CN211741681U - 摄像模块用光学系统 - Google Patents
摄像模块用光学系统 Download PDFInfo
- Publication number
- CN211741681U CN211741681U CN202020283917.8U CN202020283917U CN211741681U CN 211741681 U CN211741681 U CN 211741681U CN 202020283917 U CN202020283917 U CN 202020283917U CN 211741681 U CN211741681 U CN 211741681U
- Authority
- CN
- China
- Prior art keywords
- optical
- module
- adjusting
- optical system
- optical module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 248
- 230000007246 mechanism Effects 0.000 claims description 11
- 239000007769 metal material Substances 0.000 claims description 2
- 230000008859 change Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000006870 function Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000003750 conditioning effect Effects 0.000 description 2
- 101710179734 6,7-dimethyl-8-ribityllumazine synthase 2 Proteins 0.000 description 1
- 101710186609 Lipoyl synthase 2 Proteins 0.000 description 1
- 101710122908 Lipoyl synthase 2, chloroplastic Proteins 0.000 description 1
- 101710101072 Lipoyl synthase 2, mitochondrial Proteins 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/64—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
- G02B27/646—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image compensating for small deviations, e.g. due to vibration or shake
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/003—Alignment of optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
- G02B7/08—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
- G02B7/09—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
- G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
- G02B7/1821—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors for rotating or oscillating mirrors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B13/00—Viewfinders; Focusing aids for cameras; Means for focusing for cameras; Autofocus systems for cameras
- G03B13/32—Means for focusing
- G03B13/34—Power focusing
- G03B13/36—Autofocus systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B5/00—Adjustment of optical system relative to image or object surface other than for focusing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B5/00—Adjustment of optical system relative to image or object surface other than for focusing
- G03B5/02—Lateral adjustment of lens
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B5/00—Adjustment of optical system relative to image or object surface other than for focusing
- G03B5/04—Vertical adjustment of lens; Rising fronts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02016—Circuit arrangements of general character for the devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02366—Special surface textures of the substrate or of a layer on the substrate, e.g. textured ITO/glass substrate or superstrate, textured polymer layer on glass substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/024—Arrangements for cooling, heating, ventilating or temperature compensation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by at least one potential-jump barrier or surface barrier, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/112—Devices sensitive to infrared, visible or ultraviolet radiation characterised by field-effect operation, e.g. junction field-effect phototransistor
- H01L31/113—Devices sensitive to infrared, visible or ultraviolet radiation characterised by field-effect operation, e.g. junction field-effect phototransistor being of the conductor-insulator-semiconductor type, e.g. metal-insulator-semiconductor field-effect transistor
- H01L31/1136—Devices sensitive to infrared, visible or ultraviolet radiation characterised by field-effect operation, e.g. junction field-effect phototransistor being of the conductor-insulator-semiconductor type, e.g. metal-insulator-semiconductor field-effect transistor the device being a metal-insulator-semiconductor field-effect transistor
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
- H02K11/21—Devices for sensing speed or position, or actuated thereby
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
- H02K41/02—Linear motors; Sectional motors
- H02K41/035—DC motors; Unipolar motors
- H02K41/0352—Unipolar motors
- H02K41/0354—Lorentz force motors, e.g. voice coil motors
- H02K41/0356—Lorentz force motors, e.g. voice coil motors moving along a straight path
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
- G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
- G02B13/0045—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having five or more lenses
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B2205/00—Adjustment of optical system relative to image or object surface other than for focusing
- G03B2205/0007—Movement of one or more optical elements for control of motion blur
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B2205/00—Adjustment of optical system relative to image or object surface other than for focusing
- G03B2205/0053—Driving means for the movement of one or more optical element
- G03B2205/0069—Driving means for the movement of one or more optical element using electromagnetic actuators, e.g. voice coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48105—Connecting bonding areas at different heights
- H01L2224/48106—Connecting bonding areas at different heights the connector being orthogonal to a side surface of the semiconductor or solid-state body, e.g. parallel layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Abstract
一种摄像模块用光学系统,具有一主轴,包括:一光学模块与一调整组件。光学模块用以承载具有一光轴的一光学元件,调整组件可用以调整光学模块的光轴平行于主轴,其中光学模块与调整组件沿主轴排列,且沿垂直于主轴的一第一方向观察,调整组件与光学模块不重叠。
Description
技术领域
本实用新型涉及一种摄像模块用光学系统,特别涉及一种具有调整组件的摄像模块用光学系统。
背景技术
随着科技的发展,人们对于电子产品的高效能、高规格视觉享受的追求越来越高,以丰富更棒的产品使用体验。现今许多电子装置(例如平板电脑或智能手机)都配有镜头模块而具有照相或录影的功能。当使用者使用配有镜头模块的电子装置时,可能会有晃动的情形发生,进而使得镜头模块所拍摄的影像产生模糊。然而,人们对于影像品质的要求日益增高,故镜头模块的防震功能亦日趋重要,此外也追求产品的小型化、轻便化,以便使用者使用。如何提供一种具高品质的摄像模块是为一重要课题。
一些摄像模块内配置有复数个镜头元件,面对高分辨率需求,使得需要更高水准的光学驱动、稳定度与对准性,在调制传递函数(Modulation Transfer Function,MTF)的表现品质能够提高。一些镜头元件的光圈性能,因为低照度(low light)品质要求,需要大光圈型的产品,但是对焦(through of focus,TOF)的焦深(depth of focus)范围会变窄。相关零组件的组装,镜头元件与感光元件若无法实现垂直正交,意即跟光轴有倾斜角度(tilt)存在,若其倾斜角度过大,则TOF的曲线分散,造成影像失焦而模糊。因此,控制镜头元件与感光元件的倾斜角度是一重要课题。
实用新型内容
本实用新型的一实施例提供一种摄像模块用光学系统,具有一主轴,包括:一光学模块与一调整组件。光学模块用以承载具有一光轴的一光学元件,调整组件可用以调整光学模块的光轴平行于主轴,其中光学模块与调整组件沿主轴排列,且沿垂直于主轴的一第一方向观察,调整组件与光学模块不重叠。
于一实施例中,前述光学模块还包含一活动部与一基座,活动部具有一承载件与一驱动组件,其中承载件用以承载光学元件,且驱动组件用以驱动承载件相对基座运动。
于一实施例中,前述光学模块具有一底面,调整组件位于光学模块及底面之间。
于一实施例中,前述摄像模块用光学系统还包括一感光模块,其中光学模块、调整组件与感光模块按序沿着主轴排列。
于一实施例中,前述调整组件包含复数个调整柱,沿一第二方向延伸,且第二方向不与光轴垂直。
于一实施例中,前述调整结构至少包含三个调整柱,三者位于光学模块的一底面的不同侧,且设置于底面的边缘处。
于一实施例中,前述调整柱的端部具有阶梯状结构。于另一实施例中,前述调整柱具有圆柱状或梯形结构。
于一实施例中,前述感光模块具有一接触表面,调整组件位于光学模块与接触表面之间,且调整组件接触前述接触表面。前述接触表面具有金属材质。前述接触表面为一平面。
于一实施例中,前述接触表面具有复数个凸部,朝光学模块延伸,调整组件对应并接触前述凸部,且凸部的最大宽度大于调整组件的最大宽度。
于一实施例中,前述接触表面具有复数个凹部,凹部的开口朝向光学模块,调整组件对应并接触凹部,且凹部的最大宽度大于调整组件的最大宽度。
于一实施例中,前述摄像模块用光学系统还包括一组合与调节机构,夹持光学模块并承载感光模块,组合与调节机构对感光模块朝光学模块施加一力,并调整调整组件的外型,并用以使光轴与主轴平行。
本实用新型的另一实施例提供一种摄像模块用光学系统,具有一主轴包括:一第一光学模块、一第二光学模块与一调整组件。第一光学模块用以承载具有一第一光轴的一第一光学元件,第二光学模块用以承载具有一第二光轴的一第二光学元件。调整组件用以调整第一光轴及第二光轴平行于主轴,并包含一调整子组件,位于第一光学模块及第二光学模块之间,其中沿垂直于主轴的一第一方向观察,第一调整子组件不与第一光学模块和第二光学模块重叠。
于一实施例中,前述摄像模块用光学系统还包括一感光模块,感光模块具有前述主轴,调整组件还包含一第二调整子组件,第一光学模块、第二光学模块及感光组件是沿主轴按序排列,第二调整子组件是位于第二光学模块及感光组件之间,用以调整第二光轴平行于主轴,且沿垂直主轴的第一方向观察,第二调整子组件不与第二光学模块重叠。
于一实施例中,前述第一调整子组件设置于第二光学模块的一上表面,并至少部分接触第一光学模块的一底面,且上表面与底面相互面对。
于一实施例中,前述第一调整子组件设置于第一光学模块的一底面,并至少部分接触第二光学模块的一上表面,且底面与上表面相互面对。
于一实施例中,前述第二调整子组件设置于第二光学模块的一下表面,并至少部分接触感光模块的一表面,且下表面与感光模块的该表面相互面对。
于一实施例中,前述摄像模块用光学系统还包括一组合与调节机构,用以调整调整组件的外型,并用以使第一光轴、第二光轴与主轴平行。
附图说明
图1是表示本实用新型一实施例的摄像模块用光学系统的光学模块、调整组件、感光模块的剖面示意图。
图2是表示图1中的光学模块的底侧示意图。
图3A是表示图1中的摄像模块用光学系统的光学模块内的光学元件与感光模块有相对倾斜,并接受调整的示意图。
图3B是表示图3A中光学元件与感光模块经过调整位置的示意图。
图4是表示本实用新型另一实施例的摄像模块用光学系统的剖面示意图。
图5是表示调整柱与数个不同的对手件的示意图。
图6是表示多个不同形状的调整柱的示意图。
图7是表示多个不同形状的调整柱的示意图。
附图标记说明:
20-100、20-200 摄像模块用光学系统
20-10 基座
20-20 框架
20-30 承载件
20-40 底板
20-41 接触表面
20-56 组合与调节机构
20-501 测量装置
20-601 定位装置
20-6011 夹持件
20-6012 限位件
20-6013 定位件
20-AS 调整组件
20-A1、20-A1a、20-A1b、20-A1c、20-A1a’、20-A1b’、20-A1c’、20-A1d’ 调整柱
20-A1a’1、20-A1b’1、20-A1c’1、20-A1d’ 延伸部
20-A1c’2 凹陷部
20-BO、20-BO1、20-BO2、20-BO3 对手件
20-BOR 凹部
20-BOT 凸部
20-C 线圈
20-D1 第一方向
20-D2 第二方向
20-ES 弹性组件
20-E1 第一弹性元件
20-E2 第二弹性元件
20-F1、20-F2、20-F3 力
20-H 外壳
20-LS 光学元件
20-IM 感光模块
20-M 磁性元件
20-MC 驱动组件
20-O、20-O1、20-O2 光轴
20-OM 光学模块
20-OMB 底面
20-OMB1 上表面
20-OMB2 下表面
20-Q 主轴
20-V 活动部
20-W1、20-W2、20-W3、20-W4 宽度
具体实施方式
有关本实用新型的装置适用的其他范围将于接下来所提供的详述中清楚易见。必须了解的是,下列的详述以及具体的实施例,当提出有关摄像模块用光学系统的示范实施例时,仅作为描述的目的以及并非用以限制本实用新型的范围。
除非另外定义,在此使用的全部用语(包括技术及科学用语),具有与此篇公开所属的一般技艺者所通常理解的相同涵义。能理解的是,这些用语,例如在通常使用的字典中定义的用语,应被解读成具有一与相关技术及本公开的背景或上下文一致的意思,而不应以一理想化或过度正式的方式解读,除非在此特别定义。
请参阅图1,图1是表示本实用新型一实施例的摄像模块用光学系统20-100的示意图。如图1所示,摄像模块用光学系统20-100可设置于一电子装置(例如相机、平板电脑或手机)内部,作为摄像单元以提供拍摄、录影功能。举例而言,当来自外界的光线沿光入射方向进入摄像模块用光学系统20-100后,光线得以穿过其中的一光学元件20-LS(例如镜头组件)并至感光元件20-IM,以获取影像。以下将详细说明摄像模块用光学系统20-100的详细结构。
前述摄像模块用光学系统20-100包括一光学模块20-OM、一感光模块20-IM与一调整组件20-AS,调整组件20-AS位于光学模块20-OM与感光模块20-IM之间,并设置于光学模块20-OM的一底面20-OMB上,且沿垂直于光学系统20-100的一主轴20-Q(或光学元件20-LS的光轴20-O)的一第一方向20-D1观察,调整组件20-AS与光学模块20-OM不重叠。
前述光学模块20-OM可为一镜头模块,包含一外壳20-H、一活动部20-V与一基座20-10,外壳20-H和活动部20-V设置于基座20-10上,且外壳20-H与基座20-10形成一容纳空间,活动部20-V设置于容纳空间中。前述活动部20-V包含一框架20-20、一承载件20-30、一驱动组件20-MC与一弹性组件20-ES。外壳20-H连接并设置于基座20-10所形成的容纳空间,用以容置前述活动部20-V(包含承载件20-30、驱动组件20-MC与弹性组件20-ES),可提供保护作用。
承载件20-30用以承载光学元件20-LS,并通过弹性组件20-ES活动地连接基座20-10和框架20-20。驱动组件20-MC设置于承载件20-30和框架20-20上,用以驱动承载件20-30和光学元件20-LS相对于基座20-10、框架20-20移动,以调整光学元件20-LS的姿态或位置,进而达光学自动对焦(Auto-Focusing,AF)或光学防手震(Optical Image Stabilization,OIS)的目的。
关于弹性组件20-ES的详细而言,弹性组件20-ES包含一第一弹性元件20-E1和一第二弹性元件20-E2,分别设置于承载件20-30的上、下两侧,活动地连接承载件20-30和基座20-10与框架20-20,使得承载件20-30可相对于基座20-10与框架20-20活动。
关于驱动组件20-MC之详细而言,其可为一电磁驱动组件(ElectromagneticDriving Assembly),包含一线圈20-C和一磁性元件20-M,两者分别设置于承载件20-30和框架20-20。其中,磁性元件20-M与线圈20-C两者相互对应。当对驱动组件20-MC施加一施加驱动信号(例如通过一外部电源施加电流至线圈20-C),磁性元件20-M与线圈20-C之间产生磁力,进而可带动承载件20-30相对于基座20-10移动,以达到光学影像防手震或自动对焦的技术效果。本实施例中的驱动组件20-MC为动磁式,于另一实施例中则可为动圈式。此外,在施加驱动信号之前,前述弹性组件20-ES可让承载件20-30相对基座20-10保持在一初始位置。
驱动组件20-MC可包括一位置感测元件,其可为一位置感应器,举例而言,可为磁阻感应器(Magnetoresistive Sensor,MRS)或是光学感测器(Optical Sensor),其用以感测活动部20-V、基座20-10的相对位置关系,以利一控制单元(未图示)通过驱动组件20-MC调整两者之间的位置。位置感测元件可被线圈20-C围绕,此配置可充分利用空间,让整个驱动机构的体积达小型化之利。位置感测元件可与线圈20-C共用磁性元件20-M。
于一些实施例中,摄像模块用光学系统20-100还可包括一导磁元件(permeability element)设置于框架20-20与驱动组件20-MC的磁性元件20-M之间,可使磁性元件20-M的磁力往一既定方向集中,以增强驱动组件20-MC驱使承载件20-30移动的磁推力,以及降低磁干扰的作用。于另一实施例中,框架20-20的可嵌入前述导磁元件,使其具有导磁材质,除了可增强磁力(磁性元件20-M与线圈20-C之间)往一既定方向集中外,还可增强活动部20-V的整体机械强度。
参阅图2,前述调整组件20-AS包含复数个调整柱20-A1,设置于基座20-10的底面20-OMB并沿一第二方向延伸20-D2(第二方向20-D2不与光轴20-O垂直,例如平行或大致平行于Z轴),用以调整光学模块20-OM与感光模块20-IM的相对位置,具体而言,其是调整光学模块20-OM内设置的光学元件20-LS的光轴20-O与感光模块20-IM的主轴20-Q,以使其重叠或平行。于本实施例中,调整组件20-AS包含四个调整柱20-A1,设置于光学模块20-OM的底面20-OMB的边缘处,并位于底面20-OMB的不同侧。需注意的是,于其他实施例中,调整组件20-AS可包含三个调整柱20-A1,设置于光学模块20-OM的底面20-OMB的边缘处,三者皆位于底面20-OMB的不同侧。
详细而言,参阅图3A,当感光模块20-IM和光学模块20-OM组装时,感光模块20-IM的底板20-40(可用于承载感光模块20-IM内的感光元件)的接触表面20-41会接触调整组件20-AS,此时一组合与调节机构20-56的测量装置20-501(例如一角度测量器)测量光学模块20-OM内的光轴20-O与感光模块20-IM的主轴20-Q的角度差,以提供一测量信息。接着,组合机构20-56的一定位装置20-601根据前述测量信息来调整光学模块20-OM与感光模块20-IM之间的相对位置,以使光轴20-O与主轴20-Q重合或平行。于一些实施例中,测量装置20-501可通过光经过光学模块20-OM至感光模块20-IM所产生的影像,根据影像的模糊、对焦程度来判别光学模块20-OM内的光轴20-O与感光模块20-IM的主轴20-Q的之间是否存在角度差异。
继续参阅图3A,当主轴20-Q相对于光轴20-O有相对倾斜或歪斜时(例如光学元件20-LS放置于承载件20-30中并没有完全对齐承载件20-30的中心,会使得光轴20-O、承载件20-30的中心与主轴20-Q并非三者平行或重合),代表感光模块20-IM并非对齐光学模块20-OM。此时,定位装置20-601会带动感光模块20-IM挤压调整组件20-AS,使得调整组件20-AS的至少一部分在Z轴方向上的高度降低,以让感光模块20-IM对齐光学模块20-OM。如图3A~3B所示,当感光模块20-IM挤压调整组件20-AS时,其底板20-40接触并抵压住前述数个调整柱20-A1,使得调整柱20-A1改变原本形状,此时通过定位装置20-601让感光模块20-IM对齐光学模块20-OM,以达两者组成的对准性。
其中,定位装置20-601包含一夹持件20-6011、限位件20-6012与一定位件20-6013,夹持件20-6011用以夹持光学模块20-OM,限位件20-6012用以限位光学模块20-OM,定位件20-6013则用以承载感光模块20-IM并使其组装于光学模块20-OM。于本实施例中,夹持件20-6011是夹持光学模块20-OM的顶部,限位件20-6012则位在光学模块20-OM两侧以限位光学模块20-OM,避免过大的晃动或移动。当定位件20-6013推动感光模块20-IM向光学模块20-OM时,感光模块20-IM的底板20-40接触调整柱20-A1,通过测量装置20-501得知两者的光轴20-O、主轴20-Q是否平行或重合,以调整感光模块20-IM在不同位置压向调整柱20-A1的力量,如不同力20-F1、20-F2、20-F3,使得调整柱20-A1的形状被改变,进而可使得光轴20-O、主轴20-Q平行或重合。
于一些实施例中,前述底板20-40的接触表面20-41具有金属材质,其可连接至外部一加热电路,以使其加热升温,使得在此接触表面20-41上的调整柱20-A1得以成为融化态,进而改变其形状。于一些实施例中,接触表面20-41为平面。
如此一来,摄像模块用光学系统20-100通过在光学模块20-OM与感光组件20-IM之间设置调整组件20-AS,且调整组件AS的外型得以被改变,使得感光组件IM和光学模块20-OM组装能够精准地调校,以让主轴20-Q与光轴20-O平行或重合,以提升装置所获取的影像品质。
图4是表示本实用新型另一实施例的摄像模块用光学系统20-200与调整,与图1中的摄像模块用光学系统20-100不同的是,本实施例的摄像模块用光学系统20-200具有两个光学模块:一第一光学模块20-OM1和一第二光学模块20-OM2,两者可为相同或类似的组件,或是外型、比例大小不同的组件,而调整组件20-AS具有复数个第一调整柱20-A1(第一调整子组件)和复数个第二调整柱A2(第二调整子组件)。第一光学模块20-OM1、第一调整柱20-A1、一第二光学模块20-OM2、第二调整柱20-A2和感光模块20-IM是沿第一光学元件20-LS1的第一光轴20-O1(或者第二光学元件LS2的第二光轴20-O2、主轴20-Q)按序排列。
当欲使第一、第二光学模块20-OM1、20-OM2、感光模块20-IM三者组装时,定位装置601的夹持件20-6011夹持并限位第一、第二光学模块20-OM1、20-OM2,而定位件20-6012承载感光模块20-IM。首先,第二光学模块20-OM2的上表面20-OMB1上的第一调整柱20-A1压向第一光学模块20-OM1的基座20-10的底面,当第一、第二光学模块20-OM1、20-OM2有相对倾斜时,通过第一调整组件20-A1承靠基座20-10并使第一调整柱20-A1形状改变,并使第一、第二光学模块20-OM1、20-OM2对齐。
接着,感光模块20-IM的底板20-40压向设置在下表面20-OMB2的第二调整柱20-A2,当感光模块20-IM与第二光学模块20-OM2有相对倾斜时,通过第二调整柱20-A2承靠在底板20-40上而被挤压改变形状,直到感光模块20-IM对齐于第二光学模块20-OM2。如此一来,通过上述机制,能使能第一、第二光学模块20-OM1、20-OM2、感光模块20-IM三者对齐,第一、第二光轴20-O1、20-O2与主轴20-Q平行或重合。
于另一些实施例中,第一调整柱20-A1可设置于第一光学模块20-OM1的底面,而第二光学模块20-OM2的上表面20-OMB1压向第一调整柱20-A1。于另一些实施例中,第二调整柱20-A2可设置在感光模块20-IM的底板20-40上,而第二光学模块20-OM2的下表面20-OMB2压向第二调整柱20-A2。
以上说明的第一、第二调整柱20-A1、20-A2设置的位置可作组合,而第一、第二光学模块20-OM1、20-OM2、感光模块20-IM三者的主动移动方亦可作组合。
图5显示数个调整柱20-A1(或20-A2)与数个不同的对手件20-BO1、20-BO2、20-BO3的示意图。前述对手件20-BO1~BO3可如图3A中的感光模块20-IM的底板20-40,或者为图4中的第一光学模块20-OM1的基座20-10、第二光学模块20-OM2的上、下表面20-OMB1、20-OMB2的部分或感光模块20-IM的底板20-40。
于本实施例中,调整柱20-A1具有圆柱结构,其具有一最大宽度20-W1,而对手件20-BO1的接触面则具有一最大宽度20-W2,其中调整柱20-A1的最大宽度20-W1小于对手件的最大宽度20-W2,也就是最大宽度20-W2大于最大宽度20-W1。如此可确保对手件20-BO1压向调整柱20-A1时,能够完全覆盖调整柱20-A1,以利改变调整柱20-A1的形状,提升模块之间的对准精确度。
于一些实施例中,对手件20-BO2具有对应每一调整柱20-A1的凸部20-BOT,朝调整柱20-A1(或20-A2)延伸,搭配图1、4中的实施例,其例如朝光学模块20-OM、20-OM1、20-OM2或感光模块20-IM延伸。复数个调整柱20-A1对应并接触复数个凸部20-BOT,且凸部20-BOT的最大宽度20-W3大于调整柱20-A1的最大宽度20-W1。为求清楚、简单地显示,图5中仅示出一个调整柱20-A1与一个凸部20-BOT。
于一些实施例中,对手件20-BO3的具有复数个凹部20-BOR,其开口是朝光学模块20-OM,复数个调整柱20-A1对应并接触这些凹部20-BOR,且凹部20-BOR的最大宽度20-W4大于调整柱20-A1的最大宽度20-W1。
图6显示多个不同形状的调整柱,包含调整柱20-A1a、20-A1b、20-A1c的示意图。调整柱20-A1a可具有圆柱状或是梯形结构,其中,具有梯形结构的调整柱有两种实施方式20-A1b、20-A1c:邻近对手件20-BO的一侧最大宽度小于远离对手件20-BO的一侧的最大宽度;以及邻近对手件20-BO的一侧的最大宽度大于远离对手件20-BO的一侧的最大宽度。
图7显示多个不同的调整柱20-A1(或20-A2)的端部具有不同形状的示意图,如调整柱20-A1a’、20-A1b’、20-A1c’与20-A1d’。调整柱20-A1a’的端部具有阶梯结构,以形成一延伸部20-A1a’1和一限位面20-A1a’2,当对手件20-BO压向延伸部20-A1a’1而改变其形状时,限位面20-A1a’2可作为对手件20-BO压向延伸部20-A1a’1的限位表面,可防止对手件20-BO过度挤压调整柱20-A1a’。调整柱20-A1b’的延伸部20-A1b’1则具有一渐缩结构。
调整柱20-20-A1c’具有延伸部20-A1c’1与凹陷部20-A1c’2,凹陷部20-A1c’2位于延伸部20-A1c’1的两侧,如此当对手件20-BO压向延伸部20-A1c’1而改变其形状时,变形的延伸部20-A1c’1可往凹陷部20-A1c’2移动,凹陷部20-A1c’2具有容纳变形的延伸部20-A1c’1的效果。调整柱20-A1d’的延伸部20-A1d’1则具有一渐缩结构。
综上所述,本实用新型的实施例提供一种摄像模块用光学系统,具有一主轴,包括:一光学模块,具有一承载空间,用以承载具有一光轴的一光学元件;以及一调整组件,可调整该光学模块的该光轴平行于该主轴,该光学模块与该调整组件是沿该主轴排列,其中沿垂直该主轴的一第一方向观察,该调整组件与该光学模块的该承载空间不相重叠。
本实用新型实施例至少具有以下其中一个优点或技术效果,通过调整组件可调整数个光学模块相互对齐,以及一或数个光学模块与感光模块相互对齐,以提高装置的优良性。此外,由于调整组件可在调整时改变其外型(通常为被挤压而在垂直方向上高度减少),让光学模块与感光模块之间的调校能够更细致、更精准,大幅提升产品品质。
在本说明书以及权利要求中的序数,例如“第一”、“第二”等等,彼此之间并没有顺序上的先后关系,其仅用于标示区分两个具有相同名字的不同元件。
上述的实施例以足够的细节叙述使所属技术领域的技术人员能通过上述的描述实施本实用新型所公开的装置,以及必须了解的是,在不脱离本实用新型的构思以及范围内,当可做些许变动与润饰,因此本实用新型的保护范围当视权利要求所界定者为准。
Claims (20)
1.一种摄像模块用光学系统,具有一主轴,其特征在于,该摄像模块用光学系统包括:
一光学模块,用以承载具有一光轴的一光学元件;以及
一调整组件,用以调整该光学模块的该光轴平行于该主轴,其中该光学模块与该调整组件沿该主轴排列,且沿垂直于该主轴的一第一方向观察,该调整组件与该光学模块不重叠。
2.如权利要求1所述的摄像模块用光学系统,其特征在于,该光学模块包含一活动部与一基座,该活动部具有一承载件与一驱动组件,其中该承载件用以承载该光学元件,且该驱动组件用以驱动该承载件相对该基座运动。
3.如权利要求1所述的摄像模块用光学系统,其特征在于,该光学模块具有一底面,该调整组件位于该光学模块的该底面。
4.如权利要求1所述的摄像模块用光学系统,其特征在于,还包括一感光模块,其中该光学模块、该调整组件与该感光模块按序沿着该主轴排列。
5.如权利要求1所述的摄像模块用光学系统,其特征在于,该调整组件包含复数个调整柱,沿一第二方向延伸,且该第二方向不与该光轴垂直。
6.如权利要求5所述的摄像模块用光学系统,其特征在于,该调整组件至少包含三个调整柱,三者位于该光学模块的一底面的不同侧,且设置于该底面的边缘处。
7.如权利要求5所述的摄像模块用光学系统,其特征在于,该些调整柱的端部具有阶梯状结构。
8.如权利要求5所述的摄像模块用光学系统,其特征在于,该些调整柱具有圆柱状或梯形结构。
9.如权利要求4所述的摄像模块用光学系统,其特征在于,该感光模块具有一接触表面,该调整组件位于该光学模块与该接触表面之间,且该调整组件接触该接触表面。
10.如权利要求9所述的摄像模块用光学系统,其特征在于,该接触表面具有金属材质。
11.如权利要求9所述的摄像模块用光学系统,其特征在于,该接触表面为一平面。
12.如权利要求9所述的摄像模块用光学系统,其特征在于,该接触表面具有复数个凸部,朝该光学模块延伸,该调整组件对应并接触该些凸部,且该些凸部的最大宽度大于该调整组件的最大宽度。
13.如权利要求9所述的摄像模块用光学系统,其特征在于,该接触表面具有复数个凹部,该些凹部的开口朝向该光学模块,该调整组件对应并接触该些凹部,且该些凹部的最大宽度大于该调整组件的最大宽度。
14.如权利要求4所述的摄像模块用光学系统,其特征在于,还包括一组合与调节机构,夹持该光学模块并承载该感光模块,该组合与调节机构对该感光模块朝该光学模块施加一力,并调整该调整组件的外型,并用以使该光轴与该主轴平行。
15.一种摄像模块用光学系统,具有一主轴,其特征在于,该摄像模块用光学系统包括:
一第一光学模块,用以承载具有一第一光轴的一第一光学元件;
一第二光学模块,用以承载具有一第二光轴的一第二光学元件;以及
一调整组件,用以调整该第一光轴及该第二光轴平行于该主轴,并包含第一调整子组件,位于该第一光学模块及该第二光学模块之间,其中沿垂直于该主轴的一第一方向观察,该第一调整子组件不与该第一光学模块和该第二光学模块重叠。
16.如权利要求15所述的摄像模块用光学系统,其特征在于,还包括一感光模块,该感光模块具有该主轴,该调整组件还包含一第二调整子组件,该第一光学模块、该第二光学模块及该感光模块是沿该主轴按序排列,该第二调整子组件是位于该第二光学模块及该感光模块之间,用以调整该第二光轴平行于该主轴,且沿垂直该主轴的该第一方向观察,该第二调整子组件不与该第二光学模块重叠。
17.如权利要求15所述的摄像模块用光学系统,其特征在于,该第一调整子组件设置于该第二光学模块的一上表面,并至少部分接触该第一光学模块的一底面,且该上表面与该底面相互面对。
18.如权利要求15所述的摄像模块用光学系统,其特征在于,该第一调整子组件设置于该第一光学模块的一底面,并至少部分接触该第二光学模块的一上表面,且该底面与该上表面相互面对。
19.如权利要求16所述的摄像模块用光学系统,其特征在于,该第二调整子组件设置于该第二光学模块的一下表面,并至少部分接触该感光模块的一表面,且该下表面与该感光模块的该表面相互面对。
20.如权利要求15所述的摄像模块用光学系统,其特征在于,还包括一组合与调节机构,用以调整该调整组件的外型,并用以使该第一光轴和该第二光轴与该主轴平行。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962836405P | 2019-04-19 | 2019-04-19 | |
US62/836,405 | 2019-04-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN211741681U true CN211741681U (zh) | 2020-10-23 |
Family
ID=72830909
Family Applications (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202020240172.7U Active CN212160198U (zh) | 2019-04-19 | 2020-03-02 | 光学元件驱动机构 |
CN202020283917.8U Active CN211741681U (zh) | 2019-04-19 | 2020-03-10 | 摄像模块用光学系统 |
CN202020309885.4U Active CN211741682U (zh) | 2019-04-19 | 2020-03-13 | 光学系统 |
CN202020575595.4U Active CN211879389U (zh) | 2019-04-19 | 2020-04-17 | 感光模块 |
CN202020574521.9U Active CN211879388U (zh) | 2019-04-19 | 2020-04-17 | 感光模块 |
CN202020575617.7U Active CN212009106U (zh) | 2019-04-19 | 2020-04-17 | 光学系统 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202020240172.7U Active CN212160198U (zh) | 2019-04-19 | 2020-03-02 | 光学元件驱动机构 |
Family Applications After (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202020309885.4U Active CN211741682U (zh) | 2019-04-19 | 2020-03-13 | 光学系统 |
CN202020575595.4U Active CN211879389U (zh) | 2019-04-19 | 2020-04-17 | 感光模块 |
CN202020574521.9U Active CN211879388U (zh) | 2019-04-19 | 2020-04-17 | 感光模块 |
CN202020575617.7U Active CN212009106U (zh) | 2019-04-19 | 2020-04-17 | 光学系统 |
Country Status (2)
Country | Link |
---|---|
US (6) | US11424374B2 (zh) |
CN (6) | CN212160198U (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI698693B (zh) * | 2018-12-28 | 2020-07-11 | 大陽科技股份有限公司 | 鏡頭驅動模組及電子裝置 |
CN212160190U (zh) * | 2019-07-26 | 2020-12-15 | 台湾东电化股份有限公司 | 光学元件驱动机构 |
US11867925B2 (en) * | 2019-08-30 | 2024-01-09 | Tdk Taiwan Corp. | Driving mechanism for optical element |
US11698525B2 (en) | 2019-09-06 | 2023-07-11 | Tdk Taiwan Corp. | Optical member driving mechanism |
CN214503997U (zh) * | 2020-03-06 | 2021-10-26 | 台湾东电化股份有限公司 | 光学元件驱动机构 |
CN113156608B (zh) * | 2021-04-16 | 2022-11-01 | 南昌欧菲光电技术有限公司 | 棱镜支架、棱镜组件、摄像模组和电子设备 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR920010947B1 (ko) * | 1989-05-24 | 1992-12-24 | 가부시끼가이샤 히다찌세이사꾸쇼 | 광결합장치와 그 제조방법, 발광장치와 그 조립방법 및 렌즈홀더 |
JP4594328B2 (ja) * | 2004-12-17 | 2010-12-08 | パナソニック株式会社 | 光学ユニット及びその製造方法 |
KR100667291B1 (ko) * | 2005-07-27 | 2007-01-12 | 삼성전자주식회사 | 마이크로 미러 소자 패키지 및 그 제조방법 |
JP2008028143A (ja) * | 2006-07-21 | 2008-02-07 | Sumitomo Electric Ind Ltd | 光モジュール |
JP2008109099A (ja) * | 2006-09-26 | 2008-05-08 | Sumitomo Electric Ind Ltd | ステムと被溶接部材の溶接部構造、その溶接部構造を有する半導体デバイス、光モジュール、およびその製造方法 |
JP5846346B2 (ja) * | 2009-08-21 | 2016-01-20 | ミツミ電機株式会社 | カメラの手振れ補正装置 |
US10103613B2 (en) * | 2013-01-11 | 2018-10-16 | Intel Corporation | Mirror driving device |
JP5998962B2 (ja) * | 2013-01-31 | 2016-09-28 | 三菱電機株式会社 | 半導体光装置 |
JP6565911B2 (ja) * | 2014-07-11 | 2019-08-28 | ミツミ電機株式会社 | レンズ駆動装置、カメラモジュール、及びカメラ搭載装置 |
US9772506B2 (en) * | 2014-11-12 | 2017-09-26 | Tdk Taiwan Corp. | Configuration of flexible connections used in a lens driving module |
JP6708920B2 (ja) * | 2015-11-16 | 2020-06-10 | ミツミ電機株式会社 | レンズ駆動装置、カメラモジュール及びカメラ搭載装置 |
US10732376B2 (en) * | 2015-12-02 | 2020-08-04 | Ningbo Sunny Opotech Co., Ltd. | Camera lens module and manufacturing method thereof |
KR20180059301A (ko) * | 2016-11-25 | 2018-06-04 | 주식회사 탑 엔지니어링 | 틸트 보정이 가능한 카메라 모듈 하우징, 카메라 모듈 제조장치 및 제조방법 |
KR102275684B1 (ko) * | 2017-04-18 | 2021-07-13 | 삼성전자주식회사 | 반도체 패키지 |
EP3647865B1 (en) * | 2017-06-30 | 2022-12-14 | LG Innotek Co., Ltd. | Lens driving device, and camera module and optical device comprising same |
JP7267940B2 (ja) * | 2018-02-01 | 2023-05-02 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置およびその製造方法、並びに電子機器 |
TW201942615A (zh) * | 2018-04-04 | 2019-11-01 | 日商索尼半導體解決方案公司 | 攝像裝置 |
CN209858825U (zh) | 2018-05-11 | 2019-12-27 | 台湾东电化股份有限公司 | 光学元件驱动机构 |
-
2020
- 2020-01-14 US US16/742,401 patent/US11424374B2/en active Active
- 2020-01-14 US US16/742,154 patent/US11650430B2/en active Active
- 2020-01-17 US US16/745,951 patent/US11322628B2/en active Active
- 2020-03-02 CN CN202020240172.7U patent/CN212160198U/zh active Active
- 2020-03-10 CN CN202020283917.8U patent/CN211741681U/zh active Active
- 2020-03-13 CN CN202020309885.4U patent/CN211741682U/zh active Active
- 2020-04-17 CN CN202020575595.4U patent/CN211879389U/zh active Active
- 2020-04-17 US US16/851,808 patent/US11355656B2/en active Active
- 2020-04-17 US US16/851,786 patent/US11852844B2/en active Active
- 2020-04-17 US US16/851,765 patent/US11309443B2/en active Active
- 2020-04-17 CN CN202020574521.9U patent/CN211879388U/zh active Active
- 2020-04-17 CN CN202020575617.7U patent/CN212009106U/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US20200335539A1 (en) | 2020-10-22 |
CN212009106U (zh) | 2020-11-24 |
US20200336629A1 (en) | 2020-10-22 |
US11355656B2 (en) | 2022-06-07 |
CN211741682U (zh) | 2020-10-23 |
CN211879389U (zh) | 2020-11-06 |
CN212160198U (zh) | 2020-12-15 |
US11322628B2 (en) | 2022-05-03 |
US11852844B2 (en) | 2023-12-26 |
US20200333558A1 (en) | 2020-10-22 |
US11309443B2 (en) | 2022-04-19 |
US20200333555A1 (en) | 2020-10-22 |
US20200335644A1 (en) | 2020-10-22 |
CN211879388U (zh) | 2020-11-06 |
US11424374B2 (en) | 2022-08-23 |
US20200333687A1 (en) | 2020-10-22 |
US11650430B2 (en) | 2023-05-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN211741681U (zh) | 摄像模块用光学系统 | |
KR101354775B1 (ko) | 카메라 모듈 | |
US11543622B2 (en) | Lens driving apparatus, camera module, and optical device | |
KR102542645B1 (ko) | 렌즈구동장치, 카메라 모듈 및 광학기기 | |
US8243250B2 (en) | Photographic lens unit and electronic apparatus using the same | |
CN106462029B (zh) | 摄像机模块 | |
CN112034585B (zh) | 透镜移动装置 | |
KR20160045382A (ko) | 렌즈 구동장치 | |
KR102166232B1 (ko) | 카메라 모듈의 틸트 보정 방법 및 이를 지원하는 장치 | |
KR20190001299A (ko) | 카메라 모듈 | |
CN116299949A (zh) | 相机装置和光学设备 | |
US10701248B2 (en) | Iris module and camera module including the same | |
US20200409166A1 (en) | Lens driving apparatus, camera module and optical device | |
CN113132631A (zh) | 摄像装置模块以及移动设备 | |
TWM545928U (zh) | 雙鏡頭攝像模組 | |
KR102609414B1 (ko) | 렌즈 구동 장치, 카메라 모듈 및 광학기기 | |
KR20160057721A (ko) | 렌즈 구동장치 및 이를 포함하는 카메라 모듈 | |
KR20220133050A (ko) | 액추에이터 장치 | |
KR20180007780A (ko) | 렌즈 구동 장치, 카메라 모듈 및 광학기기 | |
CN214375501U (zh) | 光学元件驱动机构 | |
US20240036304A1 (en) | Actuator device | |
EP4318117A1 (en) | Lens driving device | |
KR20220133049A (ko) | 액추에이터 장치 | |
KR20220133044A (ko) | 액추에이터 장치 | |
KR20220133045A (ko) | 액추에이터 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |