CN211879388U - 感光模块 - Google Patents

感光模块 Download PDF

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Publication number
CN211879388U
CN211879388U CN202020574521.9U CN202020574521U CN211879388U CN 211879388 U CN211879388 U CN 211879388U CN 202020574521 U CN202020574521 U CN 202020574521U CN 211879388 U CN211879388 U CN 211879388U
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China
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photosensitive
integrated package
package substrate
substrate
module
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CN202020574521.9U
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Inventor
徐辰二
宋欣忠
吴基福
吴晧宇
深井勉
吴铭洪
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TDK Taiwan Corp
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TDK Taiwan Corp
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    • G02B27/646—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image compensating for small deviations, e.g. due to vibration or shake
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Abstract

本公开提供了一种感光模块，包含一基底、一整合封装基板以及一感光元件。整合封装基板是连接于基底，整合封装基板具有多个第一电子元件，并且这些第一电子元件被包覆于整合封装基板内且无外露。感光元件是连接于基底，并且感光元件配置以接受沿着一光轴前进的一光线。

Description

感光模块
技术领域
本公开涉及一种感光模块，尤其涉及一种利用内埋式基板技术的感光模块。
背景技术
随着科技的发展，现今许多电子装置(例如智能手机)皆具有照相或录影的功能。通过设置于电子装置上的摄像模块，使用者可以操作电子装置来提取各式各样的照片。
一般而言，摄像模块中包含有一感光模块，并且感光模块可以不同封装技术制成。随着半导体封装制造技术的进步，微电子组件变得更小，而这些组件内的电路变得越来越密集。为了使微电子组件的尺寸变得更小，微电子组件中的各个元件的封装及组装在线路设计上必须变得更加紧密，为了满足更小的空间与更高密度的要求，必须对电子组件上的所有构件进行最佳化设计。然而，高密度的感光模块也会产生较高的热量。
因此，如何设计出可以有效地提高散热效率的感光模块，便是现今值得探讨与解决的课题。
实用新型内容
有鉴于此，本公开的目的在于提出一种感光模块，以解决上述的问题。
本公开提供了一种感光模块，包含一基底、一整合封装基板以及一感光元件。整合封装基板是连接于基底，整合封装基板具有多个第一电子元件，并且这些第一电子元件被包覆于整合封装基板内且无外露。感光元件是连接于基底，并且感光元件配置以接受沿着一光轴前进的一光线。
根据本公开一些实施例，整合封装基板包括一第三绝缘层、一第四绝缘层、一中间层、一第一电路元件、以及一第二电路元件。中间层设置于第三、第四绝缘层之间，并且这些第一电子元件设置于中间层之中。第一电路元件设置于第三绝缘层与中间层之间。第二电路元件设置于中间层与第四绝缘层之间，其中中间层与第三绝缘层或第四绝缘层具有不同材质。
根据本公开一些实施例，感光模块还包含一第二电子元件，设置于整合封装基板的一表面上。
根据本公开一些实施例，感光模块还包含一散热结构，对应感光元件或整合封装基板，并且散热结构具有金属材质。
根据本公开一些实施例，感光模块还包含一透明元件以及一感光元件保持框架。透明元件对应感光元件。感光元件保持框架连接透明元件，其中透明元件与感光元件具有一间隙，并且感光元件保持框架直接设置于整合封装基板。
根据本公开一些实施例，当沿着垂直于光轴的方向观察时，感光元件位于感光元件保持框架与整合封装基板之间。
根据本公开一些实施例，感光模块还包含一另一整合封装基板，并且透明元件连接于感光元件保持框架以及另一整合封装基板之间。
根据本公开一些实施例，感光模块还包含：一电路组件、一电性连接部、以及一补强材料。整合封装基板经由电性连接部电性连接电路组件。补强材料直接接触电性连接部、整合封装基板以及电路组件。
根据本公开一些实施例，感光模块还包含一第二电子元件，第二电子元件与感光元件设置于整合封装基板的同一侧面。
根据本公开一些实施例，感光模块还包含一第二电子元件，第二电子元件与感光元件分别设置于整合封装基板的不同侧。
根据本公开一些实施例，当沿着垂直光轴的方向观察时，至少一部分的感光元件重叠于整合封装基板。
根据本公开一些实施例，感光模块还包含一透明元件，设置于整合封装基板。
根据本公开一些实施例，当沿着垂直光轴的方向观察时，至少一部分的整合封装基板重叠于透明元件以及感光元件。
根据本公开一些实施例，感光模块还包含一散热结构，直接接触感光元件以及基底，并且当沿着光轴的方向观察时，散热结构的面积小于或等于感光元件的面积。
根据本公开一些实施例，基底包含一本体以及一电性连接组件，并且感光元件通过电性连接组件电性连接于整合封装基板。
根据本公开一些实施例，电性连接组件贯穿基底的本体，并且电性连接组件电性独立于本体。
根据本公开一些实施例，感光模块还包含一散热结构，直接接触感光元件以及基底，并且当沿着光轴的方向观察时，散热结构的面积小于或等于感光元件的面积。
根据本公开一些实施例，整合封装基板与感光元件分别设置于基底的相反侧。
根据本公开一些实施例，感光元件经由基底电性连接整合封装基板。
根据本公开一些实施例，当沿着垂直光轴的方向观察时，基底、整合封装基板以及感光元件互相不重叠。
本公开提供一种感光模块，可设置于各种电子装置中。感光模块可包含一基底、一电路组件、一整合封装基板、以及一感光元件。感光元件可电性连接于电路组件或整合封装基板。整合封装基板可为内埋式基板，具有多个电子元件，包覆于整合封装基板内而无外露。基于整合封装基板的配置，感光模块可以设置更多的电子元件并且同时具有更小的体积。
基底可由高导热系数的材料制成，以提升感光模块整体的散热效果。再者，在一些实施例中，感光模块可还包含多个散热结构，连接感光元件与基底。基于散热结构的配置，可进一步提升感光模块的散热效率。
附图说明
本公开可通过之后的详细说明并配合图示而得到清楚的了解。要强调的是，按照业界的标准做法，各种特征并没有按比例绘制，并且仅用于说明的目的。事实上，为了能够清楚的说明，因此各种特征的尺寸可能会任意地放大或者缩小。
图1为根据本公开一实施例的一感光模块的剖面结构示意图。
图2为根据本公开一些实施例的整合封装基板的放大结构示意图。
图3为根据本公开另一实施例的一感光模块的剖面结构示意图。
图4为根据本公开另一实施例的一感光模块的剖面结构示意图。
图5为根据本公开另一实施例的一感光模块的剖面结构示意图。
附图标记如下：
100、200、300、400:感光模块
102:基底
1020:本体
1021:电性连接组件
103:电路组件
1030:绝缘结构层
1031:电路导线
1033:第一绝缘层
1034:第二绝缘层
103A:电路组件
103B:电路组件
104:感光元件保持框架
1041:开口
110:整合封装基板
1101:第三绝缘层
1102:第四绝缘层
1103:中间层
1105:封装层
110A:第一整合封装基板
110B:第二整合封装基板
110H:贯孔
110S:表面
115:第一电子元件
117:电子单元
120:感光元件
121:引线
125:透明元件
135:补强材料
155:第二电子元件
AS:容置空间
CE1:第一电路元件
CE2:第二电路元件
GP:间隙
HD1:第一散热结构
HD2:第二散热结构
HD3:第三散热结构
HD4:第四散热结构
HE1:第一导热元件
HE2:第二导热元件
HE3:第三导热元件
O:光轴
SD:焊锡
SDS:侧空间
具体实施方式
为了让本公开的目的、特征及优点能更明显易懂，下文特举实施例，并配合所附图示做详细说明。其中，实施例中的各元件的配置为说明之用，并非用以限制本公开。且实施例中附图标号的部分重复，为了简化说明，并非意指不同实施例之间的关联性。以下实施例中所提到的方向用语，例如：上、下、左、右、前或后等，仅是参考附加附图的方向。因此，使用的方向用语是用来说明并非用来限制本公开。
此外，实施例中可能使用相对性的用语，例如“较低”或“底部”及“较高”或“顶部”，以描述图示的一个元件对于另一元件的相对关系。能理解的是，如果将图示的装置翻转使其上下颠倒，则所叙述在“较低”侧的元件将会成为在“较高”侧的元件。
必需了解的是，为特别描述或图示的元件可以与本领域技术人员所熟知的各种形式存在。此外，当某层在其它层或基板“上”时，有可能是指“直接”在其它层或基板上，或指某层在其它层或基板上，或指其它层或基板之间夹设其它层。
在此，“约”、“大约”的用语通常表示在一给定值或范围的20％之内，较佳是10％之内，且更佳是5％之内。在此给定的数量为大约的数量，意即在没有特定说明的情况下，仍可隐含“约”、“大约”的含义。
请参考图1，图1为根据本公开一实施例的一感光模块100的剖面结构示意图。感光模块100可设置于各种电子装置中，例如笔记本电脑的摄像头、平板电脑的镜头或者智能手机的镜头中。感光模块100配置以接收电子装置外部的光线后产生一或多个数字图像信号。
于此实施例中，如图1所示，感光模块100可包含一基底102、一电路组件103、一感光元件保持框架104、一整合封装基板110、一感光元件120以及一透明元件125。基底102是配置以承载电路组件103、整合封装基板110以及感光元件120。于此实施例中，基底102可由金属材料制成，但不限于此。具体而言，基底102可由高导热系数的材料制成。
电路组件103是固定地设置于基底102上，并且电路组件103可为一印刷电路板(print circuit board，PCB)，但不限于此。电路组件103可包含一绝缘结构层1030以及多个电路导线1031，并且电路导线1031是设置于绝缘结构层1030内。这些电路导线1031配置以电性连接于整合封装基板110或外部的电子元件。绝缘结构层1030可包含一第一绝缘层1033以及一第二绝缘层1034，并且电路导线1031是设置于第一绝缘层1033与第二绝缘层1034之间。
感光元件保持框架104是固定地设置于电路组件103上，例如用胶水或焊锡，并且感光元件保持框架104具有一开口1041，对应感光元件120。透明元件125是设置于感光元件保持框架104上并覆盖开口1041，以形成封闭的一容置空间AS，用以容置整合封装基板110以及感光元件120。透明元件125可为一滤光片，例如可过滤红外光。
整合封装基板110是设置于电路组件103上，并且感光模块100还包含有多个电性连接部，电性连接部可为一焊锡SD。整合封装基板110是经由焊锡SD电性连接于电路组件103，例如通过表面粘着技术(Surface-mount technology，SMT)。表面粘着技术例如可为球栅阵列(ball grid array，BGA)封装技术。如图1所示，整合封装基板110通过多个焊锡SD连接于电路导线1031。
再者，感光模块100可还包含一补强材料135，直接接触电性连接部(焊锡SD)、整合封装基板110以及电路组件103。补强材料135可为不导电的接着剂或是导热胶水，但不限于此。在一些实施例中，补强材料135可与第二绝缘层1034一体成形，例如由聚合材料(polymer)制成。
整合封装基板110可为一内埋式基板(Semiconductor Embedded Substrate，SESUB)，但不限于此。整合封装基板110可具有多个第一电子元件115，这些第一电子元件115可为各种电子元件，例如集成电路芯片、电容、电阻、感测器等。值得注意的是，这些第一电子元件115是包覆于整合封装基板110的本体内而无外露。
感光元件120设置于整合封装基板110上并且通过多条引线121(lead wire)电性连接于整合封装基板110。感光元件120是配置以接受沿着一光轴O前进的一光线，以产生数字图像信号。
感光模块100可包含多个散热结构以及导热元件，对应感光元件120或整合封装基板110，导热元件可包含高导热系数的接着材料(例如银胶或氮化铝等)，并且散热结构可具有金属材质。如图1所示，一第一导热元件HE1是设置于感光元件120的底部，并且第一散热结构HD1是连接于第一导热元件HE1与基底102。具体而言，第一散热结构HD1是贯穿整合封装基板110、补强材料135以及电路组件103而连接于基底102，并且第一散热结构HD1电性独立于整合封装基板110。
如图1所示，第二散热结构HD2是连接于第二导热元件HE2，第二散热结构HD2是内嵌于整合封装基板110中，并且第二散热结构HD2并未贯穿整合封装基板110。第三散热结构HD3是连接于第三导热元件HE3以及电路组件103，而第三散热结构HD3并未贯穿电路组件103。另外，第四散热结构HD4是内嵌于电路组件103中，并且由于绝缘结构层1030的配置，第四散热结构HD4电性独立于电路导线1031。
基于上述散热结构以及导热元件的配置，可以提升感光元件120的散热效率，以提升感光元件120产生数字图像信号的稳定性。
值得注意的是，上述散热结构是电性独立于电路导线1031。另外，在一些实施例中，导热元件可以省略，意即感光元件120是可通过第一散热结构HD1连接于基底102。再者，整合封装基板110也通过第一散热结构HD1连接于基底102。
接着，请参考图2，图2为根据本公开一些实施例的整合封装基板110的放大结构示意图。于此实施例中，整合封装基板110包含一第三绝缘层1101、一第四绝缘层1102、一中间层1103、一第一电路元件CE1、以及一第二电路元件CE2。
中间层1103是设置于第三绝缘层1101与第四绝缘层1102之间，并且第一电子元件115是设置于中间层1103之中。第一电路元件CE1是设置于第三绝缘层1101与中间层1103之间，第二电路元件CE2是设置于中间层1103与第四绝缘层1102之间，并且中间层1103与第三绝缘层1101或第四绝缘层1102具有不同材质。举例来说，中间层1103的材质比第三绝缘层1101以及第四绝缘层1102的材质软。
第一电路元件CE1与第二电路元件CE2可为金属垫，通过贯孔110H彼此连接。另外，第三绝缘层1101上可设置有多个电子单元117(例如集成电路芯片)，并且整合封装基板110还包含一封装层1105，包覆这些电子单元117以避免其外露。电子单元117可通过多个贯孔110H、第一电路元件CE1以及第二电路元件CE2电性连接于焊锡SD。
请再回到图1。于此实施例中，感光模块100还包含一第二电子元件155，设置于整合封装基板110的一表面110S上。值得注意的是，第二电子元件155与感光元件120是设置于整合封装基板110的同一侧面。
请参考图3，图3为根据本公开另一实施例的一感光模块200的剖面结构示意图。感光模块200与感光模块100的结构相似，并且相同的元件在此便不再赘述。于此实施例中，感光元件保持框架104是设置在整合封装基板110的表面110S上。
基于上述的结构配置，可以增加感光模块200的利用空间。举例来说，如图3所示，当感光模块200连接于一镜头驱动机构(图中未表示)时，感光元件保持框架104周围的至少一侧空间SDS可以设置镜头驱动机构的元件，以增加空间利用的有效率。
请参考图4，图4为根据本公开另一实施例的一感光模块300的剖面结构示意图。于此实施例中，感光模块300包含一第一整合封装基板110A以及一第二整合封装基板110B，设置于感光元件120的相反两侧。
感光元件保持框架104是直接设置于第一整合封装基板110A上并且连接于透明元件125的一端，而透明元件125的另一端是设置于第二整合封装基板110B上。意即，透明元件125连接于感光元件保持框架104以及第二整合封装基板110B之间。
于此实施例中，透明元件125与感光元件120具有一间隙GP。具体而言，第一整合封装基板110A、第二整合封装基板110B、感光元件保持框架104以及透明元件125形成封闭的容置空间AS，并且感光元件120是设置在容置空间AS内。
当沿着垂直于光轴O的方向观察时(例如X轴方向)，感光元件120位于感光元件保持框架104与第二整合封装基板110B之间。当沿着垂直光轴O的方向观察时(例如X轴方向)，至少一部分的感光元件120重叠于第一整合封装基板110A或第二整合封装基板110B。再者，当沿着垂直光轴O的方向观察时，至少一部分的第二整合封装基板110B重叠于透明元件125以及感光元件120。
另外，如图4所示，感光模块300包含一散热结构(第一散热结构HD1)，直接接触感光元件120以及基底102，并且当沿着光轴O的方向观察时，第一散热结构HD1的面积是略小于或等于感光元件120的面积。举例来说，第一散热结构HD1的面积可为感光元件120的80～100％，因此可以增加感光元件120散热的效率。
请参考图5，图5为根据本公开另一实施例的一感光模块400的剖面结构示意图。于此实施例中，整合封装基板110与感光元件120是分别设置于基底102的相反侧。再者，第二电子元件155与感光元件120是分别设置于整合封装基板110的不同侧。
于此实施例中，感光模块400包含有二个电路组件(电路组件103A、103B)，设置于基底102的相反侧，感光元件120设置于电路组件103A上，而整合封装基板110设置于电路组件103B的底部。
于此实施例中，感光元件120是经由基底102电性连接整合封装基板110。具体而言，基底102还包含一本体1020以及至少一电性连接组件1021，并且感光元件120是通过电路组件103A、电性连接组件1021以及电路组件103B而电性连接于整合封装基板110。
值得注意的是，电性连接组件1021是贯穿基底102的本体1020，并且电性连接组件1021电性独立于基底102的本体1020。另外，当沿着垂直光轴O的方向观察时(例如X轴方向)，基底102、整合封装基板110以及感光元件120互相不重叠。
相似于感光模块300，感光模块400的第一散热结构HD1也直接接触感光元件120以及基底102，并且当沿着光轴O的方向观察时，第一散热结构HD1的面积小于或等于感光元件120的面积。
本公开提供一种感光模块，可设置于各种电子装置中。感光模块可包含一基底102、一电路组件103、一整合封装基板110以及一感光元件120。感光元件120可电性连接于电路组件103或整合封装基板110。整合封装基板110可为内埋式基板(SESUB)，具有多个电子元件，包覆于整合封装基板110内而无外露。基于整合封装基板110的配置，感光模块可以设置更多的电子元件并且同时具有更小的体积。
基底102可由高导热系数的材料制成，以提升感光模块整体的散热效果。再者，在一些实施例中，感光模块可还包含多个散热结构，连接感光元件120。基于散热结构的配置，可进一步提升感光模块的散热效率。
虽然本公开的实施例及其优点已公开如上，但应该了解的是，本领域技术人员在不脱离本公开的精神和范围内，当可作更动、替代与润饰。此外，本公开的保护范围并未局限于说明书内所述特定实施例中的工艺、机器、制造、物质组成、装置、方法及步骤，任何所属技术领域中技术人员可从本发明实施例公开内容中理解现行或未来所发展出的工艺、机器、制造、物质组成、装置、方法及步骤，只要可以在此处所述实施例中实施大抵相同功能或获得大抵相同结果皆可根据本公开使用。因此，本公开的保护范围包括上述工艺、机器、制造、物质组成、装置、方法及步骤。另外，每一权利要求构成个别的实施例，且本公开的保护范围也包括各个权利要求及实施例的组合。

Claims (20)

1.一种感光模块，其特征在于，包括:
一基底；
一整合封装基板，连接于该基底，该整合封装基板具有多个第一电子元件，并且多个所述第一电子元件被包覆于该整合封装基板内且无外露；以及
一感光元件，连接于该基底，并且该感光元件配置以接受沿着一光轴前进的一光线。
2.如权利要求1所述的感光模块，其特征在于，该整合封装基板包括：
一第三绝缘层；
一第四绝缘层；
一中间层，设置于该第三绝缘层和第四绝缘层之间，并且多个所述第一电子元件设置于该中间层之中；
一第一电路元件，设置于该第三绝缘层与该中间层之间；以及
一第二电路元件，设置于该中间层与该第四绝缘层之间，其中该中间层与该第三绝缘层或第四绝缘层具有不同材质。
3.如权利要求2所述的感光模块，其特征在于，该感光模块还包含一第二电子元件，设置于该整合封装基板的一表面上。
4.如权利要求2所述的感光模块，其特征在于，该感光模块还包含一散热结构，对应该感光元件或该整合封装基板，并且该散热结构具有金属材质。
5.如权利要求2所述的感光模块，其特征在于，该感光模块还包含：
一透明元件，对应该感光元件；以及
一感光元件保持框架，连接该透明元件，其中该透明元件与该感光元件具有一间隙，并且该感光元件保持框架直接设置于该整合封装基板。
6.如权利要求5所述的感光模块，其特征在于，当沿着垂直于该光轴的方向观察时，该感光元件位于该感光元件保持框架与该整合封装基板之间。
7.如权利要求6所述的感光模块，其特征在于，该感光模块还包含一另一整合封装基板，并且该透明元件连接于该感光元件保持框架以及该另一整合封装基板之间。
8.如权利要求2所述的感光模块，其特征在于，该感光模块还包含：
一电路组件；
一电性连接部，该整合封装基板经由该电性连接部电性连接该电路组件；以及
一补强材料，直接接触该电性连接部、该整合封装基板以及该电路组件。
9.如权利要求2所述的感光模块，其特征在于，该感光模块还包含一第二电子元件，该第二电子元件与该感光元件设置于该整合封装基板的同一侧面。
10.如权利要求2所述的感光模块，其特征在于，该感光模块还包含一第二电子元件，该第二电子元件与该感光元件分别设置于该整合封装基板的不同侧。
11.如权利要求2所述的感光模块，其特征在于，当沿着垂直该光轴的方向观察时，至少一部分的该感光元件重叠于该整合封装基板。
12.如权利要求11所述的感光模块，其特征在于，该感光模块还包含一透明元件，设置于该整合封装基板。
13.如权利要求12所述的感光模块，其特征在于，当沿着垂直该光轴的方向观察时，至少一部分的该整合封装基板重叠于该透明元件以及该感光元件。
14.如权利要求13所述的感光模块，其特征在于，该感光模块还包含一散热结构，直接接触该感光元件以及该基底，并且当沿着该光轴的方向观察时，该散热结构的面积小于或等于该感光元件的面积。
15.如权利要求1所述的感光模块，其特征在于，该基底包含一本体以及一电性连接组件，并且该感光元件通过该电性连接组件电性连接于该整合封装基板。
16.如权利要求15所述的感光模块，其特征在于，该电性连接组件贯穿该基底的该本体，并且该电性连接组件电性独立于该本体。
17.如权利要求15所述的感光模块，其特征在于，该感光模块还包含一散热结构，直接接触该感光元件以及该基底，并且当沿着该光轴的方向观察时，该散热结构的面积小于或等于该感光元件的面积。
18.如权利要求1所述的感光模块，其特征在于，该整合封装基板与该感光元件分别设置于该基底的相反侧。
19.如权利要求18所述的感光模块，其特征在于，该感光元件经由该基底电性连接该整合封装基板。
20.如权利要求19所述的感光模块，其特征在于，当沿着垂直该光轴的方向观察时，该基底、该整合封装基板以及该感光元件互相不重叠。
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US20200336629A1 (en) 2020-10-22
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CN211741681U (zh) 2020-10-23
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