CN1283830C - 钽溅蚀靶和形成金属件的方法 - Google Patents

钽溅蚀靶和形成金属件的方法 Download PDF

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Publication number
CN1283830C
CN1283830C CNB988141183A CN98814118A CN1283830C CN 1283830 C CN1283830 C CN 1283830C CN B988141183 A CNB988141183 A CN B988141183A CN 98814118 A CN98814118 A CN 98814118A CN 1283830 C CN1283830 C CN 1283830C
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CN
China
Prior art keywords
tantalum
forging
sputter target
blank
target
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Expired - Lifetime
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CNB988141183A
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English (en)
Chinese (zh)
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CN1307646A (zh
Inventor
R·P·沙
V·赛加尔
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Johnson Matthey Electronics Inc
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Johnson Matthey Electronics Inc
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Publication of CN1307646A publication Critical patent/CN1307646A/zh
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
    • C22C27/02—Alloys based on vanadium, niobium, or tantalum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
    • B21J5/00—Methods for forging, hammering, or pressing; Special equipment or accessories therefor
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Forging (AREA)
  • Physical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
CNB988141183A 1998-06-17 1998-09-08 钽溅蚀靶和形成金属件的方法 Expired - Lifetime CN1283830C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/098,760 US6348139B1 (en) 1998-06-17 1998-06-17 Tantalum-comprising articles
US09/098760 1998-06-17
US09/098,760 1998-06-17

Publications (2)

Publication Number Publication Date
CN1307646A CN1307646A (zh) 2001-08-08
CN1283830C true CN1283830C (zh) 2006-11-08

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNB988141183A Expired - Lifetime CN1283830C (zh) 1998-06-17 1998-09-08 钽溅蚀靶和形成金属件的方法

Country Status (7)

Country Link
US (3) US6348139B1 (enExample)
EP (1) EP1088115A4 (enExample)
JP (1) JP2002518593A (enExample)
KR (1) KR100512295B1 (enExample)
CN (1) CN1283830C (enExample)
TW (1) TW515848B (enExample)
WO (1) WO1999066100A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102517550A (zh) * 2011-12-20 2012-06-27 宁波江丰电子材料有限公司 高纯钽靶材的制备方法和高纯钽靶材

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CN103572223B (zh) * 2012-08-01 2016-01-27 宁波江丰电子材料股份有限公司 钽靶材及钽靶材组件的制造方法
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CN104128740A (zh) * 2013-05-02 2014-11-05 宁波江丰电子材料股份有限公司 一种铜靶材的制备方法
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102517550A (zh) * 2011-12-20 2012-06-27 宁波江丰电子材料有限公司 高纯钽靶材的制备方法和高纯钽靶材
CN102517550B (zh) * 2011-12-20 2014-07-09 宁波江丰电子材料有限公司 高纯钽靶材的制备方法和高纯钽靶材

Also Published As

Publication number Publication date
JP2002518593A (ja) 2002-06-25
EP1088115A4 (en) 2005-03-30
EP1088115A1 (en) 2001-04-04
CN1307646A (zh) 2001-08-08
US20020063056A1 (en) 2002-05-30
WO1999066100A1 (en) 1999-12-23
KR20010071476A (ko) 2001-07-28
US20020153248A1 (en) 2002-10-24
US6348139B1 (en) 2002-02-19
KR100512295B1 (ko) 2005-09-05
TW515848B (en) 2003-01-01

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