CN1235286C - 一种电子装置与制作此装置的方法 - Google Patents

一种电子装置与制作此装置的方法 Download PDF

Info

Publication number
CN1235286C
CN1235286C CNB011253703A CN01125370A CN1235286C CN 1235286 C CN1235286 C CN 1235286C CN B011253703 A CNB011253703 A CN B011253703A CN 01125370 A CN01125370 A CN 01125370A CN 1235286 C CN1235286 C CN 1235286C
Authority
CN
China
Prior art keywords
semiconductor chip
electrode
chip
terminal block
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB011253703A
Other languages
English (en)
Chinese (zh)
Other versions
CN1340857A (zh
Inventor
今须诚士
吉田育生
岸川笵夫
角义之
田口一之
内藤孝洋
佐藤俊彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of CN1340857A publication Critical patent/CN1340857A/zh
Application granted granted Critical
Publication of CN1235286C publication Critical patent/CN1235286C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/222—Multilayered bumps, e.g. a coating on top and side surfaces of a bump core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/242—Dispositions, e.g. layouts relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H10W72/9445—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Semiconductor Memories (AREA)
CNB011253703A 2000-08-31 2001-08-31 一种电子装置与制作此装置的方法 Expired - Fee Related CN1235286C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP262511/2000 2000-08-31
JP2000262511A JP3822040B2 (ja) 2000-08-31 2000-08-31 電子装置及びその製造方法

Publications (2)

Publication Number Publication Date
CN1340857A CN1340857A (zh) 2002-03-20
CN1235286C true CN1235286C (zh) 2006-01-04

Family

ID=18750182

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB011253703A Expired - Fee Related CN1235286C (zh) 2000-08-31 2001-08-31 一种电子装置与制作此装置的方法

Country Status (6)

Country Link
US (2) US6492737B1 (https=)
JP (1) JP3822040B2 (https=)
KR (1) KR100776867B1 (https=)
CN (1) CN1235286C (https=)
SG (1) SG99937A1 (https=)
TW (1) TW563214B (https=)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1360722B1 (en) * 2001-02-09 2016-12-28 Taiwan Semiconductor Manufacturing Co., Ltd. Method of manufacturing a semiconductor device
US7115986B2 (en) 2001-05-02 2006-10-03 Micron Technology, Inc. Flexible ball grid array chip scale packages
FR2826153B1 (fr) † 2001-06-14 2004-05-28 A S K Procede de connexion d'une puce a une antenne d'un dispositif d'identification par radio-frequence du type carte a puce sans contact
SG122743A1 (en) 2001-08-21 2006-06-29 Micron Technology Inc Microelectronic devices and methods of manufacture
TWI245402B (en) 2002-01-07 2005-12-11 Megic Corp Rod soldering structure and manufacturing process thereof
SG104293A1 (en) 2002-01-09 2004-06-21 Micron Technology Inc Elimination of rdl using tape base flip chip on flex for die stacking
SG115456A1 (en) 2002-03-04 2005-10-28 Micron Technology Inc Semiconductor die packages with recessed interconnecting structures and methods for assembling the same
SG115455A1 (en) * 2002-03-04 2005-10-28 Micron Technology Inc Methods for assembly and packaging of flip chip configured dice with interposer
SG115459A1 (en) 2002-03-04 2005-10-28 Micron Technology Inc Flip chip packaging using recessed interposer terminals
US6975035B2 (en) * 2002-03-04 2005-12-13 Micron Technology, Inc. Method and apparatus for dielectric filling of flip chip on interposer assembly
SG121707A1 (en) 2002-03-04 2006-05-26 Micron Technology Inc Method and apparatus for flip-chip packaging providing testing capability
SG111935A1 (en) 2002-03-04 2005-06-29 Micron Technology Inc Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods
US20040036170A1 (en) 2002-08-20 2004-02-26 Lee Teck Kheng Double bumping of flexible substrate for first and second level interconnects
US6964881B2 (en) * 2002-08-27 2005-11-15 Micron Technology, Inc. Multi-chip wafer level system packages and methods of forming same
US6943434B2 (en) * 2002-10-03 2005-09-13 Fairchild Semiconductor Corporation Method for maintaining solder thickness in flipchip attach packaging processes
JP2004247530A (ja) * 2003-02-14 2004-09-02 Renesas Technology Corp 半導体装置及びその製造方法
JP3565835B1 (ja) * 2003-04-28 2004-09-15 松下電器産業株式会社 配線基板およびその製造方法ならびに半導体装置およびその製造方法
US6881074B1 (en) * 2003-09-29 2005-04-19 Cookson Electronics, Inc. Electrical circuit assembly with micro-socket
JP4427298B2 (ja) * 2003-10-28 2010-03-03 富士通株式会社 多段バンプの形成方法
JP4580633B2 (ja) * 2003-11-14 2010-11-17 スタンレー電気株式会社 半導体装置及びその製造方法
JP4492233B2 (ja) * 2003-11-27 2010-06-30 株式会社デンソー 半導体チップの実装構造および半導体チップの実装方法
US20050208749A1 (en) * 2004-03-17 2005-09-22 Beckman Michael W Methods for forming electrical connections and resulting devices
TWI243462B (en) * 2004-05-14 2005-11-11 Advanced Semiconductor Eng Semiconductor package including passive component
KR100642765B1 (ko) 2004-09-15 2006-11-10 삼성전자주식회사 하이브리드 범프를 포함하는 미세전자소자칩, 이의패키지, 이를 포함하는 액정디스플레이장치 및 이러한미세전자소자칩의 제조방법
FR2875995B1 (fr) * 2004-09-24 2014-10-24 Oberthur Card Syst Sa Procede de montage d'un composant electronique sur un support, de preference mou, et entite electronique ainsi obtenue, telle q'un passeport
KR100610144B1 (ko) * 2004-11-03 2006-08-09 삼성전자주식회사 플립 칩 조립 구조를 가지는 칩-온-보드 패키지의 제조 방법
US20060284313A1 (en) * 2005-06-15 2006-12-21 Yongqian Wang Low stress chip attachment with shape memory materials
JP2007080592A (ja) * 2005-09-12 2007-03-29 Fujitsu Component Ltd 半導体装置実装用ソケット
KR101363463B1 (ko) * 2005-12-08 2014-02-14 페어차일드 세미컨덕터 코포레이션 도전성 잉크를 가진 플립 칩 ｍｌｐ
US7638861B2 (en) * 2005-12-08 2009-12-29 Fairchild Semiconductor Corporation Flip chip MLP with conductive ink
JP4920330B2 (ja) * 2006-07-18 2012-04-18 ソニー株式会社 実装構造体の実装方法、発光ダイオードディスプレイの実装方法、発光ダイオードバックライトの実装方法および電子機器の実装方法
JP4916241B2 (ja) * 2006-07-28 2012-04-11 パナソニック株式会社 半導体装置及びその製造方法
CN101447443B (zh) * 2006-08-15 2010-06-02 南茂科技股份有限公司 高频集成电路封装构造的制造方法
CN100499096C (zh) * 2006-08-15 2009-06-10 南茂科技股份有限公司 高频集成电路封装构造及其制造方法
WO2008078478A1 (ja) * 2006-12-27 2008-07-03 Panasonic Corporation 導電性バンプとその形成方法および半導体装置とその製造方法
US20090014852A1 (en) * 2007-07-11 2009-01-15 Hsin-Hui Lee Flip-Chip Packaging with Stud Bumps
JP5133342B2 (ja) * 2007-07-17 2013-01-30 三菱電機株式会社 半導体装置及びその製造方法
JP2009094353A (ja) * 2007-10-10 2009-04-30 Furukawa Electric Co Ltd:The 半導体装置およびその製造方法
JP2009105209A (ja) * 2007-10-23 2009-05-14 Nec Corp 電子装置及びその製造方法
JP4535295B2 (ja) * 2008-03-03 2010-09-01 セイコーエプソン株式会社 半導体モジュール及びその製造方法
WO2010151600A1 (en) 2009-06-27 2010-12-29 Michael Tischler High efficiency leds and led lamps
US20120236230A1 (en) * 2009-11-20 2012-09-20 Sharp Kabushiki Kaisha Device substrate and method for manufacturing same
US8384121B2 (en) 2010-06-29 2013-02-26 Cooledge Lighting Inc. Electronic devices with yielding substrates
US8653539B2 (en) 2010-01-04 2014-02-18 Cooledge Lighting, Inc. Failure mitigation in arrays of light-emitting devices
TWI406376B (zh) * 2010-06-15 2013-08-21 力成科技股份有限公司 晶片封裝構造
JP2012028513A (ja) * 2010-07-22 2012-02-09 Elpida Memory Inc 半導体装置及びその製造方法
JP6024200B2 (ja) * 2012-05-18 2016-11-09 富士電機機器制御株式会社 表面実装基板への電子部品実装方法
US8877561B2 (en) 2012-06-07 2014-11-04 Cooledge Lighting Inc. Methods of fabricating wafer-level flip chip device packages
JP2014053597A (ja) * 2012-08-09 2014-03-20 Hitachi Chemical Co Ltd チップ型電子部品及び接続構造体
US20140055961A1 (en) * 2012-08-23 2014-02-27 Shayan Malek Printed Circuit Boards with Recesses
JP6067408B2 (ja) * 2013-02-20 2017-01-25 スタンレー電気株式会社 フリップチップ型半導体発光素子、半導体装置及びその製造方法
US9351436B2 (en) * 2013-03-08 2016-05-24 Cochlear Limited Stud bump bonding in implantable medical devices
RU2642170C2 (ru) * 2013-12-19 2018-01-24 Интел Корпорейшн Гибко оборачиваемый кристалл интегральной схемы
KR102199991B1 (ko) * 2014-05-28 2021-01-11 엘지이노텍 주식회사 발광 소자 및 이를 구비한 라이트 유닛
KR102538894B1 (ko) * 2016-04-11 2023-06-01 삼성전기주식회사 카메라 모듈용 기판 및 이를 구비하는 카메라 모듈
US10217712B2 (en) * 2016-12-16 2019-02-26 Advanced Semiconductor Engineering, Inc. Semiconductor package and semiconductor process for manufacturing the same
CN111602232B (zh) * 2018-01-19 2024-04-30 三菱电机株式会社 半导体装置、半导体装置的制造方法及电力转换装置
USD933618S1 (en) 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
JP7385483B2 (ja) * 2020-01-27 2023-11-22 キオクシア株式会社 半導体装置およびその製造方法
JP2021190454A (ja) * 2020-05-26 2021-12-13 ローム株式会社 半導体装置、および半導体装置の製造方法
CN111799241A (zh) * 2020-06-24 2020-10-20 霸州市云谷电子科技有限公司 邦定结构及其制作方法和显示面板

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU637874B2 (en) * 1990-01-23 1993-06-10 Sumitomo Electric Industries, Ltd. Substrate for packaging a semiconductor device
US5075965A (en) * 1990-11-05 1991-12-31 International Business Machines Low temperature controlled collapse chip attach process
US5768109A (en) * 1991-06-26 1998-06-16 Hughes Electronics Multi-layer circuit board and semiconductor flip chip connection
JP3019511B2 (ja) * 1991-08-21 2000-03-13 富士ゼロックス株式会社 転写材担持体への用紙ガイド装置
JPH0546031U (ja) * 1991-11-21 1993-06-18 日本無線株式会社 多段バンプ電気回路素子
JP3057130B2 (ja) * 1993-02-18 2000-06-26 三菱電機株式会社 樹脂封止型半導体パッケージおよびその製造方法
US5615827A (en) * 1994-05-31 1997-04-01 International Business Machines Corporation Flux composition and corresponding soldering method
US5742100A (en) * 1995-03-27 1998-04-21 Motorola, Inc. Structure having flip-chip connected substrates
US5598036A (en) * 1995-06-15 1997-01-28 Industrial Technology Research Institute Ball grid array having reduced mechanical stress
US5874780A (en) * 1995-07-27 1999-02-23 Nec Corporation Method of mounting a semiconductor device to a substrate and a mounted structure
EP0774888B1 (en) * 1995-11-16 2003-03-19 Matsushita Electric Industrial Co., Ltd Printed wiring board and assembly of the same
US5796165A (en) * 1996-03-19 1998-08-18 Matsushita Electronics Corporation High-frequency integrated circuit device having a multilayer structure
US6169329B1 (en) * 1996-04-02 2001-01-02 Micron Technology, Inc. Semiconductor devices having interconnections using standardized bonding locations and methods of designing
US5926694A (en) * 1996-07-11 1999-07-20 Pfu Limited Semiconductor device and a manufacturing method thereof
US6002172A (en) * 1997-03-12 1999-12-14 International Business Machines Corporation Substrate structure and method for improving attachment reliability of semiconductor chips and modules
JPH10270496A (ja) 1997-03-27 1998-10-09 Hitachi Ltd 電子装置、情報処理装置、半導体装置並びに半導体チップの実装方法
JP3063709B2 (ja) * 1997-11-05 2000-07-12 日本電気株式会社 電子部品の実装構造、搭載用基板および電子部品の搭載方法
DE19750073A1 (de) * 1997-11-12 1999-05-20 Bosch Gmbh Robert Schaltungsträgerplatte
JPH11204692A (ja) * 1998-01-19 1999-07-30 Oki Electric Ind Co Ltd 半導体装置
CN1134833C (zh) * 1998-09-30 2004-01-14 精工爱普生株式会社 半导体装置及其制造方法、电路基板和电子装置
US6214716B1 (en) * 1998-09-30 2001-04-10 Micron Technology, Inc. Semiconductor substrate-based BGA interconnection and methods of farication same
US6242932B1 (en) * 1999-02-19 2001-06-05 Micron Technology, Inc. Interposer for semiconductor components having contact balls
US6222280B1 (en) * 1999-03-22 2001-04-24 Micron Technology, Inc. Test interconnect for semiconductor components having bumped and planar contacts
US6492738B2 (en) * 1999-09-02 2002-12-10 Micron Technology, Inc. Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer
JP2001091544A (ja) * 1999-09-27 2001-04-06 Hitachi Ltd 半導体検査装置の製造方法
US6413102B2 (en) * 1999-12-22 2002-07-02 Micron Technology, Inc. Center bond flip chip semiconductor carrier and a method of making and using it
US6497943B1 (en) * 2000-02-14 2002-12-24 International Business Machines Corporation Surface metal balancing to reduce chip carrier flexing

Also Published As

Publication number Publication date
CN1340857A (zh) 2002-03-20
JP3822040B2 (ja) 2006-09-13
JP2002076057A (ja) 2002-03-15
US6492737B1 (en) 2002-12-10
SG99937A1 (en) 2003-11-27
TW563214B (en) 2003-11-21
KR100776867B1 (ko) 2007-11-16
KR20020018591A (ko) 2002-03-08
US20030102570A1 (en) 2003-06-05

Similar Documents

Publication Publication Date Title
CN1235286C (zh) 一种电子装置与制作此装置的方法
CN1199269C (zh) 半导体装置及其制造方法和制造装置
CN1161834C (zh) 半导体器件及其制造方法
CN1291467C (zh) 电子器件的制造方法
CN1265455C (zh) 半导体器件及其制造方法
CN1271712C (zh) 具有从密封树脂暴露出来的散热器的半导体器件
CN1154178C (zh) 半导体装置及其制造方法、电路基板和电子装置
CN1185698C (zh) 半导体装置及其制造方法、电路板以及电子设备
CN1516898A (zh) 半导体装置及其制造方法
CN1700466A (zh) 半导体封装体及其形成方法
CN1956189A (zh) 叠层半导体装置及叠层半导体装置的下层模块
CN1411045A (zh) 半导体装置
CN1790651A (zh) 芯片集成基板的制造方法
CN1531085A (zh) 半导体器件
CN1665027A (zh) 半导体器件
CN1956190A (zh) 层叠型半导体模块
CN1835229A (zh) 半导体器件和制造半导体器件的方法
CN1277737A (zh) 半导体装置及其制造方法、电路基板和电子装置
CN1622326A (zh) 偏移结合的多芯片半导体器件
CN1343007A (zh) 半导体装置及其制造方法,电路基板及电子设备
CN2636411Y (zh) 多芯片封装结构
CN1581482A (zh) 电路模块
CN1897241A (zh) 半导体器件及其制造方法
CN1700458A (zh) 具有第一和第二导电凸点的半导体封装及其制造方法
CN1519930A (zh) 半导体器件、电子设备及它们的制造方法和电子仪器

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: RENESAS ELECTRONICS CORPORATION

Free format text: FORMER OWNER: HITACHI, LTD.

Effective date: 20121108

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20121108

Address after: Kanagawa, Japan

Patentee after: Renesas Electronics Corporation

Address before: Tokyo, Japan

Patentee before: Hitachi Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20060104

Termination date: 20160831