置及其制造方法 |
JP3945968B2 (ja) * | 2000-09-06 | 2007-07-18 | 三洋電機株式会社 | 半導体装置およびその製造方法 |
-
2002
- 2002-12-03 JP JP2002350774A patent/JP2004186362A/ja active Pending
-
2003
- 2003-08-15 TW TW092122459A patent/TW595274B/zh not_active IP Right Cessation
- 2003-11-26 KR KR1020030084298A patent/KR100715409B1/ko not_active IP Right Cessation
- 2003-12-03 CN CNB2003101197080A patent/CN1298203C/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6445592B1 (en) * | 1993-08-30 | 2002-09-03 | Temic Telefunken Microelectronic Gmbh | Electronic assembly |
JPH0870024A (ja) * | 1994-08-29 | 1996-03-12 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JP2001077232A (ja) * | 1999-09-06 | 2001-03-23 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
CN1315823A (zh) * | 2000-03-08 | 2001-10-03 | 三洋电机株式会社 | 电路装置的制造方法及电路装置 |
CN1348205A (zh) * | 2000-10-02 | 2002-05-08 | 三洋电机株式会社 | 电路装置的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW595274B (en) | 2004-06-21 |
TW200410604A (en) | 2004-06-16 |
JP2004186362A (ja) | 2004-07-02 |
KR20040048818A (ko) | 2004-06-10 |
CN1505459A (zh) | 2004-06-16 |
KR100715409B1 (ko) | 2007-05-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070131 Termination date: 20121203 |